Electronic Devices and Semiconductor Manufacturing Commons^™

System And Method For Object Recognition Based Estimation Of Planogram Compliance, Pranoy Hari, Shilpa Yadukumar Rao, Rajashree Ramakrishnan, Avishek Kumar Shaw, Archan Ray, Nishant Kumar, Dipti Prasad Mukherjee

Patents

Object recognition-based estimation of planogram compliance provides an expected arrangement of products on shelves. Identifying whether a product is placed in an appropriate location on a shelf is a challenging task due to various real-time parameters associated with image capturing. In the present disclosure, an input image associated with a shelf of a retail store is received and product images are cropped. Further, a set of reference images stored in a database are scaled corresponding to the input image. Further, one or more composite matching scores are calculated based on normalized cross-correlation and shape-based feature matching to obtain one or …

The Effects Of Radiation On Memristor-Based Electronic Spiking Neural Networks, Sumedha Gandharava Dahl

Boise State University Theses and Dissertations

In this dissertation, memristor-based spiking neural networks (SNNs) are used to analyze the effect of radiation on the spatio-temporal pattern recognition (STPR) capability of the networks. Two-terminal resistive memory devices (memristors) are used as synapses to manipulate conductivity paths in the network. Spike-timing-dependent plasticity (STDP) learning behavior results in pattern learning and is achieved using biphasic shaped pre- and post-synaptic spikes. A TiO₂ based non-linear drift memristor model designed in Verilog-A implements synaptic behavior and is modified to include experimentally observed effects of state-altering, ionizing, and off-state degradation radiation on the device. The impact of neuron “death” (disabled neuron …

Low-Power Cmos Cross-Coupled Differential-Drive Rectifier For Ambient Radio Frequency Energy Harvesting Systems, Sing Leung Gabriel Chong

Student Works (2020-2029)

Wireless Sensor Node (WSN) for the Internet of Things (IoT) and Internet of Everything (IoE) will require harvesting low-power ambient Radio Frequency (RF) energy to achieve self-power capabilities, alleviating the need of batteries. The research title of “Low-Power CMOS Cross-Coupled Differential-Drive Rectifier for Ambient Radio Frequency Energy Harvesting Systems” relates to the design of integrated circuit (IC) rectifiers for low-power ambient RF energy harvesting (RFEH) in complementary-metal-oxide-semiconductor (CMOS) technology. The adoption of CMOS for the rectifier designs is to achieve small physical form factor, low-cost, and system-on-chip (SoC) integration. The rectifier is the main circuit in an ambient RFEH system …

Hybrid Microwave Power Amplifiers For Broadband Communication, Sangaran Pragash

Student Works (2020-2029)

The software-defined radio is the future of radio technology. The development of a broadband power amplifier is the most challenging radio component to design in achieving software-defined radio goals due to the PA gain-bandwidth limitation. The distributed power amplifier (DPA) overcomes the limitation by combining output power from several transistors in an additive fashion. Matrix Amplifier (MA) consists of two or more DPA stacked together in a multiplicative manner. In this project, a high power and high gain DPA for a two-way radio system is demonstrated. The DPA exhibits 10W output power and 32dB gain across the frequency range of …

Performance Of Pld Grown Zno Thin Film As A Thin Film Transistor, Shahidul Asif

Graduate Theses/Dissertations

The performance of ZnO thin film (grown in different parameters) as a thin film transistor (TFT) is the focus of this study. ZnO is renowned for being n-type semiconductor naturally which was utilized in fabricating a thin film transistor here. This thesis is compared the performance of ZnO thin film transistor by growing the thin film using pulsed laser deposition (PLD) on two slightly different substrates at different temperatures in an optimal 0.1 milli bar oxygen pressure which was later analyzed using other material characterization methods. The substrates were both Si (100) but had different resistivity due to different amount …

Comparison Of Pressure-Assist Silver Sintering To Tin Silver Solder Alloy As Die Attach Material In High Power Semiconductor, Tolentino Erik Nino

Student Works (2020-2029)

The research is focused on pressure-assisted silver sintering material that is compared to tin silver solder alloy paste as used in power electronics. Material characterization, electrical tests, and reliability tests were conducted in the experiment. After drying process, it was observed that the Ag sintering paste height was reduced to approximately 40 percent. Die attach shear test showed that the average reading is about from 200 to 600 grams which are already enough to hold the dice before proceeding to the pressure sintering process. X-ray revealed that the void percent for SnAg paste sample is about 1.5 percent while pressure-assist …

3-Dimensional Carbon Micro-Electro Mechanical System (Mems) Electrode For Potential Dielectrophoretic Hepatic Cell Patterning Application, Wan Yahya Wan Nurlina

Student Works (2020-2029)

The maintenance of liver tissue unique pattern remains a great challenge in the generation of functional engineered liver tissue in vitro. This thesis presents a carbon dielectrophoresis (DEP) based cell patterning for generating hepatic cell constructs, mimicking biological hepatic lobule. A new design of electrode named interdigitated radiating-strips electrode (IRSE) was simulated and optimized using COMSOL Multiphysics 4.2a. The simulation result proved that IRSE is capable to provide uniform distribution of electric field for generating three-dimensional (3D) DEP force. The use of carbon electrodes has been an alternative to traditional metal electrodes and insulator structures for DEP applications since more …

Studies On Space Grade Nano-Iconic Radiation Sensors Using Additive Manufacturing Technology, Shah Mohammad Rahmot Ullah

Boise State University Theses and Dissertations

Though Additive manufacturing technology has been developing for 30 years, in recent years, it gets researchers’ and industries’ attention for new expansion in fabricated electronics devices, especially on a flexible substrate. This technology allows fabricating complex design of electronics devices with multi-functionality. Its application has been significantly expanded to different fields such as sensors and other device prototypes for nuclear facilities, aerospace manufacturing, bio-medical, solar energy, etc. due to its low-cost efficiency and sustainable manufacturing. It has a huge advantage over traditional methods such as lower materials waste during production, avoiding complex etching system and harmful chemicals, simplified assembly system …

Device-Level Predictive Modeling Of Extreme Electromagnetic Interference, Nishchay H. Sule

Electrical and Computer Engineering ETDs

Radio Frequency (RF) interference is a prominent issue for modern electronic devices. As device size and supply power shrink to meet the on-going demand for compact and complex Integrated Circuits (ICs), their susceptibility to external noise coupling to the input or power supply increases significantly. One such type of noise that acts upon a system to be considered is Extreme Electromagnetic Interference (EEMI). Previous works done to understand and evaluate the impact of EEMI onto a system or sub-system have been conducted on a statistical or empirical analysis level, which has led to complex and convoluted analysis, that requires significant …

Converter- And Module-Level Packaging For High Power Density And High Efficiency Power Conversion, Amol Rajendrakumar Deshpande

Graduate Theses and Dissertations

Advancements in the converter- and module-level packaging will be the key for the development of the emerging high-power, high power-density, high-eciency power conversion applications, such as traction, shipboards, more-electric-aircraft, and locomotive. Wide bandgap (WBG) devices such as silicon carbide (SiC) MOSFET attract much attention in these applications for their fast switching speeds, resulting in low loss and a consequent possibility for high switching frequency to increase the power density. However, for high-current, high power implementations, WBG devices are still available in small die sizes. Multiple SiC devices need to be connected in parallel to replace a large IGBT die. It …

Synthesis And Application Of Ceramic Paste For High-Temperature Electronic Packaging, Ardalan Nasiri

Graduate Theses and Dissertations

This dissertation research focused on the synthesis and application of ceramic paste for high-temperature applications. An alumina paste material comprising aluminum dihydric phosphate and alumina powder was developed for high-temperature electronic packaging. Nano aluminum nitride and nano-silica powders were embedded to promote the paste curing process, limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500°C showed no defect or additional cracks. Thermal …

Design And Optimization Of Multichip Gan Module Enabling Improved Switching Performance, Asif Imran Emon

Graduate Theses and Dissertations

Wide bandgap semiconductors (SiC & GaN) due to their enhanced performance and superior material properties compared to traditional silicon power devices have become the ultimate choice for future high-performance power electronics energy conversion. GaN high electron mobility transistor (HEMT) offers very fast switching capability enabling the designer to push switching frequency to the MHz range. Traditional device packaging becomes a limiting factor in fully harnessing the benefits offered by these advanced power devices, and thus, improved and advanced packaging structures are a must to bridge the gap between GaN devices and their applications. A co-design, co-optimization method has been followed …

Performance Analysis Of Renewable Energy Resources In Rural Areas: A Case Study Of Solar Energy, Jackson Justo

Tanzania Journal of Engineering and Technology (TJET)

This paper presents an overview of the recent development trends of solar photovoltaic (PV) systems and the performance in the Tanzanian context. The two types of solar power generation that are considered in this paper are: i) solar PV systems and ii) concentrated solar power (CSP). The two are compared in terms of cost of energy and energy storage mechanism. Moreover, the effect of ambient temperature on the solar PV module is analyzed. In addition, a detailed analysis on using solar axis tracking to increase the power generation is also presented. The extent to which the cell surface temperature and …

High Speed, High Current Monitoring System, Nicolette Lila Ray

Electrical Engineering

Electronics testing requires lengthy data collection and analysis. Streamlining at least part of this process allows resource reallocation, and faster data processing. Verifying a signal’s efficiency is key specification for a component’s datasheet. This project focuses on streamlining data collection when measuring a device’s output current. It combines amplifier design and digital interfacing to perform monitor a device’s output current. A computer-enable interface displays a graphical output current representation. It ensures accurate, high speed, high current measurements while removing a person’s need to manually plot data after testing. A new testing method provides room for company and product growth with …

Ohmic Contact Metallization For Silicon Carbide In Future Transportation And Aviation Systems, Tanner W. Rice

Electrical Engineering Undergraduate Honors Theses

This paper analyzes metallization stacks in both n-type and p-type used in Silicon Carbide to create Ohmic Contacts. Silicon Carbide has shown its significance in usage as a semiconductor in high temperatures, and other extreme environments compared to its silicon counterpart. Additionally, silicon carbide exhibits many other favorable attributes such as strong radiation hardness, high power capability, and high-temperature tolerance. These attributes translate into great components for use in aviation and other future transportations by increasing reliability in a sector that already requires high reliability. Applications of this material could prove useful in fields such as aviation, among others. This …

Simultaneous Ohmic Contacts To N And P-Type Silicon Carbide For Future Electric Vehicles, Hayden Hunter

Electrical Engineering Undergraduate Honors Theses

The paper explores possible metallization schemes to form simultaneous ohmic contacts to n-type and p-type silicon carbide contacts. Silicon carbide has shown promise in revolutionizing the power electronics market due to its increased switching speed, compact design, and higher temperature tolerance when compared to Silicon, the market standard. With the continuing development of silicon carbide technology, higher efficiency in future electric vehicles can be achieved by employing this new technology. This paper discusses theoretical contact formation between metals and semiconductors along with a proposed experiment to create a Ni/Al metallization scheme on both n and p-type contacts simultaneously on a …

Reducing Emi In Sic Direct Torque Controlled Motor Drive, Michael Sykes

Electrical Engineering Undergraduate Honors Theses

This paper covers the comparison between Silicon (Si) vs Silicon Carbide (SiC) for Motor Drive systems and a possible control algorithm to limit the increased Electromagnetic Interference (EMI) caused by using SiC transistors for the inverter. Motor Drive systems need constant improvements if the world is going to move on from machines that emit CO₂ and other harmful gases into the Earth’s atmosphere. One reason these electric machines are not commonplace today is because of their efficiency and other problems they may cause. Silicon transistors are the most commonplace transistor around the world today, but advances over the past …

Microrobots For Wafer Scale Microfactory: Design Fabrication Integration And Control., Ruoshi Zhang

Electronic Theses and Dissertations

Future assembly technologies will involve higher automation levels, in order to satisfy increased micro scale or nano scale precision requirements. Traditionally, assembly using a top-down robotic approach has been well-studied and applied to micro-electronics and MEMS industries, but less so in nanotechnology. With the bloom of nanotechnology ever since the 1990s, newly designed products with new materials, coatings and nanoparticles are gradually entering everyone’s life, while the industry has grown into a billion-dollar volume worldwide. Traditionally, nanotechnology products are assembled using bottom-up methods, such as self-assembly, rather than with top-down robotic assembly. This is due to considerations of volume handling …

Design Of Submicron Structured Guided-Mode-Resonance Near-Infrared Polarizer, Marzia Zaman

Graduate Theses and Dissertations

The objective of this research is to design a larger submicron linear polarizer in the near-infrared wavelength range with a wide bandwidth which can be fabricated using the conventional thin-film microfabrication technology to reduce cost. For this purpose, a gold (Au) wire-grid transmission-type transverse-magnetic (TM) polarizer and a silicon (Si) wire-grid reflection-type TM polarizer, were designed using the guided-mode-resonance filter. The Au wire-grid TM polarizer of 700nm grating width and 1200nm grating period has 95% transmittance at 2400nm, more than 1000nm resonance peak bandwidth, and an extinction ratio (ER) of around 300 with a moderated level of sidebands. The 700nm …

Low-Cost Test And Characterization Platform For Memristors, Lyle Jones

Boise State University Theses and Dissertations

The electrical Testing and Characterization of the devices built under research conditions on silicon wafers, diced wafers, or package parts have hampered research since the beginning of integrated circuits. The challenges of performing electrical characterization on devices are to acquire useful and accurate data, the ease of use of the test platform, the portability of the test equipment, the ability to automate quickly, to allow modifications to the platform, the ability to change the configuration of the Device Under Test (DUT) or the Memristor Based Design (MBD), and to do this within budget. The devices that this research is focused …

Resonant Metagratings For Spectral And Angular Control Of Light For Colored Rooftop Photovoltaics, Floris Uleman, Andrea Cordaro, Andrea Alù, Albert Polman

Advanced Science Research Center

We designed semitransparent metagrating supercells that enable control over the spectrum and directivity of incident light for applications in photovoltaics with tailored angular appearance. The building block of the supercells is a 100–120 nm wide and 175 nm tall silicon nanowire that shows a strong Mie resonance around λ = 650 nm. By arranging the resonant Mie scatterers into metagratings of increasing pitch (675–1300 nm), we created a Lambertian-like scattering distribution over an angular range of choice. The millimeter-sized metasurfaces were fabricated using electron beam lithography and reactive ion etching. The fabricated metasurface nearly fully suppresses specular reflection on resonance …

Characterization Of Reactive Ion Etch Chemistries Using Direct Write Lithography, Dylan T. Martin-Abood

Theses and Dissertations

The DoD requires a variety of COTS and number of custom microelectronics to provide important functionality to critical military systems. Photolithography and DRIE are two techniques commonly used in the development of deep anisotropic features for the fabrication and modification of microelectronics and MEMS. However, standard photolithography techniques are ineffective for unique substrate geometries and DRIE processes require a chemical passivation step only applicable to Si substrates. This work confirmed the capability of RIE using DWL to perform deep, highly selective, anisotropic etching on elevated, non-circular substrates.

Development Of Integrated Zinc Oxide Nanorods Coated Glass Substrate Sensing Device, Mohd Yusof Haziezol Helmi

Student Works (2020-2029)

A simple and practical cost-effective integrated zinc oxide (ZnO) nanorods coated glass substrate sensing device for humidity and formaldehyde vapor sensing applications is reported. The developed sensor device is composed of a commercial light-emitting diode (LED) and photodiode that correspondingly served as light source and detector which precisely positioned on a 3D printed sensor platform. A receiver circuit and Arduino platform were employed for signal amplification and processing. A uniform ZnO nanorods coating were grown on the surface of glass substrate via hydrothermal method by controlling the growth durations and coating length. A standard reference for the optimum working condition …

Noble-Transition Alloy Absorbers For Near-Infrared Hot-Carrier Optoelectronics, Sara Karoline Figueiredo Stofela

LSU Doctoral Dissertations

Optoelectronics is the field of technology concerned with the study and application of electronic devices that source, detect and control light. Here we focus on the optical communications field which relies on optical fiber systems to carry signals to their destinations operating in the near-infrared range. To improve the performance of current optical fiber systems, one of the paths is to develop better near-infrared photodetectors.

The current group of materials used for near-infrared photodetection relies in the III-V semiconductor family. Although their spectral photosensitivity correlates well with the near-infrared, response time performance and electronic circuit integration remain limited for this …

Anti-Resonance, Inhibited Coupling And Mode Transitionin Depressed Core Fibers, Xiaokang Lian, Gerald Farrell, Qiang Wu, Wei Han, Changyu Shen, Youqiao Ma, Yuliya Semenova

Articles

The depressed core fiber (DCF), consisting of a low-index solid core, a high-index cladding and air surrounding, is in effect a bridge between the conventional step-index fiber and the tube-type hollow-core fiber from the point of view of the index profile. In this paper the dispersion diagram of a DCF is obtained by solving the full-vector eigenvalue equations and analyzed using the theory of anti-resonant and the inhibited coupling mechanisms. While light propagation in tube-type hollow-core fibers is commonly described by the symmetric planar waveguide model, here we propose an asymmetric planar waveguide for the DCFs in an anti-resonant reflecting …

Fabrication, Characterization And Applications Of Highly Conductive Wet-Spun Pedot:Pss Fibers, Ruben Sarabia Riquelme

Theses and Dissertations--Chemical and Materials Engineering

Smart electronic textiles cross conventional uses to include functionalities such as light emission, health monitoring, climate control, sensing, storage and conversion of energy, etc. New fibers and yarns that are electrically conductive and mechanically robust are needed as fundamental building blocks for these next generation textiles.

Conjugated polymers are promising candidates in the field of electronic textiles because they are made of earth-abundant, inexpensive elements, have good mechanical properties and flexibility, and can be processed using low-cost large-scale solution processing methods. Currently, the main method to fabricate electrically conductive fibers or yarns from conjugated polymers is the deposition of the …

Arsenic Exposure And Methylation Efficiency In Relation To Oxidative Stress In Semiconductor Workers, Chih-Hong Pan, Ching-Yu Lin, Ching-Huang Lai, Hueiwang Anna Jeng

Community & Environmental Health Faculty Publications

This study examined associations between oxidative stress and arsenic (As) exposure and methylation efficiency in semiconductor workers. An As-exposed group (n = 427) and a control group (n = 91) were included. The As-exposure group (n = 427) included 149 maintenance staff members and 278 production staff members representing high As exposure and low As exposure, respectively. The control group included 91 administrative staff members with no or minimal As exposure. An occupational exposure assessment was conducted to assess personal As exposure by measuring As concentrations in urine, hair, and fingernails of the subjects. Urinary As(III), As(V), monomethylarsonic (MMA), and …

Electric Field Control Of Fixed Magnetic Skyrmions For Energy Efficient Nanomagnetic Memory, Dhritiman Bhattacharya

Theses and Dissertations

To meet the ever-growing demand of faster and smaller computers, increasing number of transistors are needed in the same chip area. Unfortunately, Silicon based transistors have almost reached their miniaturization limits mainly due to excessive heat generation. Nanomagnetic devices are one of the most promising alternatives of CMOS. In nanomagnetic devices, electron spin, instead of charge, is the information carrier. Hence, these devices are non-volatile: information can be stored in these devices without needing any external power which could enable computing architectures beyond traditional von-Neumann computing. Additionally, these devices are also expected to be more energy efficient than CMOS devices …

Investigation Of Host Nanotube Parameters For Enhancing The Performance Of Nanostructured Cds-Cdte Solar Cells, Deepak Kumar

Theses and Dissertations--Electrical and Computer Engineering

Numerical simulations are performed to investigate the effects of host nanotube parameters (pore diameter and pitch for different CdS coverages) and CdTe doping density on device performance in nanowire CdS/ CdTe solar cells using SCAPS-1D. This research finds the optimum values for these parameters in order to achieve the highest efficiency. Experimentally the effect of anodization voltage and fluoride ion concentration on the pore diameter and the pitch are studied for the Titania nanotubes host. It is observed that in the range of 0.3 mL to 2 mL of ammonium fluoride content, pore diameter and the pitch of the Titania …

Rapid Prototyping Of Nanostructures With Electron Beam Induced Processing, Samaneh Esfandiarpour

Theses and Dissertations--Electrical and Computer Engineering

Focused electron beam induced processing (FEBIP) is a nano-scale fabrication technique that allows the direct deposition of functional materials. However, it suffers from significant drawbacks, such as high cost, low speed, unavailable precursors for many materials and low purity of deposits. Liquid-phase focused electron beam induced processes (LP-FEBIP) are being investigated due to the potential benefits over the gas phase technique. In this method, deposition or etching occurs at the interface between a substrate and a bulk liquid. In this work, electron beam induced deposition of copper nanostructures from aqueous solutions of copper sulfate is demonstrated. The addition of sulfuric …