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Electronic Devices and Semiconductor Manufacturing Commons™
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Articles 1 - 11 of 11
Full-Text Articles in Electronic Devices and Semiconductor Manufacturing
Physical Effects On The Worst-Case Delay Analysis And Signal Integrity Of Buses And Spirals, Mahmoud Mahany
Physical Effects On The Worst-Case Delay Analysis And Signal Integrity Of Buses And Spirals, Mahmoud Mahany
Theses and Dissertations
Physical effects have a significant impact on the IC design which will be investigated in this thesis. Moving toward advanced technology nodes, magnetic effects become more dominant than capacitive effects. As the dimensions of the devices go down and the interconnect manipulates the circuit behavior more and more. Cross talking and voltage drops are affecting the design heavily, however - going to the full electromagnetic point of view - current return path (CRP) adds significant parasitics to the performance of the chip. Neglecting the CRP gives wrong intuition and simulation of the designs, especially that the environment and surroundings can …
Influence Of Al2o3 Passivation Layer Thickness On The Thermal Stability And Quality Of Mocvd-Grown Gan On Si, S M Atiqur Rahman, Manika Tun Nafisa, Zhe Chuan Feng, Benjamin Klein, Ian T. Ferguson
Influence Of Al2o3 Passivation Layer Thickness On The Thermal Stability And Quality Of Mocvd-Grown Gan On Si, S M Atiqur Rahman, Manika Tun Nafisa, Zhe Chuan Feng, Benjamin Klein, Ian T. Ferguson
Symposium of Student Scholars
This research delves into the significant impact of varying thicknesses of the Al2O3 passivation layer on the thermal stability and crystalline quality of GaN on Si structures, an essential aspect for the next generation of high-temperature electronic and optoelectronic devices. By adopting metal-organic chemical vapor deposition (MOCVD) for the growth process, we analyzed structures with different Al2O3 passivation layer thicknesses: none, 2 nm, 10 nm, and 20 nm, each built upon the GaN layer. Through Raman spectroscopy, we meticulously assessed the changes in the E2 (High) phonon mode's peak position and full width …
Ionic Conductivity, Li+ Transference Number, And Diffusion Coefficient Of A Solid-State Electrolyte Composite, Lizbeth Zurita
Ionic Conductivity, Li+ Transference Number, And Diffusion Coefficient Of A Solid-State Electrolyte Composite, Lizbeth Zurita
Reviews, Analyses, and Instructional Studies in Electrochemistry (RAISE)
The design of solid-state electrolyte (SSE) composites involves the fundamental study of transport properties, such as ionic conductivity. This transport property is influenced by the transport mechanisms of the charge species inside the composite, such as diffusion and migration. In this work, we perform the measurement of these three parameters through defined techniques. The resulting parameters were: ionic conductivity, the diffusion coefficient, and the Li+ transference number.
Cmos-Memristive Neuromorphic Architecture For Nonlinear Signal Processing, Manu Rathore
Cmos-Memristive Neuromorphic Architecture For Nonlinear Signal Processing, Manu Rathore
Doctoral Dissertations
Neuromorphic computing mimics the functional components and structure of the human brain to achieve highly efficient computing with minimal resources and power consumption. Creating neuromorphic systems in Complementary Metal-Oxide-Semiconductor (CMOS) technology offers an alternative computing paradigm to Von neumann computing. However, implementing these systems on an CMOS Integrated Circuit (IC) poses major challenges. These challenges include implementing synaptic weight multiplication and weight tuning operation that conserves energy and occupies minimal area. Additionally, designing a network-on-chip architecture that is reconfigurable and offers a full-connectivity design space is crucial. Furthermore, implementing a complete architecture for nonlinear data processing and, specifically, online learning …
Post-Layout Evaluation Of Adiabatic Logic For Energy Efficiency And Cpa Resistance, Jun-Cheng Chin
Post-Layout Evaluation Of Adiabatic Logic For Energy Efficiency And Cpa Resistance, Jun-Cheng Chin
Masters Theses
The Internet of Things (IoT) has become commonplace in society, but it has been demonstrated that many IoT systems are vulnerable to significant security exploits. This necessitates the need for a closer examination of IoT security. IoT design prerequisites are low power consumption and an emphasis on smaller die areas for increased production yield. Security on the software level typically provides adequate protection but there are hardware-level exploits that are difficult or impossible to counteract. Booting attacks, eavesdropping and interference, and Side-Channel Attacks (SCA) are exploits deployed against IoT devices on the hardware level. To combat these vulnerabilities, several lightweight …
Effect Of Fabrication Parameters On The Ferroelectricity Of Hafnium Zirconium Oxide Films: A Statistical Study, Guillermo A. Salcedo, Ahmad E. Islam, Elizabeth Reichley, Michael Dietz, Christine M. Schubert Kabban, Kevin D. Leedy, Tyson C. Back, Weison Wang, Andrew Green, Timothy S. Wolfe, James M. Sattler
Effect Of Fabrication Parameters On The Ferroelectricity Of Hafnium Zirconium Oxide Films: A Statistical Study, Guillermo A. Salcedo, Ahmad E. Islam, Elizabeth Reichley, Michael Dietz, Christine M. Schubert Kabban, Kevin D. Leedy, Tyson C. Back, Weison Wang, Andrew Green, Timothy S. Wolfe, James M. Sattler
Faculty Publications
Ferroelectricity in hafnium zirconium oxide (Hf1−xZrxO2) and the factors that impact it have been a popular research topic since its discovery in 2011. Although the general trends are known, the interactions between fabrication parameters and their effect on the ferroelectricity of Hf1−xZrxO2 require further investigation. In this paper, we present a statistical study and a model that relates Zr concentration (x), film thickness (tf), and annealing temperature (Ta) with the remanent polarization (Pr) in tungsten (W)-capped Hf1−xZrxO2. …
Impact Of Chips And Science Act Of 2022 On China's Related Industries And Policy Suggestions, Jiuling Shi, Yongmiao Hong, Ying Liu
Impact Of Chips And Science Act Of 2022 On China's Related Industries And Policy Suggestions, Jiuling Shi, Yongmiao Hong, Ying Liu
Bulletin of Chinese Academy of Sciences (Chinese Version)
As the cornerstone of modern information technology, chips are the strategic commanding heights of competition game and industrial development of countries all over the world. In recent years, the United States has taken advantage of its technological advances to successively introduce chip laws against China, which seriously violates the laws of market economy and has a significant impact on the global semiconductor industry chain. This study first sorts out the development pattern of the global semiconductor industry, and then introduces the background, content and purpose of CHIPS and Science Act of 2022. Then, it analyzes the impact of the …
Photoluminescence Of Beryllium-Related Defects In Gallium Nitride, Mykhailo Vorobiov, Mykhailo Vorobiov
Photoluminescence Of Beryllium-Related Defects In Gallium Nitride, Mykhailo Vorobiov, Mykhailo Vorobiov
Theses and Dissertations
This study explores the potential of beryllium (Be) as an alternative dopant to magnesium (Mg) for achieving higher hole concentrations in gallium nitride (GaN). Despite Mg prominence as an acceptor in optoelectronic and high-power devices, its deep acceptor level at 0.22 eV above the valence band limits its effectiveness. By examining Be, this research aims to pave the way to overcoming these limitations and extend the findings to aluminum nitride and aluminum gallium nitride (AlGaN) alloy. Key contributions of this work include. i)Identification of three Be-related luminescence bands in GaN through photoluminescence spectroscopy, improving the understanding needed for further material …
Analyzing Viability Of Blue Indium Gallium Nitride Leds For Use In Space Missions Using A Low Earth Orbit Cubesa, Bertrand Edward Wieliczko
Analyzing Viability Of Blue Indium Gallium Nitride Leds For Use In Space Missions Using A Low Earth Orbit Cubesa, Bertrand Edward Wieliczko
Graduate Theses, Dissertations, and Problem Reports
The payload capacity of spacecraft is constrained by the weight of the craft itself, including fuel and electronic systems. The protective measures used to shield onboard electronics from the harsh space environment, characterized by high-energy particles and significant temperature fluctuations, can further diminish the available payload capacity. This thesis explores the potential of naturally radiation-hard alternatives to commonly used electronic materials, such as Silicon, to reduce the need for shielding and other protective measures, thereby decreasing the weight and cost of space missions.
III-V semiconductor materials, such as Gallium Nitride (GaN), are known for their inherent resilience to temperature swings …
Nano-Patterned Si Structures For Optical Filters And Electro-Mechanical Relays: Fabrication, Characterization, Prospects, And Limitations, Md Ataul Mamun
Nano-Patterned Si Structures For Optical Filters And Electro-Mechanical Relays: Fabrication, Characterization, Prospects, And Limitations, Md Ataul Mamun
Theses and Dissertations
Nanofabrication technology, especially nanopatterning, is a rapidly advancing field that has already resulted in creating novel devices and holds promise for producing even more with unmatched performance. These techniques also allow us to gain insight into physical phenomena at the micro- and nanoscale. The ultimate performance of nanofabricated devices and their compatibility with existing Si-based CMOS technology hinge upon the careful selection of materials and precise design, coordinated with meticulous pattern transfer. In this work, we applied nanopatterning techniques on silicon to create optical filters for the shortwave infrared (SWIR) region and nanoelectromechanical system (NEMS) relay-based logic gates. Additionally, these …
Reinventing Integrated Photonic Devices And Circuits For High Performance Communication And Computing Applications, Venkata Sai Praneeth Karempudi
Reinventing Integrated Photonic Devices And Circuits For High Performance Communication And Computing Applications, Venkata Sai Praneeth Karempudi
Theses and Dissertations--Electrical and Computer Engineering
The long-standing technological pillars for computing systems evolution, namely Moore's law and Von Neumann architecture, are breaking down under the pressure of meeting the capacity and energy efficiency demands of computing and communication architectures that are designed to process modern data-centric applications related to Artificial Intelligence (AI), Big Data, and Internet-of-Things (IoT). In response, both industry and academia have turned to 'more-than-Moore' technologies for realizing hardware architectures for communication and computing. Fortunately, Silicon Photonics (SiPh) has emerged as one highly promising ‘more-than-Moore’ technology. Recent progress has enabled SiPh-based interconnects to outperform traditional electrical interconnects, offering advantages like high bandwidth density, …