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Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji 2020 University of Arkansas, Fayetteville

Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji

Graduate Theses and Dissertations

Semiconductor packaging and development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical related strains occur because of the coefficient of thermal expansion mismatch from different conjoined materials being assembled to manufacture a device. To curb the effect of thermal expansion mismatch between conjoined parts, studies have been done in integrating compliant structures between dies, solder balls, and substrates. Initial studies have enabled the design and manufacturing of these structures using a photolithography approach which involves a high number of fabrication steps depending on the complexity of the structures …


An Exploratory Study Of Pulse Width And Delta Sigma Modulators, Logan B. Penrod 2020 Cal Poly SLO

An Exploratory Study Of Pulse Width And Delta Sigma Modulators, Logan B. Penrod

Master's Theses

This paper explores the noise shaping and noise producing qualities of Delta-Sigma Modulators (DSM) and Pulse-Width Modulators (PWM). DSM has long been dominant in the Delta Sigma Analog-to-Digital Converter (DSADC) as a noise-shaped quantizer and time discretizer, while PWM, with a similar self oscillating structure, has seen use in Class D Power Amplifiers, performing a similar function. It has been shown that the PWM in Class D Amplifiers outperforms the DSM [1], but could this advantage be used in DSADC use-cases? LTSpice simulation and printed circuit board implementation and test are used to present data on four variations of these …


Fourier Transform Infrared Spectroscopy For The Measurement Of Gesn/(Si)Gesn, Solomon Opeyemi Ojo 2020 University of Arkansas, Fayetteville

Fourier Transform Infrared Spectroscopy For The Measurement Of Gesn/(Si)Gesn, Solomon Opeyemi Ojo

Graduate Theses and Dissertations

Photoluminescence (PL) and Electroluminescence (EL) characterization techniques are important tools for studying the optical and electrical properties of (Si)GeSn. Light emission from these PL and EL measurements provides relevant information on material quality, bandgap energy, current density, and device efficiency. Prior to this work, the in-house PL set-up of this lab which involves the use of a commercially-obtained dispersive spectrometer was used for characterizing both GeSn thin film and fabricated devices, but these measurements were limited by issues bordering on low spectral resolution, spectral artifacts, and poor signal-to-noise ratio (SNR) thereby resulting in the possible loss of vital information and …


Design Of A 350 Kw Silicon Carbide Based 3-Phase Inverter With Ultra-Low Parasitic Inductance, Matthew Feurtado 2020 University of Arkansas, Fayetteville

Design Of A 350 Kw Silicon Carbide Based 3-Phase Inverter With Ultra-Low Parasitic Inductance, Matthew Feurtado

Graduate Theses and Dissertations

The objective of this thesis is to present a design for a low parasitic inductance, high power density 3-phase inverter using silicon-carbide power modules for traction application in the electric vehicles with a power rating of 350 kW. With the market share of electric vehicles continuing to grow, there is a great opportunity for wide bandgap semiconductors such as silicon carbide (SiC) to improve the efficiency and size of the motor drives in these applications. In order to accomplish this goal, careful design and selection of each component in the system for optimum performance from an electrical, mechanical, and thermal …


Simulation Of An Sp8t 18 Ghz Rf Switch Using Smt Pin Diodes, Andre De Souza Vigano 2020 California Polytechnic State University, San Luis Obispo

Simulation Of An Sp8t 18 Ghz Rf Switch Using Smt Pin Diodes, Andre De Souza Vigano

Master's Theses

Radio frequency (RF) and microwave switches are widely used in several different applications including radar, measurement systems, telecommunications, and other areas. An RF switch can control a radar’s transmit vs. receive mode, select the operating band, or direct an RF signal to different paths. In this study, a single pole eight throw (SP8T) switch using only Surface Mount (SMT) components is designed and simulated in Keysight’s Advanced Design System (ADS). Single pole eight throw is defined as one input and eight possible outputs. A star network configuration with series-shunt PIN diode switches is used to create the 8-way RF switch. …


High-Temperature Optoelectronic Device Characterization And Integration Towards Optical Isolation For High-Density Power Modules, Syam Madhusoodhanan 2020 University of Arkansas, Fayetteville

High-Temperature Optoelectronic Device Characterization And Integration Towards Optical Isolation For High-Density Power Modules, Syam Madhusoodhanan

Graduate Theses and Dissertations

Power modules based on wide bandgap (WBG) materials enhance reliability and considerably reduce cooling requirements that lead to a significant reduction in total system cost and weight. Although these innovative properties lead power modules to higher power density, some concerns still need to be addressed to take full advantage of WBG-based modules. For example, the use of bulky transformers as a galvanic isolation system to float the high voltage gate driver limits further size reduction of the high-temperature power modules. Bulky transformers can be replaced by integrating high-temperature optocouplers to scale down power modules further and achieve disrupting performance in …


Growth And Characterization Of Semiconductor Materials And Devices For Extreme Environments Applications, Abbas Sabbar 2020 University of Arkansas, Fayetteville

Growth And Characterization Of Semiconductor Materials And Devices For Extreme Environments Applications, Abbas Sabbar

Graduate Theses and Dissertations

Numerous industries require electronics to operate reliably in harsh environments, such as extreme high temperatures (HTs), low temperature (LT), radiation rich environments, multi-extreme, etc. This dissertation is focused on two harsh environments: HT and multi-extreme.

The first study is on HT optoelectronics for future high-density power module applications. In the power modules design, galvanic isolation is required to pass through the gate control signal, reject the transient noise, and break the ground loops. The optocoupler, which consists of a lighting emitting diode (LED) and photodetector (PD), is commonly used as the solution of galvanic isolation at room temperatures. There is …


Novel Memristor Based True Random Number Generator, Scott Stoller 2020 Boise State University

Novel Memristor Based True Random Number Generator, Scott Stoller

Boise State University Theses and Dissertations

Random numbers are an important, but often overlooked part of the modern computing environment. They are used everywhere around us for a variety of purposes, from simple decision making in video games such as a coin toss, to securing financial transactions and encrypting confidential communications. They are even useful for gambling and the lottery.

Random numbers are generated in many ways. Pseudo random number generators (PRNGs) generate numbers based on a formula. True random number generators (TRNGs) capture entropy from the environment to generate randomness. As our society and our devices become more connected in the digital world, it is …


A Note From The Editor, Daphne Fauber 2020 Purdue University

A Note From The Editor, Daphne Fauber

Ideas: Exhibit Catalog for the Honors College Visiting Scholars Series

This piece is a letter from Daphne Fauber, the editor of this issue of Ideas. In the letter, the editor introduces the work of Dr. Paschalis Gkoupidenis as well as the moment in time in which his Visiting Scholars talk occurs.


Engineering Electromagnetic Systems For Next-Generation Brain-Machine Interface, Brayan Ricardo Navarrete 2020 Florida International University

Engineering Electromagnetic Systems For Next-Generation Brain-Machine Interface, Brayan Ricardo Navarrete

FIU Electronic Theses and Dissertations

MagnetoElectric Nanoparticles (MENPs) are known to be a powerful tool for a broad range of applications spanning from medicine to energy-efficient electronics. MENPs allow to couple intrinsic electric fields in the nervous system with externally controlled magnetic fields. This thesis exploited MENPs to achieve contactless brain-machine interface (BMIs). Special electromagnetic devices were engineered for controlling the MENPs’ magnetoelectric effect to enable stimulation and recording. The most important engineering breakthroughs of the study are summarized below.

(I) Metastable Physics to Localize Nanoparticles: One of the main challenges is to localize the nanoparticles at any selected site(s) in the brain. The fundamental …


A New Method Of Statcom Controlling For Harmonic Mitigation And Power Factor Correction, Doha Jdeed 2020 Tartus University, Tartus, Syria

A New Method Of Statcom Controlling For Harmonic Mitigation And Power Factor Correction, Doha Jdeed

Journal of the Arab American University مجلة الجامعة العربية الامريكية للبحوث

This paper presents a control algorithm of 3ph STATic synchronous COMpensator (STATCOM). The algorithm depends on the accurate reference currents extraction from only the nonlinear load current spec-trum in frequency domain using Fast Fourier Transfer (FFT). Then the determined harmonics and reactive components of load current are added together to form the compensating reference signals, the PI controllers then generate signals which control the Pulse Width Modulation (PWM) method. The simulation of the study is carried out under MATLAB/Simulink environment to show the usefulness of this control algorithm with nonlin-ear dynamic loads. It determines exactly the phase shift between the …


Thermal Transport Modeling Of Semiconductor Materials From First Principles, Aliya Qureshi 2020 University of Massachusetts Amherst

Thermal Transport Modeling Of Semiconductor Materials From First Principles, Aliya Qureshi

Masters Theses

Over the past few years, the size of semiconductor devices has been shrinking whereas the density of transistors has exponentially increased. Thus, thermal management has become a serious concern as device performance and reliability is greatly affected by heat. An understanding of thermal transport properties at device level along with predictive modelling can lead us to design of new systems and materials tailored according to the thermal conductivity. In our work we first review different models used to calculate thermal conductivity and examine their accuracy using the experimentally measured thermal conductivity for Si. Our results suggest that empirically calculated rates …


System And Method For Object Recognition Based Estimation Of Planogram Compliance, Pranoy Hari, Shilpa Yadukumar Rao, Rajashree Ramakrishnan, Avishek Kumar Shaw, Archan Ray, Nishant Kumar, Dipti Prasad Mukherjee 2020 Tata Consultancy Services Limited

System And Method For Object Recognition Based Estimation Of Planogram Compliance, Pranoy Hari, Shilpa Yadukumar Rao, Rajashree Ramakrishnan, Avishek Kumar Shaw, Archan Ray, Nishant Kumar, Dipti Prasad Mukherjee

Patents

Object recognition-based estimation of planogram compliance provides an expected arrangement of products on shelves. Identifying whether a product is placed in an appropriate location on a shelf is a challenging task due to various real-time parameters associated with image capturing. In the present disclosure, an input image associated with a shelf of a retail store is received and product images are cropped. Further, a set of reference images stored in a database are scaled corresponding to the input image. Further, one or more composite matching scores are calculated based on normalized cross-correlation and shape-based feature matching to obtain one or …


Fabrication Of Silicon Microneedles For Dermal Interstitial Fluid Extraction In Human Subjects, Caleb A. Berry 2020 University of Maine

Fabrication Of Silicon Microneedles For Dermal Interstitial Fluid Extraction In Human Subjects, Caleb A. Berry

Electronic Theses and Dissertations

The goal of this project is to design and develop a fabrication process for silicon microneedle arrays to extract dermal interstitial fluid (ISF) from human skin. ISF is a cell- free, living tissue medium that is known to contain many of the same, clinical biomarkers of general health, stress response and immune status as in blood. However, a significant barrier to adoption of ISF as a diagnostic matrix is the lack of a rapid, minimally invasive method of access and collection for analysis. Microfabricated chips containing arrays of microneedles that can rapidly and painlessly access and collect dermal ISF for …


The Effects Of Radiation On Memristor-Based Electronic Spiking Neural Networks, Sumedha Gandharava Dahl 2020 Boise State University

The Effects Of Radiation On Memristor-Based Electronic Spiking Neural Networks, Sumedha Gandharava Dahl

Boise State University Theses and Dissertations

In this dissertation, memristor-based spiking neural networks (SNNs) are used to analyze the effect of radiation on the spatio-temporal pattern recognition (STPR) capability of the networks. Two-terminal resistive memory devices (memristors) are used as synapses to manipulate conductivity paths in the network. Spike-timing-dependent plasticity (STDP) learning behavior results in pattern learning and is achieved using biphasic shaped pre- and post-synaptic spikes. A TiO2 based non-linear drift memristor model designed in Verilog-A implements synaptic behavior and is modified to include experimentally observed effects of state-altering, ionizing, and off-state degradation radiation on the device. The impact of neuron “death” (disabled neuron …


Studies On Space Grade Nano-Iconic Radiation Sensors Using Additive Manufacturing Technology, Shah Mohammad Rahmot Ullah 2020 Boise State University

Studies On Space Grade Nano-Iconic Radiation Sensors Using Additive Manufacturing Technology, Shah Mohammad Rahmot Ullah

Boise State University Theses and Dissertations

Though Additive manufacturing technology has been developing for 30 years, in recent years, it gets researchers’ and industries’ attention for new expansion in fabricated electronics devices, especially on a flexible substrate. This technology allows fabricating complex design of electronics devices with multi-functionality. Its application has been significantly expanded to different fields such as sensors and other device prototypes for nuclear facilities, aerospace manufacturing, bio-medical, solar energy, etc. due to its low-cost efficiency and sustainable manufacturing. It has a huge advantage over traditional methods such as lower materials waste during production, avoiding complex etching system and harmful chemicals, simplified assembly system …


Performance Of Pld Grown Zno Thin Film As A Thin Film Transistor, Shahidul Asif 2020 Missouri State University

Performance Of Pld Grown Zno Thin Film As A Thin Film Transistor, Shahidul Asif

MSU Graduate Theses

The performance of ZnO thin film (grown in different parameters) as a thin film transistor (TFT) is the focus of this study. ZnO is renowned for being n-type semiconductor naturally which was utilized in fabricating a thin film transistor here. This thesis is compared the performance of ZnO thin film transistor by growing the thin film using pulsed laser deposition (PLD) on two slightly different substrates at different temperatures in an optimal 0.1 milli bar oxygen pressure which was later analyzed using other material characterization methods. The substrates were both Si (100) but had different resistivity due to different amount …


Device-Level Predictive Modeling Of Extreme Electromagnetic Interference, NISHCHAY H. SULE 2020 The University of New Mexico

Device-Level Predictive Modeling Of Extreme Electromagnetic Interference, Nishchay H. Sule

Electrical and Computer Engineering ETDs

Radio Frequency (RF) interference is a prominent issue for modern electronic devices. As device size and supply power shrink to meet the on-going demand for compact and complex Integrated Circuits (ICs), their susceptibility to external noise coupling to the input or power supply increases significantly. One such type of noise that acts upon a system to be considered is Extreme Electromagnetic Interference (EEMI). Previous works done to understand and evaluate the impact of EEMI onto a system or sub-system have been conducted on a statistical or empirical analysis level, which has led to complex and convoluted analysis, that requires significant …


Synthesis And Application Of Ceramic Paste For High-Temperature Electronic Packaging, Ardalan Nasiri 2020 University of Arkansas, Fayetteville

Synthesis And Application Of Ceramic Paste For High-Temperature Electronic Packaging, Ardalan Nasiri

Graduate Theses and Dissertations

This dissertation research focused on the synthesis and application of ceramic paste for high-temperature applications. An alumina paste material comprising aluminum dihydric phosphate and alumina powder was developed for high-temperature electronic packaging. Nano aluminum nitride and nano-silica powders were embedded to promote the paste curing process, limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500°C showed no defect or additional cracks. Thermal …


Converter- And Module-Level Packaging For High Power Density And High Efficiency Power Conversion, Amol Rajendrakumar Deshpande 2020 University of Arkansas, Fayetteville

Converter- And Module-Level Packaging For High Power Density And High Efficiency Power Conversion, Amol Rajendrakumar Deshpande

Graduate Theses and Dissertations

Advancements in the converter- and module-level packaging will be the key for the development of the emerging high-power, high power-density, high-eciency power conversion applications, such as traction, shipboards, more-electric-aircraft, and locomotive. Wide bandgap (WBG) devices such as silicon carbide (SiC) MOSFET attract much attention in these applications for their fast switching speeds, resulting in low loss and a consequent possibility for high switching frequency to increase the power density. However, for high-current, high power implementations, WBG devices are still available in small die sizes. Multiple SiC devices need to be connected in parallel to replace a large IGBT die. It …


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