Electronic Devices and Semiconductor Manufacturing Commons^™

Engineering Electromagnetic Systems For Next-Generation Brain-Machine Interface, Brayan Ricardo Navarrete

FIU Electronic Theses and Dissertations

MagnetoElectric Nanoparticles (MENPs) are known to be a powerful tool for a broad range of applications spanning from medicine to energy-efficient electronics. MENPs allow to couple intrinsic electric fields in the nervous system with externally controlled magnetic fields. This thesis exploited MENPs to achieve contactless brain-machine interface (BMIs). Special electromagnetic devices were engineered for controlling the MENPs’ magnetoelectric effect to enable stimulation and recording. The most important engineering breakthroughs of the study are summarized below.

(I) Metastable Physics to Localize Nanoparticles: One of the main challenges is to localize the nanoparticles at any selected site(s) in the brain. The fundamental …

A New Method Of Statcom Controlling For Harmonic Mitigation And Power Factor Correction, Doha Jdeed

Journal of the Arab American University مجلة الجامعة العربية الامريكية للبحوث

This paper presents a control algorithm of 3ph STATic synchronous COMpensator (STATCOM). The algorithm depends on the accurate reference currents extraction from only the nonlinear load current spec-trum in frequency domain using Fast Fourier Transfer (FFT). Then the determined harmonics and reactive components of load current are added together to form the compensating reference signals, the PI controllers then generate signals which control the Pulse Width Modulation (PWM) method. The simulation of the study is carried out under MATLAB/Simulink environment to show the usefulness of this control algorithm with nonlin-ear dynamic loads. It determines exactly the phase shift between the …

Thermal Transport Modeling Of Semiconductor Materials From First Principles, Aliya Qureshi

Masters Theses

Over the past few years, the size of semiconductor devices has been shrinking whereas the density of transistors has exponentially increased. Thus, thermal management has become a serious concern as device performance and reliability is greatly affected by heat. An understanding of thermal transport properties at device level along with predictive modelling can lead us to design of new systems and materials tailored according to the thermal conductivity. In our work we first review different models used to calculate thermal conductivity and examine their accuracy using the experimentally measured thermal conductivity for Si. Our results suggest that empirically calculated rates …

System And Method For Object Recognition Based Estimation Of Planogram Compliance, Pranoy Hari, Shilpa Yadukumar Rao, Rajashree Ramakrishnan, Avishek Kumar Shaw, Archan Ray, Nishant Kumar, Dipti Prasad Mukherjee

Patents

Object recognition-based estimation of planogram compliance provides an expected arrangement of products on shelves. Identifying whether a product is placed in an appropriate location on a shelf is a challenging task due to various real-time parameters associated with image capturing. In the present disclosure, an input image associated with a shelf of a retail store is received and product images are cropped. Further, a set of reference images stored in a database are scaled corresponding to the input image. Further, one or more composite matching scores are calculated based on normalized cross-correlation and shape-based feature matching to obtain one or …

Fabrication Of Silicon Microneedles For Dermal Interstitial Fluid Extraction In Human Subjects, Caleb A. Berry

Electronic Theses and Dissertations

The goal of this project is to design and develop a fabrication process for silicon microneedle arrays to extract dermal interstitial fluid (ISF) from human skin. ISF is a cell- free, living tissue medium that is known to contain many of the same, clinical biomarkers of general health, stress response and immune status as in blood. However, a significant barrier to adoption of ISF as a diagnostic matrix is the lack of a rapid, minimally invasive method of access and collection for analysis. Microfabricated chips containing arrays of microneedles that can rapidly and painlessly access and collect dermal ISF for …

Studies On Space Grade Nano-Iconic Radiation Sensors Using Additive Manufacturing Technology, Shah Mohammad Rahmot Ullah

Boise State University Theses and Dissertations

Though Additive manufacturing technology has been developing for 30 years, in recent years, it gets researchers’ and industries’ attention for new expansion in fabricated electronics devices, especially on a flexible substrate. This technology allows fabricating complex design of electronics devices with multi-functionality. Its application has been significantly expanded to different fields such as sensors and other device prototypes for nuclear facilities, aerospace manufacturing, bio-medical, solar energy, etc. due to its low-cost efficiency and sustainable manufacturing. It has a huge advantage over traditional methods such as lower materials waste during production, avoiding complex etching system and harmful chemicals, simplified assembly system …

The Effects Of Radiation On Memristor-Based Electronic Spiking Neural Networks, Sumedha Gandharava Dahl

Boise State University Theses and Dissertations

In this dissertation, memristor-based spiking neural networks (SNNs) are used to analyze the effect of radiation on the spatio-temporal pattern recognition (STPR) capability of the networks. Two-terminal resistive memory devices (memristors) are used as synapses to manipulate conductivity paths in the network. Spike-timing-dependent plasticity (STDP) learning behavior results in pattern learning and is achieved using biphasic shaped pre- and post-synaptic spikes. A TiO₂ based non-linear drift memristor model designed in Verilog-A implements synaptic behavior and is modified to include experimentally observed effects of state-altering, ionizing, and off-state degradation radiation on the device. The impact of neuron “death” (disabled neuron …

Performance Of Pld Grown Zno Thin Film As A Thin Film Transistor, Shahidul Asif

MSU Graduate Theses

The performance of ZnO thin film (grown in different parameters) as a thin film transistor (TFT) is the focus of this study. ZnO is renowned for being n-type semiconductor naturally which was utilized in fabricating a thin film transistor here. This thesis is compared the performance of ZnO thin film transistor by growing the thin film using pulsed laser deposition (PLD) on two slightly different substrates at different temperatures in an optimal 0.1 milli bar oxygen pressure which was later analyzed using other material characterization methods. The substrates were both Si (100) but had different resistivity due to different amount …

Device-Level Predictive Modeling Of Extreme Electromagnetic Interference, Nishchay H. Sule

Electrical and Computer Engineering ETDs

Radio Frequency (RF) interference is a prominent issue for modern electronic devices. As device size and supply power shrink to meet the on-going demand for compact and complex Integrated Circuits (ICs), their susceptibility to external noise coupling to the input or power supply increases significantly. One such type of noise that acts upon a system to be considered is Extreme Electromagnetic Interference (EEMI). Previous works done to understand and evaluate the impact of EEMI onto a system or sub-system have been conducted on a statistical or empirical analysis level, which has led to complex and convoluted analysis, that requires significant …

Synthesis And Application Of Ceramic Paste For High-Temperature Electronic Packaging, Ardalan Nasiri

Graduate Theses and Dissertations

This dissertation research focused on the synthesis and application of ceramic paste for high-temperature applications. An alumina paste material comprising aluminum dihydric phosphate and alumina powder was developed for high-temperature electronic packaging. Nano aluminum nitride and nano-silica powders were embedded to promote the paste curing process, limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500°C showed no defect or additional cracks. Thermal …

Converter- And Module-Level Packaging For High Power Density And High Efficiency Power Conversion, Amol Rajendrakumar Deshpande

Graduate Theses and Dissertations

Advancements in the converter- and module-level packaging will be the key for the development of the emerging high-power, high power-density, high-eciency power conversion applications, such as traction, shipboards, more-electric-aircraft, and locomotive. Wide bandgap (WBG) devices such as silicon carbide (SiC) MOSFET attract much attention in these applications for their fast switching speeds, resulting in low loss and a consequent possibility for high switching frequency to increase the power density. However, for high-current, high power implementations, WBG devices are still available in small die sizes. Multiple SiC devices need to be connected in parallel to replace a large IGBT die. It …

Design And Optimization Of Multichip Gan Module Enabling Improved Switching Performance, Asif Imran Emon

Graduate Theses and Dissertations

Wide bandgap semiconductors (SiC & GaN) due to their enhanced performance and superior material properties compared to traditional silicon power devices have become the ultimate choice for future high-performance power electronics energy conversion. GaN high electron mobility transistor (HEMT) offers very fast switching capability enabling the designer to push switching frequency to the MHz range. Traditional device packaging becomes a limiting factor in fully harnessing the benefits offered by these advanced power devices, and thus, improved and advanced packaging structures are a must to bridge the gap between GaN devices and their applications. A co-design, co-optimization method has been followed …

Nanoelectronic Applications Of Magnetoelectric Nanostructures, Ping Wang

FIU Electronic Theses and Dissertations

The greatly increased interest in magnetoelectric materials over the last decade is due to their potential to enable next-generation multifunctional nanostructures required for revolutionizing applications spanning from energy-efficient information processing to medicine. Magnetoelectric nanomaterials offer a unique way to use a voltage to control the electron spin and, reciprocally, to use remotely controlled magnetic fields to access local intrinsic electric fields. The magnetoelectric coefficient is the most critical indicator for the magnetoelectric coupling in these nanostructures. To realize the immense potential of these materials, it is necessary to maximize the coefficient. Therefore, the goal of this PhD thesis study was …

High Speed, High Current Monitoring System, Nicolette Lila Ray

Electrical Engineering

Electronics testing requires lengthy data collection and analysis. Streamlining at least part of this process allows resource reallocation, and faster data processing. Verifying a signal’s efficiency is key specification for a component’s datasheet. This project focuses on streamlining data collection when measuring a device’s output current. It combines amplifier design and digital interfacing to perform monitor a device’s output current. A computer-enable interface displays a graphical output current representation. It ensures accurate, high speed, high current measurements while removing a person’s need to manually plot data after testing. A new testing method provides room for company and product growth with …

Reducing Emi In Sic Direct Torque Controlled Motor Drive, Michael Sykes

Electrical Engineering Undergraduate Honors Theses

This paper covers the comparison between Silicon (Si) vs Silicon Carbide (SiC) for Motor Drive systems and a possible control algorithm to limit the increased Electromagnetic Interference (EMI) caused by using SiC transistors for the inverter. Motor Drive systems need constant improvements if the world is going to move on from machines that emit CO₂ and other harmful gases into the Earth’s atmosphere. One reason these electric machines are not commonplace today is because of their efficiency and other problems they may cause. Silicon transistors are the most commonplace transistor around the world today, but advances over the past …

Simultaneous Ohmic Contacts To N And P-Type Silicon Carbide For Future Electric Vehicles, Hayden Hunter

Electrical Engineering Undergraduate Honors Theses

The paper explores possible metallization schemes to form simultaneous ohmic contacts to n-type and p-type silicon carbide contacts. Silicon carbide has shown promise in revolutionizing the power electronics market due to its increased switching speed, compact design, and higher temperature tolerance when compared to Silicon, the market standard. With the continuing development of silicon carbide technology, higher efficiency in future electric vehicles can be achieved by employing this new technology. This paper discusses theoretical contact formation between metals and semiconductors along with a proposed experiment to create a Ni/Al metallization scheme on both n and p-type contacts simultaneously on a …

Ohmic Contact Metallization For Silicon Carbide In Future Transportation And Aviation Systems, Tanner W. Rice

Electrical Engineering Undergraduate Honors Theses

This paper analyzes metallization stacks in both n-type and p-type used in Silicon Carbide to create Ohmic Contacts. Silicon Carbide has shown its significance in usage as a semiconductor in high temperatures, and other extreme environments compared to its silicon counterpart. Additionally, silicon carbide exhibits many other favorable attributes such as strong radiation hardness, high power capability, and high-temperature tolerance. These attributes translate into great components for use in aviation and other future transportations by increasing reliability in a sector that already requires high reliability. Applications of this material could prove useful in fields such as aviation, among others. This …

Microrobots For Wafer Scale Microfactory: Design Fabrication Integration And Control., Ruoshi Zhang

Electronic Theses and Dissertations

Future assembly technologies will involve higher automation levels, in order to satisfy increased micro scale or nano scale precision requirements. Traditionally, assembly using a top-down robotic approach has been well-studied and applied to micro-electronics and MEMS industries, but less so in nanotechnology. With the bloom of nanotechnology ever since the 1990s, newly designed products with new materials, coatings and nanoparticles are gradually entering everyone’s life, while the industry has grown into a billion-dollar volume worldwide. Traditionally, nanotechnology products are assembled using bottom-up methods, such as self-assembly, rather than with top-down robotic assembly. This is due to considerations of volume handling …

Low-Cost Test And Characterization Platform For Memristors, Lyle Jones

Boise State University Theses and Dissertations

The electrical Testing and Characterization of the devices built under research conditions on silicon wafers, diced wafers, or package parts have hampered research since the beginning of integrated circuits. The challenges of performing electrical characterization on devices are to acquire useful and accurate data, the ease of use of the test platform, the portability of the test equipment, the ability to automate quickly, to allow modifications to the platform, the ability to change the configuration of the Device Under Test (DUT) or the Memristor Based Design (MBD), and to do this within budget. The devices that this research is focused …

Design Of Submicron Structured Guided-Mode-Resonance Near-Infrared Polarizer, Marzia Zaman

Graduate Theses and Dissertations

The objective of this research is to design a larger submicron linear polarizer in the near-infrared wavelength range with a wide bandwidth which can be fabricated using the conventional thin-film microfabrication technology to reduce cost. For this purpose, a gold (Au) wire-grid transmission-type transverse-magnetic (TM) polarizer and a silicon (Si) wire-grid reflection-type TM polarizer, were designed using the guided-mode-resonance filter. The Au wire-grid TM polarizer of 700nm grating width and 1200nm grating period has 95% transmittance at 2400nm, more than 1000nm resonance peak bandwidth, and an extinction ratio (ER) of around 300 with a moderated level of sidebands. The 700nm …