System And Method For Object Recognition Based Estimation Of Planogram Compliance,
2020
Tata Consultancy Services Limited
System And Method For Object Recognition Based Estimation Of Planogram Compliance, Pranoy Hari, Shilpa Yadukumar Rao, Rajashree Ramakrishnan, Avishek Kumar Shaw, Archan Ray, Nishant Kumar, Dipti Prasad Mukherjee
Patents
Object recognition-based estimation of planogram compliance provides an expected arrangement of products on shelves. Identifying whether a product is placed in an appropriate location on a shelf is a challenging task due to various real-time parameters associated with image capturing. In the present disclosure, an input image associated with a shelf of a retail store is received and product images are cropped. Further, a set of reference images stored in a database are scaled corresponding to the input image. Further, one or more composite matching scores are calculated based on normalized cross-correlation and shape-based feature matching to obtain one or …
The Effects Of Radiation On Memristor-Based Electronic Spiking Neural Networks,
2020
Boise State University
The Effects Of Radiation On Memristor-Based Electronic Spiking Neural Networks, Sumedha Gandharava Dahl
Boise State University Theses and Dissertations
In this dissertation, memristor-based spiking neural networks (SNNs) are used to analyze the effect of radiation on the spatio-temporal pattern recognition (STPR) capability of the networks. Two-terminal resistive memory devices (memristors) are used as synapses to manipulate conductivity paths in the network. Spike-timing-dependent plasticity (STDP) learning behavior results in pattern learning and is achieved using biphasic shaped pre- and post-synaptic spikes. A TiO2 based non-linear drift memristor model designed in Verilog-A implements synaptic behavior and is modified to include experimentally observed effects of state-altering, ionizing, and off-state degradation radiation on the device. The impact of neuron “death” (disabled neuron …
Low-Power Cmos Cross-Coupled Differential-Drive Rectifier For Ambient Radio Frequency Energy Harvesting Systems,
2020
Universiti Malaya
Low-Power Cmos Cross-Coupled Differential-Drive Rectifier For Ambient Radio Frequency Energy Harvesting Systems, Sing Leung Gabriel Chong
Student Works (2020-2029)
Wireless Sensor Node (WSN) for the Internet of Things (IoT) and Internet of Everything (IoE) will require harvesting low-power ambient Radio Frequency (RF) energy to achieve self-power capabilities, alleviating the need of batteries. The research title of “Low-Power CMOS Cross-Coupled Differential-Drive Rectifier for Ambient Radio Frequency Energy Harvesting Systems” relates to the design of integrated circuit (IC) rectifiers for low-power ambient RF energy harvesting (RFEH) in complementary-metal-oxide-semiconductor (CMOS) technology. The adoption of CMOS for the rectifier designs is to achieve small physical form factor, low-cost, and system-on-chip (SoC) integration. The rectifier is the main circuit in an ambient RFEH system …
Hybrid Microwave Power Amplifiers For Broadband Communication,
2020
Universiti Malaya
Hybrid Microwave Power Amplifiers For Broadband Communication, Sangaran Pragash
Student Works (2020-2029)
The software-defined radio is the future of radio technology. The development of a broadband power amplifier is the most challenging radio component to design in achieving software-defined radio goals due to the PA gain-bandwidth limitation. The distributed power amplifier (DPA) overcomes the limitation by combining output power from several transistors in an additive fashion. Matrix Amplifier (MA) consists of two or more DPA stacked together in a multiplicative manner. In this project, a high power and high gain DPA for a two-way radio system is demonstrated. The DPA exhibits 10W output power and 32dB gain across the frequency range of …
Performance Of Pld Grown Zno Thin Film As A Thin Film Transistor,
2020
Missouri State University
Performance Of Pld Grown Zno Thin Film As A Thin Film Transistor, Shahidul Asif
Graduate Theses/Dissertations
The performance of ZnO thin film (grown in different parameters) as a thin film transistor (TFT) is the focus of this study. ZnO is renowned for being n-type semiconductor naturally which was utilized in fabricating a thin film transistor here. This thesis is compared the performance of ZnO thin film transistor by growing the thin film using pulsed laser deposition (PLD) on two slightly different substrates at different temperatures in an optimal 0.1 milli bar oxygen pressure which was later analyzed using other material characterization methods. The substrates were both Si (100) but had different resistivity due to different amount …
Comparison Of Pressure-Assist Silver Sintering To Tin Silver Solder Alloy As Die Attach Material In High Power Semiconductor,
2020
Universiti Malaya
Comparison Of Pressure-Assist Silver Sintering To Tin Silver Solder Alloy As Die Attach Material In High Power Semiconductor, Tolentino Erik Nino
Student Works (2020-2029)
The research is focused on pressure-assisted silver sintering material that is compared to tin silver solder alloy paste as used in power electronics. Material characterization, electrical tests, and reliability tests were conducted in the experiment. After drying process, it was observed that the Ag sintering paste height was reduced to approximately 40 percent. Die attach shear test showed that the average reading is about from 200 to 600 grams which are already enough to hold the dice before proceeding to the pressure sintering process. X-ray revealed that the void percent for SnAg paste sample is about 1.5 percent while pressure-assist …
3-Dimensional Carbon Micro-Electro Mechanical System (Mems) Electrode For Potential Dielectrophoretic Hepatic Cell Patterning Application,
2020
Universiti Malaya
3-Dimensional Carbon Micro-Electro Mechanical System (Mems) Electrode For Potential Dielectrophoretic Hepatic Cell Patterning Application, Wan Yahya Wan Nurlina
Student Works (2020-2029)
The maintenance of liver tissue unique pattern remains a great challenge in the generation of functional engineered liver tissue in vitro. This thesis presents a carbon dielectrophoresis (DEP) based cell patterning for generating hepatic cell constructs, mimicking biological hepatic lobule. A new design of electrode named interdigitated radiating-strips electrode (IRSE) was simulated and optimized using COMSOL Multiphysics 4.2a. The simulation result proved that IRSE is capable to provide uniform distribution of electric field for generating three-dimensional (3D) DEP force. The use of carbon electrodes has been an alternative to traditional metal electrodes and insulator structures for DEP applications since more …
Studies On Space Grade Nano-Iconic Radiation Sensors Using Additive Manufacturing Technology,
2020
Boise State University
Studies On Space Grade Nano-Iconic Radiation Sensors Using Additive Manufacturing Technology, Shah Mohammad Rahmot Ullah
Boise State University Theses and Dissertations
Though Additive manufacturing technology has been developing for 30 years, in recent years, it gets researchers’ and industries’ attention for new expansion in fabricated electronics devices, especially on a flexible substrate. This technology allows fabricating complex design of electronics devices with multi-functionality. Its application has been significantly expanded to different fields such as sensors and other device prototypes for nuclear facilities, aerospace manufacturing, bio-medical, solar energy, etc. due to its low-cost efficiency and sustainable manufacturing. It has a huge advantage over traditional methods such as lower materials waste during production, avoiding complex etching system and harmful chemicals, simplified assembly system …
Device-Level Predictive Modeling Of Extreme Electromagnetic Interference,
2020
The University of New Mexico
Device-Level Predictive Modeling Of Extreme Electromagnetic Interference, Nishchay H. Sule
Electrical and Computer Engineering ETDs
Radio Frequency (RF) interference is a prominent issue for modern electronic devices. As device size and supply power shrink to meet the on-going demand for compact and complex Integrated Circuits (ICs), their susceptibility to external noise coupling to the input or power supply increases significantly. One such type of noise that acts upon a system to be considered is Extreme Electromagnetic Interference (EEMI). Previous works done to understand and evaluate the impact of EEMI onto a system or sub-system have been conducted on a statistical or empirical analysis level, which has led to complex and convoluted analysis, that requires significant …
Converter- And Module-Level Packaging For High Power Density And High Efficiency Power Conversion,
2020
University of Arkansas, Fayetteville
Converter- And Module-Level Packaging For High Power Density And High Efficiency Power Conversion, Amol Rajendrakumar Deshpande
Graduate Theses and Dissertations
Advancements in the converter- and module-level packaging will be the key for the development of the emerging high-power, high power-density, high-eciency power conversion applications, such as traction, shipboards, more-electric-aircraft, and locomotive. Wide bandgap (WBG) devices such as silicon carbide (SiC) MOSFET attract much attention in these applications for their fast switching speeds, resulting in low loss and a consequent possibility for high switching frequency to increase the power density. However, for high-current, high power implementations, WBG devices are still available in small die sizes. Multiple SiC devices need to be connected in parallel to replace a large IGBT die. It …
Synthesis And Application Of Ceramic Paste For High-Temperature Electronic Packaging,
2020
University of Arkansas, Fayetteville
Synthesis And Application Of Ceramic Paste For High-Temperature Electronic Packaging, Ardalan Nasiri
Graduate Theses and Dissertations
This dissertation research focused on the synthesis and application of ceramic paste for high-temperature applications. An alumina paste material comprising aluminum dihydric phosphate and alumina powder was developed for high-temperature electronic packaging. Nano aluminum nitride and nano-silica powders were embedded to promote the paste curing process, limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500°C showed no defect or additional cracks. Thermal …
Design And Optimization Of Multichip Gan Module Enabling Improved Switching Performance,
2020
University of Arkansas, Fayetteville
Design And Optimization Of Multichip Gan Module Enabling Improved Switching Performance, Asif Imran Emon
Graduate Theses and Dissertations
Wide bandgap semiconductors (SiC & GaN) due to their enhanced performance and superior material properties compared to traditional silicon power devices have become the ultimate choice for future high-performance power electronics energy conversion. GaN high electron mobility transistor (HEMT) offers very fast switching capability enabling the designer to push switching frequency to the MHz range. Traditional device packaging becomes a limiting factor in fully harnessing the benefits offered by these advanced power devices, and thus, improved and advanced packaging structures are a must to bridge the gap between GaN devices and their applications. A co-design, co-optimization method has been followed …
Performance Analysis Of Renewable Energy Resources In Rural Areas: A Case Study Of Solar Energy,
2020
University of Dar es Salaam
Performance Analysis Of Renewable Energy Resources In Rural Areas: A Case Study Of Solar Energy, Jackson Justo
Tanzania Journal of Engineering and Technology (TJET)
This paper presents an overview of the recent development trends of solar photovoltaic (PV) systems and the performance in the Tanzanian context. The two types of solar power generation that are considered in this paper are: i) solar PV systems and ii) concentrated solar power (CSP). The two are compared in terms of cost of energy and energy storage mechanism. Moreover, the effect of ambient temperature on the solar PV module is analyzed. In addition, a detailed analysis on using solar axis tracking to increase the power generation is also presented. The extent to which the cell surface temperature and …
High Speed, High Current Monitoring System,
2020
California Polytechnic State University, San Luis Obispo
High Speed, High Current Monitoring System, Nicolette Lila Ray
Electrical Engineering
Electronics testing requires lengthy data collection and analysis. Streamlining at least part of this process allows resource reallocation, and faster data processing. Verifying a signal’s efficiency is key specification for a component’s datasheet. This project focuses on streamlining data collection when measuring a device’s output current. It combines amplifier design and digital interfacing to perform monitor a device’s output current. A computer-enable interface displays a graphical output current representation. It ensures accurate, high speed, high current measurements while removing a person’s need to manually plot data after testing. A new testing method provides room for company and product growth with …
Ohmic Contact Metallization For Silicon Carbide In Future Transportation And Aviation Systems,
2020
University of Arkansas, Fayetteville
Ohmic Contact Metallization For Silicon Carbide In Future Transportation And Aviation Systems, Tanner W. Rice
Electrical Engineering Undergraduate Honors Theses
This paper analyzes metallization stacks in both n-type and p-type used in Silicon Carbide to create Ohmic Contacts. Silicon Carbide has shown its significance in usage as a semiconductor in high temperatures, and other extreme environments compared to its silicon counterpart. Additionally, silicon carbide exhibits many other favorable attributes such as strong radiation hardness, high power capability, and high-temperature tolerance. These attributes translate into great components for use in aviation and other future transportations by increasing reliability in a sector that already requires high reliability. Applications of this material could prove useful in fields such as aviation, among others. This …
Simultaneous Ohmic Contacts To N And P-Type Silicon Carbide For Future Electric Vehicles,
2020
University of Arkansas, Fayetteville
Simultaneous Ohmic Contacts To N And P-Type Silicon Carbide For Future Electric Vehicles, Hayden Hunter
Electrical Engineering Undergraduate Honors Theses
The paper explores possible metallization schemes to form simultaneous ohmic contacts to n-type and p-type silicon carbide contacts. Silicon carbide has shown promise in revolutionizing the power electronics market due to its increased switching speed, compact design, and higher temperature tolerance when compared to Silicon, the market standard. With the continuing development of silicon carbide technology, higher efficiency in future electric vehicles can be achieved by employing this new technology. This paper discusses theoretical contact formation between metals and semiconductors along with a proposed experiment to create a Ni/Al metallization scheme on both n and p-type contacts simultaneously on a …
Reducing Emi In Sic Direct Torque Controlled Motor Drive,
2020
University of Arkansas, Fayetteville
Reducing Emi In Sic Direct Torque Controlled Motor Drive, Michael Sykes
Electrical Engineering Undergraduate Honors Theses
This paper covers the comparison between Silicon (Si) vs Silicon Carbide (SiC) for Motor Drive systems and a possible control algorithm to limit the increased Electromagnetic Interference (EMI) caused by using SiC transistors for the inverter. Motor Drive systems need constant improvements if the world is going to move on from machines that emit CO2 and other harmful gases into the Earth’s atmosphere. One reason these electric machines are not commonplace today is because of their efficiency and other problems they may cause. Silicon transistors are the most commonplace transistor around the world today, but advances over the past …
Microrobots For Wafer Scale Microfactory: Design Fabrication Integration And Control.,
2020
University of Louisville
Microrobots For Wafer Scale Microfactory: Design Fabrication Integration And Control., Ruoshi Zhang
Electronic Theses and Dissertations
Future assembly technologies will involve higher automation levels, in order to satisfy increased micro scale or nano scale precision requirements. Traditionally, assembly using a top-down robotic approach has been well-studied and applied to micro-electronics and MEMS industries, but less so in nanotechnology. With the bloom of nanotechnology ever since the 1990s, newly designed products with new materials, coatings and nanoparticles are gradually entering everyone’s life, while the industry has grown into a billion-dollar volume worldwide. Traditionally, nanotechnology products are assembled using bottom-up methods, such as self-assembly, rather than with top-down robotic assembly. This is due to considerations of volume handling …
Design Of Submicron Structured Guided-Mode-Resonance Near-Infrared Polarizer,
2020
University of Arkansas, Fayetteville
Design Of Submicron Structured Guided-Mode-Resonance Near-Infrared Polarizer, Marzia Zaman
Graduate Theses and Dissertations
The objective of this research is to design a larger submicron linear polarizer in the near-infrared wavelength range with a wide bandwidth which can be fabricated using the conventional thin-film microfabrication technology to reduce cost. For this purpose, a gold (Au) wire-grid transmission-type transverse-magnetic (TM) polarizer and a silicon (Si) wire-grid reflection-type TM polarizer, were designed using the guided-mode-resonance filter. The Au wire-grid TM polarizer of 700nm grating width and 1200nm grating period has 95% transmittance at 2400nm, more than 1000nm resonance peak bandwidth, and an extinction ratio (ER) of around 300 with a moderated level of sidebands. The 700nm …
Low-Cost Test And Characterization Platform For Memristors,
2020
Boise State University
Low-Cost Test And Characterization Platform For Memristors, Lyle Jones
Boise State University Theses and Dissertations
The electrical Testing and Characterization of the devices built under research conditions on silicon wafers, diced wafers, or package parts have hampered research since the beginning of integrated circuits. The challenges of performing electrical characterization on devices are to acquire useful and accurate data, the ease of use of the test platform, the portability of the test equipment, the ability to automate quickly, to allow modifications to the platform, the ability to change the configuration of the Device Under Test (DUT) or the Memristor Based Design (MBD), and to do this within budget. The devices that this research is focused …
