Electronic Devices and Semiconductor Manufacturing Commons^™

Chip-Package Interfacial Stress Analysis And Reliability Implications For Flip-Chip Power Devices, Jonathan Gh Treco

Mechanical Engineering Undergraduate Honors Theses

The solder in flip-chip assemblies experience high stress and strain because of thermal mismatch induced deformation. These deformations occur because of the differences of coefficient of thermal expansion between flip-chip assembly materials. The similarly in stress profiles between thermal induced and shear induced stress in solder joints enable the use of die shear testing as a representative technique for relating the max stress the flip-chip can withstand to cyclic thermal fatigue failures. In this work, two electronic device sample preparation types are evaluated: One set of samples are soldered together and other set of samples use epoxy as an adhesive. …

Optimization Of Graphene Parameters For The Development Of Supercapacitors, Jessica L. Montgomery

Mechanical Engineering Undergraduate Honors Theses

In the growing market of evolving electronic devices and the sustainable goals of the energy industry, better sources of energy dense storage devices are needed. Carbon based supercapacitors have attracted the attention of research due to the natural properties of high electrical conductivity, chemical and electrochemical stability, and high surface area. The object of this thesis is to expand upon current knowledge of reduced graphene oxide to better understand the effectiveness of the material as electrode in supercapacitors. This thesis will focus on the physical orientation of supercapacitors to further develop a device that will allow a set of supercapacitors …

System-Layout-Dependent Thermally Induced Solder Stress & Reliability Implications, Ange C. Iradukunda

Mechanical Engineering Undergraduate Honors Theses

Electronic flip chip assemblies consist of dissimilar component materials, which exhibit different CTE. Under thermal cyclic operating conditions, this CTE mismatch produces interfacial and interconnect stresses, which are highly dependent on system layout. In this paper, sensitivity analyses are performed using ANSYS FEA to establish how the proximity and arrangement of neighboring devices affect interconnect stress. Flip chip alignment modes ranging from edge-to-edge to corner-to-corner are studied. Results of these FEA studies, demonstrated that closely packing devices together has the effect of making them act as one. This results in a significant increase in the thermomechanical stresses induced on peripheral …

Design And Test Of A Gate Driver With Variable Drive And Self-Test Capability Implemented In A Silicon Carbide Cmos Process, Matthew Barlow

Graduate Theses and Dissertations

Discrete silicon carbide (SiC) power devices have long demonstrated abilities that outpace those of standard silicon (Si) parts. The improved physical characteristics allow for faster switching, lower on-resistance, and temperature performance. The capabilities unleashed by these devices allow for higher efficiency switch-mode converters as well as the advance of power electronics into new high-temperature regimes previously unimaginable with silicon devices. While SiC power devices have reached a relative level of maturity, recent work has pushed the temperature boundaries of control electronics further with silicon carbide integrated circuits.

The primary requirement to ensure rapid switching of power MOSFETs was a gate …

Modeling And Validation Of 4h-Sic Low Voltage Mosfets For Integrated Circuit Design, Shamim Ahmed

Graduate Theses and Dissertations

Silicon Carbide is a promising wide bandgap material and gradually becoming the first choice of semiconductor for high density and high efficiency power electronics in medium voltage range (500-1500V). SiC has also excellent thermal conductivity and the devices fabricated with the material can operate at high temperature (~ 400 ⁰C). Thus, a power electronic system built with SiC devices requires less cooling requirement and saves board space and cost. The high temperature applications of SiC material can also be extended to space exploration, oil and gas rigging, aerospace and geothermal energy systems for data acquisition, sensing and instrumentation and power …

The Effect Of Power Supply Ramp Time On Sram Puf's, Abdelrahman T. Elshafiey Mr.

Electrical and Computer Engineering ETDs

Physical unclonable functions (PUFs) are security primitives that exploit the device mismatches. PUFs are a promising solution for hardware cryptography and key storage. They are used in many security applications including identification, authentication and key generation. SRAM is one of the popular implementations of PUFs. SRAM PUFs offer the advantage, over other PUF constructions, of reusing resources (memories) that already exist in many designs.

In this thesis, for the first time, it is demonstrated that the start-up value of an SRAM PUF could be different depending on the SRAM power supply rising time. An analytical model has been developed to …

Hand Cranked Generator For Mobile Devices, Kyle Brown, Monique Butoto, Stephen Cain, Steven Corio, Brock Stevenson

Thinking Matters Symposium Archive

It’s estimated that over 90% of American adults own cell phones while over 70% of the United States land area belongs to rural counties. It is a challenge to charge mobile devices in these remote and rural areas given the lack of access to power sources. This lack of power in remote destinations limits the general use of mobile devices for outdoor enthusiasts, as well as a survival means for all who need access to a portable power generation device, especially in emergency situations. There are other portable generators currently available on the market, but our project wanted to take …

Design Verification Of Mems Resonators With Fem Simulator, Joshua Wiswell

Thinking Matters Symposium Archive

The purpose of this project was to use COMSOL, an advanced FEM (finite element modeling) software, to analyze a Coupled Thermal Resonator. This Coupled Thermal Resonator was previously constructed in L-Edit, but when analyzed in COMSOL, it produced undesirable results. This project focused on improving the design and model of the Resonator to improve simulation results and evaluating the actual response of the MEMS device to determine if simulated results were accurate for the actual device. Many different factors may have contributed to producing the double peak seen in the simulation, including the weak coupling between the two resonators. These …

Toward Improving Electrocardiogram (Ecg) Biometric Verification Using Mobile Sensors: A Two-Stage Classifier Approach, Robin Tan, Marek Perkowski

Electrical and Computer Engineering Faculty Publications and Presentations

Electrocardiogram (ECG) signals sensed from mobile devices pertain the potential for biometric identity recognition applicable in remote access control systems where enhanced data security is demanding. In this study, we propose a new algorithm that consists of a two-stage classifier combining random forest and wavelet distance measure through a probabilistic threshold schema, to improve the effectiveness and robustness of a biometric recognition system using ECG data acquired from a biosensor integrated into mobile devices. The proposed algorithm is evaluated using a mixed dataset from 184 subjects under different health conditions. The proposed two-stage classifier achieves a total of 99.52% subject …

Analysis And Simulation Of Photovoltaic Systems Incorporating Battery Energy Storage, Oluwaseun M. Akeyo

Theses and Dissertations--Electrical and Computer Engineering

Solar energy is an abundant renewable source, which is expected to play an increasing role in the grid's future infrastructure for distributed generation. The research described in the thesis focuses on the analysis of integrating multi-megawatt photovoltaics (PV) systems with battery energy storage into the existing grid and on the theory supporting the electrical operation of components and systems. The PV system is divided into several sections, each having its own DC-DC converter for maximum power point tracking and a two-level grid connected inverter with different control strategies. The functions of the battery are explored by connecting it to the …

Growth Of Zn-Polar Bemgzno/Zno Heterostructure With Two Dimensional Electron Gas (2deg) And Fabrication Of Silver Schottky Diode On Bemgzno/Zno Heterostructure., Md Barkat Ullah

Theses and Dissertations

Title of dissertation: GROWTH OF Zn POLAR BeMgZnO/ZnO HETEROSTRUCTURE WITH TWO DIMENSIONAL ELECTRON GAS (2DEG) AND FABRICATION OF SILVER SCHOTTKY DIODE ON BeMgZnO/ZnO HETEROSTRUCTURE

By Md Barkat Ullah, Ph.D

A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy in Electrical and Computer Engineering at Virginia Commonwealth University.

Virginia Commonwealth University,2017

Major Director: Dr. Hadis Morkoç, Professor, Electrical and Computer Engineering

This thesis focuses on growth of Zn polar BeMgZnO/ZnO heterostructure on GaN/sapphire template with two dimensional electron gas (2DEG) for the application of UV photodetector/emitter and high speed electronics. The motivation of using …

Low-Temperature Fabrication Process For Integrated High-Aspect Ratio Metal Oxide Nanostructure Semiconductor Gas Sensors, William Paul Clavijo

Theses and Dissertations

This work presents a new low-temperature fabrication process of metal oxide nanostructures that allows high-aspect ratio zinc oxide (ZnO) and titanium dioxide (TiO₂) nanowires and nanotubes to be readily integrated with microelectronic devices for sensor applications. This process relies on a new method of forming a close-packed array of self-assembled high-aspect-ratio nanopores in an anodized aluminum oxide (AAO) template in a thin (2.5 µm) aluminum film deposited on a silicon and lithium niobate substrate (LiNbO₃). This technique is in sharp contrast to traditional free-standing thick film methods and the use of an integrated thin aluminum film …

Optical Spectroscopy Of Wide Bandgap Semiconductor Heterostructures And Group-Iv Alloy Quantum Dots, Tanner A. Nakagawara

Theses and Dissertations

Efficient and robust blue InGaN multiple quantum well (MQW) light emitters have become ubiquitous; however, they still have unattained theoretical potential. It is widely accepted that “localization” of carriers due to indium fluctuations theoretically enhance their efficiency by moderating defect-associated nonradiative recombination. To help develop a complete understanding of localization effects on carrier dynamics, this thesis explores degree of localization in InGaN MQWs and its dependence on well thickness and number of wells, through temperature and power dependent photoluminescence measurements. Additionally, silicon-compatible, nontoxic, colloidally synthesizable 2-5 nm Ge_1-xSn_x alloy quantum-dots (QDs) are explored for potential visible to …

Quantitative Analysis Of X-Ray Fluorescence Absorption And Emission For Thickness Determination Of Ald-Grown Metal And Oxide Nanoscaled Films, Tarek M. Abdel-Fattah, Alex Wixtrom, Larry Arias, Kai Zhang, Helmut Baumgart

Electrical & Computer Engineering Faculty Publications

This study describes the use of X-ray fluorescence spectroscopy (XRF) to determine the thickness of nanoscaled thin films of insulating oxides such as Al₂O₃, HfO₂, and ZrO₂, semiconducting oxides such as TiO₂, ZnO, and metals like Pt, on silicon substrates synthesized by atomic layer deposition (ALD) technology. XRF thickness measurements were compared with the predicted layer thickness based on calculations from known ALD growth rates for each metal or metal oxide films. The ALD growth rates have been calibrated with TEM cross-sectional measurements of the resulting film thickness. The results …

Marine Mammal Tracks From Two-Hydrophone Acoustic Recordings Made With A Glider, Elizabeth T. Küsel, Tessa Munoz, Martin Siderius, David K. Mellinger, Sara L. Heimlich

Electrical and Computer Engineering Faculty Publications and Presentations

A multinational oceanographic and acoustic sea experiment was carried out in the summer of 2014 off the western coast of the island of Sardinia, Mediterranean Sea. During this experiment, an underwater glider fitted with two hydrophones was evaluated as a potential tool for marine mammal population density estimation studies. An acoustic recording system was also tested, comprising an inexpensive, off-the-shelf digital recorder installed inside the glider. Detection and classification of sounds produced by whales and dolphins, and sometimes tracking and localization, are inherent components of population density estimation from passive acoustics recordings. In this work we discuss the equipment used …

Real-Time Internal Temperature Estimation And Health Monitoring For Igbt Modules, Ze Wang

Department of Electrical and Computer Engineering: Dissertations, Theses, and Student Research

Field experiences have demonstrated that power semiconductor devices, such as insulated-gate bipolar transistors (IGBTs), are among the most fragile components of power electronic converters. Thermomechanical stresses produced by temperature variations during operational and environmental loads are the major causes of IGBT degradation. As the devices are often operated under complex working conditions, temperature variations and the associated damage are difficult to predict during the converter design stage. A promising approach—online health monitoring and prognosis for power semiconductor devices—that can avoid device failure and effectively schedule maintenance has attracted much interest.

This dissertation research focused on real-time accurate internal temperature estimation …

Mass Reduction Patterning Of Silicon-On-Oxide-Based Micromirrors, Harris J. Hall, Andrew Green, Sarah Dooley, Jason D. Schmidt, Laverne A. Starman, Derrick Langley, Ronald A. Coutu Jr.

Faculty Publications

It has long been recognized in the design of micromirror-based optical systems that balancing static flatness of the mirror surface through structural design with the system’s mechanical dynamic response is challenging. Although a variety of mass reduction approaches have been presented in the literature to address this performance trade, there has been little quantifiable comparison reported. In this work, different mass reduction approaches, some unique to the work, are quantifiably compared with solid plate thinning in both curvature and mass using commercial finite element simulation of a specific square silicon-on-insulator–based micromirror geometry. Other important considerations for micromirror surfaces, including surface …

Improvements To Micro-Contact Performance And Reliability, Tod V. Laurvick

Theses and Dissertations

Microelectromechanical Systems (MEMS) based devices, and specifically microswitches, continue to offer many advantages over competing technologies. To realize the benefits of micro-switches, improvements must be made to address performance and reliability shortfalls which have long been an issue with this application. To improve the performance of these devices, the micro-contacts used in this technology must be understood to allow for design improvements, and offer a means for testing to validate this technology and determine when such improvements are ready for operational environments. To build devices which are more robust and capable of continued operation after billions of cycles requires that …

Strategies And Techniques For Fabricating Mems Bistable Thermal Actuators., Dilan Ratnayake

Electronic Theses and Dissertations

Bistable elements are beginning to appear in the field of MEMS as they allow engineers to design sensors and actuators which require no electrical power and possess mechanical memory. This research focuses on the development of novel strategies and techniques for fabricating MEMS bistable structures to serve as no electrical power thermal actuators. Two parallel strategies were explored for the design and fabrication of the critical bistable element. Both strategies involved an extensive material study on candidate thin film materials to determine their temperature coefficient of expansion and as-deposited internal stress properties. Materials investigated included titanium tungsten, Invar, silicon nitride …

Si-Based Germanium-Tin (Gesn) Emitters For Short-Wave Infrared Optoelectronics, Seyed Amir Ghetmiri

Graduate Theses and Dissertations

Conventional integrated electronics have reached a physical limit, and their efficiency has been influenced by the generated heat in the high-density electronic packages. Integrated photonic circuits based on the highly developed Si complementary-metal-oxide-semiconductor (CMOS) infrastructure was proposed as a viable solution; however, Si-based emitters are the most challenging component for the monolithic integrated photonic circuits. The indirect bandgap of silicon and germanium is a bottleneck for the further development of photonic and optoelectronic integrated circuits.

The Ge1-xSnx alloy, a group IV material system compatible with Si CMOS technology, was suggested as a desirable material that theoretically exhibits a direct bandgap …