Materials Chemistry Commons^™

Electrodeposition Mechanism And Process Of A Novel Cyanide-Free Gold Sulfite Bath, Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian

Journal of Electrochemistry

A novel cyanide-free gold sulfite process is introduced in this paper. In the bath, chloauric acid was directly employed as the main salt, and hydroxyethylidene diphosphonic acid (HEDP) was used as the stabilizer and coating grain refiner. The bath stability, the gold coating morphology and the mechanism of gold electrodeposition were studied in detail. The results showed that HEDP could significantly improve the bath stability. Moreover, the grains of the gold coating obtained from the gold sulfite bath without HEDP was rod-like, which grew gradually with the increasing of the deposition time, resulting in that the appearance of the coating …

Electrochemical Deposition Of Copper Pillar Bumps With High Uniformity, Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo

Journal of Electrochemistry

Electrochemical deposition of copper pillar bumps (CPBs) is one of the key technologies for the advanced packaging. In this study, the effects of the additive concentration, the electrolyte convection, the current density, and the electroplating system on the uniformity of the CPBs have been systematically investigated. The results showed that the profiles of the CPBs were mainly determined by the additive concentration, the bath convection and the current density, while the heights of the CPBs were mainly affected by the electroplating system. For the CPBs profiles, it was found that the low leveler concentration and high current density would generally …

Research Progress In Electroless Cobalt Plating And The Bottom-Up Filling Of Electroless Plating, Yu Shen, Bing-Bing Li, Yi Ma, Zeng-Lin Wang

Journal of Electrochemistry

With the continuous improvement of semiconductor integration, the resistivity of copper interconnect lines increases rapidly. When the width of the interconnect line is close to 7 nm, the resistivity of copper becomes the same as that of cobalt. International Business Machines Corporation (IBM) and Advanced Semiconductor Incorporation (ASI) have used cobalt to replace copper as a next-generation interconnect material. However, the fabrication of the cobalt seed layer and the super filling of electroplating cobalt for the 7 nm via-holes have been still the large challenge. Electroless plating is a very simple method to form a seed layer on the surface …

Preface To Special Issue On Electronic Electroplating, Zhi-Dong Chen, Chong Wang, Wei He, Ming Li

Journal of Electrochemistry

No abstract provided.

Investigation Of Through-Hole Copper Electroplating With Methyl Orange As A Special Leveler, Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen

Journal of Electrochemistry

Methyl Orange (MO) with two kinds of functional groups can act as both an accelerator and an inhibitor, which has been used as a special leveler to simplify the electroplating additive system in the through-hole (TH) copper electroplating experiments. In this work, the role of MO in TH electroplating is characterized by molecular dynamics simulations and quantum chemical calculations. It is suggested that MO can spontaneously flatten the copper surface and be well adsorbed on the cathode surface, which inhibit the copper electrodeposition on the cathode. Electrochemical behavior of MO was evaluated by galvanostatic measurements (GM) and cyclic voltammetry (CV) …

Designing Dynamic And Degradable Polymeric Materials With Thiol-X Chemistries, Reese Sloan

Dissertations

With plastic production poised to increase in coming years, there arises a need to develop new polymeric materials designed to combat the global pollution crisis. A commonly utilized approach in addressing this challenge is to employ a responsive functional moiety into the polymer architecture. Thiol-X reactions, a commonly utilized class of “click” reactions, have garnered broad implementation in new stimuli-responsive materials. This work specifically focuses on utilizing radical-mediated thiol-ene coupling and base-catalyzed thiol-isocyanate reactions to develop a library of ternary thiol-ene/thiourethane covalent adaptable networks (CANs) and hydrolytically labile poly(thioether ketal) thermoplastics. CANs are a class of network materials capable of …

Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder, Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu

Journal of Electrochemistry

Sn-Ag-Cu ternary alloy is the most ideal substitute for Sn-Pb alloy at present, and can be prepared by electrodeposition with high production efficiency, simple equipment, easy maintenance and excellent coating performance. The coordination system of the electroplating solution was investigated through the Hull cell experiment. The type of brighteners used in the plating solution and the ratio of the two brighteners were determined through the microscopic morphologic characterization, electrochemical corrosion test and cathodic polarization curve test. In addition, the dispersant and stabilizer were studied by observing the microscopic morphology and measuring the concentration change of Sn²⁺ ions in the …

Optimization Of Pulse Plating Additives And Plating Parameters For High Aspect Ratio Through Holes, Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, Zeng-Kun Wu

Journal of Electrochemistry

As an important component in electronic products, printed circuit board (PCB) plays a supporting and interconnecting role for the electronic components in it. With the development of communication technology, electronic products are developing in the direction of “thin, light and small”, and high density interconnection (HDI) comes into being. Due to the high-density interconnection characteristics of HDI boards, the thickness of the board is increasing. At the same time, in order to reserve space for the laying of fine lines on the subsequent board surface, the diameter of the through holes on the board is also decreasing, so the depth-diameter …

An Investigation On The Interface Corrosion Behaviors Of Cobalt Interconnects In Chemical Mechanical Polishing Slurry, Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, Tao Hang

Journal of Electrochemistry

Cobalt is widely regarded as the most promising interconnect material for 10 nm node and beyond. The development of a chemical mechanical planarization (CMP) slurry suitable for cobalt interconnect is a critical component for the application of cobalt interconnect. During CMP process of the interconnect layer, the achievement of high-quality surface after planarization is greatly challenged by the metal corrosion in CMP slurry. In this contribution, the corrosion behavior of cobalt in a slurry with potassium persulfate (KPS) as an oxidizer, glycine as a complexing agent, and benzotriazole (BTA) as an inhibitor was investigated. Static erosion rates (SER) of cobalt …

Electrochemical Sers Study Of Benzotriazole And 3-Mercapto-1-Propanesulfonate In Acidic Solution On Copper Electrode, Yin-Fei Shen, Yan-Li Chen, Sheng-Xu Wang, Ye Zhu, Wen-Chang Wang, Min-Xian Wu, Zhi-Dong Chen

Journal of Electrochemistry

Since the development of acid copper plating technology, the role of additives is indispensable. In addition to the main salt copper sulfate and supporting electrolyte sulfuric acid, suppressors, accelerators, levelers and chlorine ions (Cl^-) are also required to be added into the plating solution. Appropriate additive system can have a significant impact on the coating or the plating solution, which can help improve the quality of the coating and increase the brightness of the coating. Through electrochemical measurement, vibrational spectroscopy, scanning probe microscopy, molecular dynamics simulation and other methods, researches have a deeper understanding in the adsorption configuration …

Development Status Of Copper Electroplating Filling Technology In Through Glass Via For 3d Interconnections, Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li

Journal of Electrochemistry

With the slow development of Moore's Law, the high density and miniaturization of microelectronic devices put forward higher requirements for advanced packaging technology. As a key technology in 2.5D/3D packaging, interposer technology has been extensively studied. According to different interposer materials, it is mainly divided into organic interposer, silicon interposer and glass interposer. Compared with the through silicon via (TSV) interconnection, the through glass via (TGV) interposer has received extensive attention in the 2.5D/3D advanced packaging field for its advantages of excellent high-frequency electrical characteristics, simple process, low cost, and adjustable coefficient of thermal expansion (CTE). However, the thermal conductivity …

Study On Low Voltage Electrodeposition Of Diamond-Like Carbon Film, Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, Zhi-Dong Chen

Journal of Electrochemistry

Diamond-like carbon (DLC) films are receiving a lot of attention from the scientific community, thanks to the promise of DLC films for applications in microelectronics and optoelectronics. Usually, electrodeposition is the preferred common technique because of low cost, large deposition area and simplicity of the setup. However, when carbon films are electrodeposited on a stainless steel, high cell voltages (≥1000 V) are required owing to the low electric conductivity of the organic solvents. This work has developed a new electrolyte system that could achieve carbon deposition on a stainless steel under a low applied cell voltage. The DLC films were …

Study On Weak Alkaline Cyanide-Free Silver Plating Process For Etching Lead Frame, Jian-Wei Zhao, Hai-Feng Zhu, Xiao-Hui Yu, Gui-Yun Yuan, Zhi Sun

Journal of Electrochemistry

As a new development direction of integrated circuit chip carrier, etched lead frame has been gradually applied in microelectronics industry in recent years. Since the preparation of the etched lead frame requires the use of multiple layers of non-alkali-resistant photoresist films with specific patterns, and the traditional cyanide silver plating is unable to meet this requirement, making that the development of weakly alkaline cyanide free silver plating process has great significance. In this paper, a weak alkaline silver plating process based on 5,5-dimethylhydantoin (DMH) cyanide-free silver plating system was studied. The electrodeposition behavior of the system and the nucleation mechanism …

Microstructure Of Electrodeposited Copper Foil: Discussion On The Mechanism Model Of Three-Dimensional Electrocrystallization, Ren-Zhi Liu, Ping-Ling Xie, Chong Wang

Journal of Electrochemistry

The manufacturing of electrolytic copper foil has attracted more and more attention with the extensive applications of printed circuit board and lithium battery. The industrial scale is still extending. Compared with the developments of electroplating equipment and electroplating process, there is limited research on the mechanism of electrodeposition. This paper summarizes the manufacturing process of electrodeposited copper foil and analyzes the differences of various electroplating parameters in different electrodeposited copper technologies, and points out the important role of electrodeposition current density in the formation of copper foil. By showing and comparing the microstructures of different electrodeposited copper foils, the influences …

Introduction Of Development And Application Technology Of Organic Additives For Acid Copper Electroplating, Hao-Bin Zou, Chao-Li Tan, Wei Xiong, Dao-Lin Xi, Bin-Yun Liu

Journal of Electrochemistry

Acid copper electroplating is one of the key technologies in buildup multilayer PCB (BUM-PCB) manufacture process and the most important technique to achieve electrical interconnection between any layer and high-density interconnection in a substrate. This article introduces the research focus of organic additives used in acid copper electroplating, and developing different kinds of micro-via filling copper electroplating technique applied in various scenarios, and some other technical problems from applications. First of all, according to the chronopotentiometric (CP) experiment results, the levelers with different polymeric molecular structures exhibited various responses of cupric deposition potential along with their increased concentrations, which is …

Effect Of Sodium Alcohol Thiyl Propane Sulfonate On Electrolysis Of High Performance Copper Foil For Lithium Ion Batteries, Sen Yang, Wen-Chang Wang, Ran Zhang, Shui-Ping Qin, Min-Xian Wu, Naotoshi Mitsuzaki, Zhi-Dong Chen

Journal of Electrochemistry

Electrolytic copper foils have been widely used in printed circuit boards and lithium-ion batteries due to their simple production process and high economic value. In the process of electrolysis foil making, additives can greatly improve the performance of electrolytic copper foils. In this work, the copper foils were prepared in a self-designed plate electrodeposition device of which the operating principles were in accordance with those of actual industrial production. A series of the Virgin Make-up Solution (VMS: 312.5 g·L^-1 CuSO₄·5H₂O, 100 g·L^-1 H₂SO₄, 50 mg·L^-1 Cl^-) containing …

Biomimetic And Medical Applications Of Hollow Nanoscale Structures, Justin Fang

Dissertations, Theses, and Capstone Projects

Materials whose structure incorporates nanoscale void spaces have multiple possible uses, whether in a bulk form or as individual particles, due to the combination of high surface area ratios and nanoscale material properties. This thesis will explore a few of these possibilities, concentrating on potential biomimetic and biomedical applications, for two materials: metal- organic frameworks and superparamagnetic iron oxide nanocages.

Metal-organic frameworks consist of metal ions such as Cu2+ which have highly porous lattice structures allowing them to absorb and release guest molecules such as peptides like diphenylalanine; this stored chemical energy can be turned into kinetic energy and used …

Development Of Optical Nanomaterial For Enhanced Cerenkov Imaging, Qize Zhang

Dissertations, Theses, and Capstone Projects

Cancer is a significant public health problem worldwide and is the second leading cause of death in the United States. Imaging has increasingly been used over the last two decades to improve the diagnosis and guidance of tumor tissue removal surgery. Among the most widely used techniques for in vivo imaging are planar and tomographic fluorescence imaging and bioluminescence imaging. Despite their utility, these techniques are primarily restricted to preclinical use. Factors that have prevented translation from the bench to the bedside include depth-penetration considerations, regulatory issues, and toxicity. A recent development in nuclear imaging has been the ability to …

Electrochemical Synthesis Of Acetylpyrazine, Lin Mao, Dong-Fang Niu, Shuo-Zhen Hu, Xin-Sheng Zhang

Journal of Electrochemistry

Acetylpyrazine is naturally presented in hazelnuts, peanuts, and sesame seeds. As an important food additive, it is widely used in baked foods, meat, sesame and tobacco. At the same time, acetylpyrazine is also an important pharmaceutical intermediate, which is used in the syntheses of anti-tuberculosis drugs, anti-tumor, anti-malaria, anti-viral, antibacterial and treatments of epilepsy, pain and Parkinson’s drugs. At present, the synthesis methods of acetylpyrazine include oxidation method, multi-step method and Grignard reagent method, which have the disadvantages of low yield, cumbersome process, severe reaction conditions and high cost. In this study, acetylation of pyrazine was used to synthesize acetylpyrazine …

Electrochemical Voltammetric Behavior Of Sulfur Mustard On The Bare Pt Electrode, Yu-Lin Yang, Jie Sun, Tian Zhou, Ji-Gang Li, Shou-Ping Wei

Journal of Electrochemistry

The sulfur mustard (bis(2-chloroethyl) sulphide, HD), one of highly toxic chemical weapon agents, can damage the alive tissue cells (such as skin, lung, respiratory mucosa and so on), and cause carcinogenic and mutagenic effects for a long time exposure, which imposes a great threat not only to the human health, but also to the sustainable development of the society. With its convenience, high sensitivity and rapid response, electrochemical technology exhibits considerable potential in the field-deployed detection toward HD, but the related reports are rare. Herein, the electrochemical behavior of HD on the bare Pt electrode was investigated by electrochemical measurements, …