Co-Microencapsulation Of Ruellia Tuberosa L. And Cosmos Caudatus K. Extracts For Pharmaceutical Applications,
2022
Chemistry Department, Faculty of Mathematics and Natural Sciences, Universitas Brawijaya, Malang 65145, Indonesia
Co-Microencapsulation Of Ruellia Tuberosa L. And Cosmos Caudatus K. Extracts For Pharmaceutical Applications, Choirin Annisa, Sasangka Prasetyawan, Anna Safitri
Makara Journal of Science
This study aims to co-microencapsulate the Ruellia tuberosa L. and Cosmos caudatus K. extracts, with chitosan–sodium tripolyphosphate (Na-TPP) as coating material. α-Amylase inhibition and antioxidant assays were conducted to determine the potential of microcapsules used as antidiabetic agents. The microcapsules were manufactured under the influences of pH, Na-TPP concentration, and stirring time. The optimum microencapsulation conditions were selected based on the highest encapsulation efficiency. The optimum microencapsulation conditions were a pH of 4, Na-TPP concentration of 0.15% (w/v), and stirring time of 60 min. The microcapsules exhibited an IC50 (inhibitory concentration) value of 223.64 ± 0.81 µg/mL and an …
Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder,
2022
1. Shennan Circuits Co., Ltd,Guangdong Shenzhen 518023, China;
Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder, Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu
Journal of Electrochemistry
Sn-Ag-Cu ternary alloy is the most ideal substitute for Sn-Pb alloy at present, and can be prepared by electrodeposition with high production efficiency, simple equipment, easy maintenance and excellent coating performance. The coordination system of the electroplating solution was investigated through the Hull cell experiment. The type of brighteners used in the plating solution and the ratio of the two brighteners were determined through the microscopic morphologic characterization, electrochemical corrosion test and cathodic polarization curve test. In addition, the dispersant and stabilizer were studied by observing the microscopic morphology and measuring the concentration change of Sn2+ ions in the …
Application Of Numerical Simulation Method In Periodic Pulse Reverse Electroplating Through Hole,
2022
MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, Heilongjiang, China;
Application Of Numerical Simulation Method In Periodic Pulse Reverse Electroplating Through Hole, Yuan-Hang Zhang, Mao-Zhong An, Pei-Xia Yang, Jin-Qiu Zhang
Journal of Electrochemistry
The upgrade of the fifth generation (5G) communication technology increases the number of communication backplane layers and the aspect ratio of through holes on the board, making it more difficult to use traditional direct current deposition for interconnection. Direct current electrodeposition is more prone to uneven coating in the hole, resulting in poor contact between the coating and components, and open circuit. This has a serious impact on the stability of printed circuit board. The periodic pulse reverse plating method can significantly improve the uniformity of high aspect ratio through-hole plating and improve the production quality of through-hole plating through …
Optimization Of Pulse Plating Additives And Plating Parameters For High Aspect Ratio Through Holes,
2022
1. School of Chemistry and Chemical Engineering, Chongqing University, Chongqing 401331, China;
Optimization Of Pulse Plating Additives And Plating Parameters For High Aspect Ratio Through Holes, Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, Zeng-Kun Wu
Journal of Electrochemistry
As an important component in electronic products, printed circuit board (PCB) plays a supporting and interconnecting role for the electronic components in it. With the development of communication technology, electronic products are developing in the direction of “thin, light and small”, and high density interconnection (HDI) comes into being. Due to the high-density interconnection characteristics of HDI boards, the thickness of the board is increasing. At the same time, in order to reserve space for the laying of fine lines on the subsequent board surface, the diameter of the through holes on the board is also decreasing, so the depth-diameter …
An Investigation On The Interface Corrosion Behaviors Of Cobalt Interconnects In Chemical Mechanical Polishing Slurry,
2022
School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240;
An Investigation On The Interface Corrosion Behaviors Of Cobalt Interconnects In Chemical Mechanical Polishing Slurry, Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, Tao Hang
Journal of Electrochemistry
Cobalt is widely regarded as the most promising interconnect material for 10 nm node and beyond. The development of a chemical mechanical planarization (CMP) slurry suitable for cobalt interconnect is a critical component for the application of cobalt interconnect. During CMP process of the interconnect layer, the achievement of high-quality surface after planarization is greatly challenged by the metal corrosion in CMP slurry. In this contribution, the corrosion behavior of cobalt in a slurry with potassium persulfate (KPS) as an oxidizer, glycine as a complexing agent, and benzotriazole (BTA) as an inhibitor was investigated. Static erosion rates (SER) of cobalt …
Research Progresses Of Cobalt Interconnect And Superfilling By Electroplating In Chips,
2022
1. College of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
Research Progresses Of Cobalt Interconnect And Superfilling By Electroplating In Chips, Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, Su Wang
Journal of Electrochemistry
Copper interconnect using dual damascene technology has always been the main means for metallization in the back end of line process. However, with the size effect becoming more and more obvious due to feature size reduction, copper interconnect can no longer meet the demand for high circuit speed in Post-Moore era. Following copper interconnection, cobalt interconnection in chips attracts much attention as an interconnect technology by the next generation, which has been introduced in 7 nm node of integrated circuit manufacturing and below. The electron mean free path of cobalt (~10 nm) is much shorter than copper’s (39 nm), thus …
Electrochemical Sers Study Of Benzotriazole And 3-Mercapto-1-Propanesulfonate In Acidic Solution On Copper Electrode,
2022
School of Petrochemical Engineering, Changzhou University, Changzhou 213164, Jiangsu, China.;
Electrochemical Sers Study Of Benzotriazole And 3-Mercapto-1-Propanesulfonate In Acidic Solution On Copper Electrode, Yin-Fei Shen, Yan-Li Chen, Sheng-Xu Wang, Ye Zhu, Wen-Chang Wang, Min-Xian Wu, Zhi-Dong Chen
Journal of Electrochemistry
Since the development of acid copper plating technology, the role of additives is indispensable. In addition to the main salt copper sulfate and supporting electrolyte sulfuric acid, suppressors, accelerators, levelers and chlorine ions (Cl-) are also required to be added into the plating solution. Appropriate additive system can have a significant impact on the coating or the plating solution, which can help improve the quality of the coating and increase the brightness of the coating. Through electrochemical measurement, vibrational spectroscopy, scanning probe microscopy, molecular dynamics simulation and other methods, researches have a deeper understanding in the adsorption configuration …
Development Status Of Copper Electroplating Filling Technology In Through Glass Via For 3d Interconnections,
2022
1. School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
Development Status Of Copper Electroplating Filling Technology In Through Glass Via For 3d Interconnections, Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li
Journal of Electrochemistry
With the slow development of Moore's Law, the high density and miniaturization of microelectronic devices put forward higher requirements for advanced packaging technology. As a key technology in 2.5D/3D packaging, interposer technology has been extensively studied. According to different interposer materials, it is mainly divided into organic interposer, silicon interposer and glass interposer. Compared with the through silicon via (TSV) interconnection, the through glass via (TGV) interposer has received extensive attention in the 2.5D/3D advanced packaging field for its advantages of excellent high-frequency electrical characteristics, simple process, low cost, and adjustable coefficient of thermal expansion (CTE). However, the thermal conductivity …
Influences Of Suppressing Additive Malachite Green On Superconformal Cobalt Filling And Nucleation,
2022
MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, Heilongjiang, China;
Influences Of Suppressing Additive Malachite Green On Superconformal Cobalt Filling And Nucleation, Xiao-Chuan Ma, Ya-Qiang Li, Pei-Xia Yang, Jin-Qiu Zhang, Mao-Zhong An
Journal of Electrochemistry
As the semiconductor integrated circuits evolve into 7 nm technology and beyond, the resistance of the Cu filling at back-end-of-line interconnects no longer linearly scales with dimension. The metal Co with lower mean free path can be used to replace Cu for reducing the line resistance caused by the scattering on the outer surface and grain boundary in the smaller and smaller size. In this study, CoSO4 was used as the main salt, boric acid as a buffer and malachite green (MG) as an inhibitor for further research. According to the electrochemical cyclic voltammetric (CV) curves by using a …
Study On Low Voltage Electrodeposition Of Diamond-Like Carbon Film,
2022
School of petrochemical engineering, Changzhou University, Changzhou 213164, Jiangsu, China;
Study On Low Voltage Electrodeposition Of Diamond-Like Carbon Film, Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, Zhi-Dong Chen
Journal of Electrochemistry
Diamond-like carbon (DLC) films are receiving a lot of attention from the scientific community, thanks to the promise of DLC films for applications in microelectronics and optoelectronics. Usually, electrodeposition is the preferred common technique because of low cost, large deposition area and simplicity of the setup. However, when carbon films are electrodeposited on a stainless steel, high cell voltages (≥1000 V) are required owing to the low electric conductivity of the organic solvents. This work has developed a new electrolyte system that could achieve carbon deposition on a stainless steel under a low applied cell voltage. The DLC films were …
Study On Weak Alkaline Cyanide-Free Silver Plating Process For Etching Lead Frame,
2022
1. Jiaxing University, College of Materials and Textile Engineering, Jiaxing 314001, Zhejiang, China;
Study On Weak Alkaline Cyanide-Free Silver Plating Process For Etching Lead Frame, Jian-Wei Zhao, Hai-Feng Zhu, Xiao-Hui Yu, Gui-Yun Yuan, Zhi Sun
Journal of Electrochemistry
As a new development direction of integrated circuit chip carrier, etched lead frame has been gradually applied in microelectronics industry in recent years. Since the preparation of the etched lead frame requires the use of multiple layers of non-alkali-resistant photoresist films with specific patterns, and the traditional cyanide silver plating is unable to meet this requirement, making that the development of weakly alkaline cyanide free silver plating process has great significance. In this paper, a weak alkaline silver plating process based on 5,5-dimethylhydantoin (DMH) cyanide-free silver plating system was studied. The electrodeposition behavior of the system and the nucleation mechanism …
Microstructure Of Electrodeposited Copper Foil: Discussion On The Mechanism Model Of Three-Dimensional Electrocrystallization,
2022
1. Wuhan Fengfan Electrochemical Technology Co., Ltd., Wuhan 430000, Hubei, China;
Microstructure Of Electrodeposited Copper Foil: Discussion On The Mechanism Model Of Three-Dimensional Electrocrystallization, Ren-Zhi Liu, Ping-Ling Xie, Chong Wang
Journal of Electrochemistry
The manufacturing of electrolytic copper foil has attracted more and more attention with the extensive applications of printed circuit board and lithium battery. The industrial scale is still extending. Compared with the developments of electroplating equipment and electroplating process, there is limited research on the mechanism of electrodeposition. This paper summarizes the manufacturing process of electrodeposited copper foil and analyzes the differences of various electroplating parameters in different electrodeposited copper technologies, and points out the important role of electrodeposition current density in the formation of copper foil. By showing and comparing the microstructures of different electrodeposited copper foils, the influences …
Introduction Of Development And Application Technology Of Organic Additives For Acid Copper Electroplating,
2022
1. Guanghua Institute of Sci-Tech(Guangdong) Co., Ltd, Guangzhou, Guangdong 510288, China;
Introduction Of Development And Application Technology Of Organic Additives For Acid Copper Electroplating, Hao-Bin Zou, Chao-Li Tan, Wei Xiong, Dao-Lin Xi, Bin-Yun Liu
Journal of Electrochemistry
Acid copper electroplating is one of the key technologies in buildup multilayer PCB (BUM-PCB) manufacture process and the most important technique to achieve electrical interconnection between any layer and high-density interconnection in a substrate. This article introduces the research focus of organic additives used in acid copper electroplating, and developing different kinds of micro-via filling copper electroplating technique applied in various scenarios, and some other technical problems from applications. First of all, according to the chronopotentiometric (CP) experiment results, the levelers with different polymeric molecular structures exhibited various responses of cupric deposition potential along with their increased concentrations, which is …
Effect Of Sodium Alcohol Thiyl Propane Sulfonate On Electrolysis Of High Performance Copper Foil For Lithium Ion Batteries,
2022
1. School of Petrochemical Engineering, Changzhou University, Changzhou 213164, Jiangsu, China;
Effect Of Sodium Alcohol Thiyl Propane Sulfonate On Electrolysis Of High Performance Copper Foil For Lithium Ion Batteries, Sen Yang, Wen-Chang Wang, Ran Zhang, Shui-Ping Qin, Min-Xian Wu, Naotoshi Mitsuzaki, Zhi-Dong Chen
Journal of Electrochemistry
Electrolytic copper foils have been widely used in printed circuit boards and lithium-ion batteries due to their simple production process and high economic value. In the process of electrolysis foil making, additives can greatly improve the performance of electrolytic copper foils. In this work, the copper foils were prepared in a self-designed plate electrodeposition device of which the operating principles were in accordance with those of actual industrial production. A series of the Virgin Make-up Solution (VMS: 312.5 g·L-1 CuSO4·5H2O, 100 g·L-1 H2SO4, 50 mg·L-1 Cl-) containing …
On The Exact Helium Wave Function Expansion,
2022
University of Connecticut
On The Exact Helium Wave Function Expansion, Carl W. David
Chemistry Education Materials
A 1S wave function’s expansion for 2 electron atoms and ions is obtained and the leading coefficients are reported.
Electrochemical Synthesis Of Acetylpyrazine,
2022
State Key Laboratory of Chemical Engineering, East China University of Science and Technology, Shanghai 200237, China;
Electrochemical Synthesis Of Acetylpyrazine, Lin Mao, Dong-Fang Niu, Shuo-Zhen Hu, Xin-Sheng Zhang
Journal of Electrochemistry
Acetylpyrazine is naturally presented in hazelnuts, peanuts, and sesame seeds. As an important food additive, it is widely used in baked foods, meat, sesame and tobacco. At the same time, acetylpyrazine is also an important pharmaceutical intermediate, which is used in the syntheses of anti-tuberculosis drugs, anti-tumor, anti-malaria, anti-viral, antibacterial and treatments of epilepsy, pain and Parkinson’s drugs. At present, the synthesis methods of acetylpyrazine include oxidation method, multi-step method and Grignard reagent method, which have the disadvantages of low yield, cumbersome process, severe reaction conditions and high cost. In this study, acetylation of pyrazine was used to synthesize acetylpyrazine …
Electrochemical Voltammetric Behavior Of Sulfur Mustard On The Bare Pt Electrode,
2022
Department of Chemistry Defense, Institute of NBC Defense, Beijing 102205, China;
Electrochemical Voltammetric Behavior Of Sulfur Mustard On The Bare Pt Electrode, Yu-Lin Yang, Jie Sun, Tian Zhou, Ji-Gang Li, Shou-Ping Wei
Journal of Electrochemistry
The sulfur mustard (bis(2-chloroethyl) sulphide, HD), one of highly toxic chemical weapon agents, can damage the alive tissue cells (such as skin, lung, respiratory mucosa and so on), and cause carcinogenic and mutagenic effects for a long time exposure, which imposes a great threat not only to the human health, but also to the sustainable development of the society. With its convenience, high sensitivity and rapid response, electrochemical technology exhibits considerable potential in the field-deployed detection toward HD, but the related reports are rare. Herein, the electrochemical behavior of HD on the bare Pt electrode was investigated by electrochemical measurements, …
Electrocatalytic "Volcano-Type" Effect Of Nano-Tio2 (A)/(R) Phase Content In Pt/Tio2-CnX Catalyst,
2022
Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China;
Electrocatalytic "Volcano-Type" Effect Of Nano-Tio2 (A)/(R) Phase Content In Pt/Tio2-CnX Catalyst, Ai-Lin Cui, Yang Bai, Hong-Ying Yu, Hui-Min Meng
Journal of Electrochemistry
The relationship between the electrochemical activity of fuel cell catalysts and Pt particle size, as well as the catalyst support and co-catalyst is still unclear. In this work, FESEM, XRD, BET, TEM and CV techniques were adopted to investigate the effects of TiO2 anatase (A)/rutile (R) phases content on the electrochemical activity of Pt electrocatalyst. The results showed that the anatase-rutile phase transformation occurred during the heat treatment of TiO2 at 700 ~ 900 oC accompanied by the growth of two-phase crystalline size, and anatase was completely transformed into rutile at 900 oC. TEM results revealed …
Biofouling Behaviors Of Pure Titanium Surface Polarized At Different Potentials,
2022
1. Center for Marine Materials Corrosion and Protection, College of Materials, Xiamen University, Xiamen 361005, Fujian, China;
Biofouling Behaviors Of Pure Titanium Surface Polarized At Different Potentials, Zhao-Xia Dai, Da-Jiang Zheng, Guang-Ling Song, Dan-Qing Feng, Pei Su
Journal of Electrochemistry
Titanium (Ti) and its alloys are commonly used as engineering materials. Although they have been widely used in marine environments, they are also facing serious threats of biofouling. Therefore, it is necessary to investigate the relationship between electrochemical behavior and bioaffinity of titanium oxide film in seawater to explore effective surface treatment technology to reduce biofouling. In this work, the cathodic potential of -0.8 VSCE and the passivation potential of 0.5 VSCE were directly applied to the TA2 Ti in artificial seawater for potentionstatic polarization treatment to prepare two kinds of surface films with different states and then …
Effect Of Chloride Ion On Electrochemical Behavior Of Silver Electrodeposition In Chcl-Urea Low Eutectic Solvent,
2022
School of Environmental and Chemical Engineering, Shenyang University of Technology, Shenyang 110159, China;
Effect Of Chloride Ion On Electrochemical Behavior Of Silver Electrodeposition In Chcl-Urea Low Eutectic Solvent, Chong-Bo Zhan, Run-Jia Zhang, Xu Fu, Hai-Jing Sun, Xin Zhou, Bao-Jie Wang, Jie Sun
Journal of Electrochemistry
Metallic silver coating has been widely used in the fields of microelectronics industry, catalyst, sensor and preparation of magnetoresistive materials because of its excellent corrosion resistance, good lubricity, high conductivity, excellent decoration and high catalysis. Compared with the traditional aqueous solution system, the research on metal electrodeposition in ionic liquid system is developing rapidly. In addition, additives are the key factors in the silver plating process. Adding a small amount of organic or inorganic additives to the plating solution will significantly change the coating properties, such as improving brightness, hardness and ductility. In this paper, using choline chloride urea (ChCl-Urea) …
