A Methodology Of Spice Simulation To Extract Sram Setup And Hold Timing Parameters Based On Dff Delay Degradation,
University of Kentucky
A Methodology Of Spice Simulation To Extract Sram Setup And Hold Timing Parameters Based On Dff Delay Degradation, Xiaowei Zhang
Theses and Dissertations--Electrical and Computer Engineering
SRAM is a significant component in high speed computer design, which serves mainly as high speed storage elements like register files in microprocessors, or the interface like multiple-level caches between high speed processing elements and low speed peripherals. One method to design the SRAM is to use commercial memory compiler. Such compiler can generate different density/speed SRAM designs with single/dual/multiple ports to fulfill design purpose. There are discrepancy of the SRAM timing parameters between extracted layout netlist SPICE simulation vs. equation-based Liberty file (.lib) by a commercial memory compiler. This compiler takes spec values as its input and uses them …
Studies And Progresses On Hole Metallization In High-Density Interconnected Printed Circuit Boards,
College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, Fujian China;
Studies And Progresses On Hole Metallization In High-Density Interconnected Printed Circuit Boards, Zhao-Yun Wang, Lei Jin, Jia-Qiang Yang, Wei-Qing Li, Dong-Ping Zhan, Fang-Zu Yang, Shi-Gang Sun
Journal of Electrochemistry
Printed circuit boards (PCBs) are almost the core components of all electronic systems. With the rapid development of sciences and technologies, PCBs are gradually developing in the direction of multi-layer, thin and high-density wiring due to the functionalization, miniaturization, lightweight and high reliability of electronic products, as well as the widespread popularization of the subminiature package such as chip scale package (CSP) and ball grid array (BGA). Therefore, High-density interconnected printed circuit boards (HDI-PCBs) arise. Hole metallization is one of the core technologies in HDI-PCBs and includes two processes composed of conductive treatment and electron electroplating. Electroless copper plating, as …
Design Of A Bandgap Voltage Reference,
University of Arkansas, Fayetteville
Design Of A Bandgap Voltage Reference, Nicolaus Vail
Electrical Engineering Undergraduate Honors Theses
This thesis details the design process of a bandgap voltage reference (BGR) integrated circuit in a 180 nm CMOS process. A BGR provides a constant DC voltage across a range of operating temperatures and supply voltages. By its nature, the circuit is intended as a reference, not to provide current, so the output would be connected to a very high impedance, such as the gate of a transistor. At 27°C, this design provides a 955 mV reference voltage given a nominal VDD of 3 V. From 20°C to 175°C, the output voltage has a variance of 7.2 mV (approximately 0.8%) …
Design Of A Folded Cascode Operational Amplifier In A 1.2 Micron Silicon-Carbide Cmos Process,
University of Arkansas, Fayetteville
Design Of A Folded Cascode Operational Amplifier In A 1.2 Micron Silicon-Carbide Cmos Process, Kyle Addington
Electrical Engineering Undergraduate Honors Theses
This thesis covers the design of a Folded Cascode CMOS Operational Amplifier (Op-Amp) in Raytheon’s 1.2-micron Silicon Carbide (SiC) process. The use of silicon-carbide as a material for integrated circuits (ICs) is gaining popularity due to its ability to function at high temperatures outside the range of typical silicon ICs. The goal of this design was to create an operational amplifier suitable for use in a high temperature analog-to-digital converter application. The amplifier has been designed to have a DC gain of 50dB, a phase margin of 50 degrees, and a bandwidth of 2 MHz. The circuit’s application includes input …
Research Progresses Of Copper Interconnection In Chips,
College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, Fujian, China;
Research Progresses Of Copper Interconnection In Chips, Lei Jin, Jia-Qiang Yang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian, Shao-Min Zhou
Journal of Electrochemistry
In this paper, the copper interconnection technology in chip manufacturing is introduced in detail, and the essentials of acidic copper sulfate electroplating process and the mechanisms of common-used additives are reviewed. The progresses of novel additives at home and abroad are also summarized. Based on the studied achievement, the possibility of the novel copper interconnect process replacing the acidic copper electroplating is prospected.
Reliable Software Updates For On-Orbit Cubesat Satellites,
California Polytechnic State University, San Luis Obispo
Reliable Software Updates For On-Orbit Cubesat Satellites, Sean Fitzsimmons
Master's Theses
CubeSat satellites have redefined the standard solution for conducting missions in space due to their unique form factor and cost. The harsh environment of space necessitates examining features that improve satellite robustness and ultimately extend lifetime, which is typical and vital for mission success. The CubeSat development team at Cal Poly, PolySat, has recently redefined its standard avionics platform to support more complex mission capabilities with this robustness in mind. A significant addition was the integration of the Linux operating system, which provides the flexibility to develop much more elaborate protection mechanisms within software, such as support for remote on-orbit …
Mp3 Player System Design,
California Polytechnic State University - San Luis Obispo
Mp3 Player System Design, Eric Wu
Electrical Engineering
The purpose of this project is to design and build a portable audio player that reads music files off an SD card, decodes the music file and outputs the music through a headphone jack. A microcontroller running FreeRTOS will facilitate the data transfer between an SD card and the decoding chip. The decoded audio will then be sent to a high-end DAC chip that outputs the sound.
Machine Learning Approach To Stability Analysis Of Semiconductor Memory Element,
Southern Methodist University
Machine Learning Approach To Stability Analysis Of Semiconductor Memory Element, Ravindra Thanniru, Gautam Kapila, Nibhrat Lohia
SMU Data Science Review
Memory stability analysis traditionally relied heavily on circuit simulation-based approaches that run Monte Carlo (MC) analysis over various manufacturing and use condition parameters. This paper researches application of Machine Learning approaches for memory element failure analysis which could mimic simulation-like accuracy and minimize the need for engineers to rely heavily on simulators for their validations. Both regressor and classifier algorithms are benchmarked for accuracy and recall scores. A high recall score implies fewer escapes of fails to field and is the metric of choice for comparing algorithm. The paper identifies that recall score in excess of 0.97 can be achieved …
Design And Characterization Of Standard Cell Library Using Finfets,
California Polytechnic State University, San Luis Obispo
Design And Characterization Of Standard Cell Library Using Finfets, Phanindra Datta Sadhu
Master's Theses
The processors and digital circuits designed today contain billions of transistors on a small piece of silicon. As devices are becoming smaller, slimmer, faster, and more efficient, the transistors also have to keep up with the demands and needs of the daily user. Unfortunately, the CMOS technology has reached its limit and cannot be used to scale down due to the transistor's breakdown caused by short channel effects. An alternative solution to this is the FinFET transistor technology, where the gate of the transistor is a three dimensional fin that surrounds the transistor and prevents the breakdown caused by scaling …
Improvement Of Stability Of A Grid-Connected Inverter With An Lcl Filter By Robust Strong Active Damping And Model Predictive Control,
University of Arkansas, Fayetteville
Improvement Of Stability Of A Grid-Connected Inverter With An Lcl Filter By Robust Strong Active Damping And Model Predictive Control, Seungyong Lee
Graduate Theses and Dissertations
This study addresses development and implementation of robust control methods for a three-phase grid-connected voltage source inverter (VSI) accompanied by an inductive-capacitive-inductive (LCL) filter. A challenge of current control for the VSI is LCL filter resonance near to the control stability boundary, which interacts with the inverter control switching actions and creates the possibility of instability. In general, active damping is needed to stabilize the system and ensure robust performance in steady-state and dynamic responses. While many active damping methods have been proposed to resolve this issue, capacitor-current-feedback active damping has been most widely used for its simple implementation.
There …
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