Operations Research, Systems Engineering and Industrial Engineering Commons^™

Correlation Of Numerical Ability And Quality Technician Best Performers In Manufacturing Quality Control Applications, Charles Wesley Shelton

All-Inclusive List of Electronic Theses and Dissertations

The occupation of Quality Technician has many duties requiring numerical operations. Business and industry place considerable emphasis on numerical ability when evaluating the performance of a Quality Technician. In this study, the numerical ability and performance classification of Quality Technicians were analyzed using a correlation analysis. lll A single case study was used to investigate this relationship. A modified Delphi Method was used to determine characteristics of a Quality Technician. Quality Technicians were evaluated by their direct supervisor and completed a standardized numerical ability test. The evaluations by the supervisor were used to classify each technician based on their performance. …

Effect Of Chromium–Gold And Titanium–Titanium Nitride–Platinum–Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason B. Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications requires good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr-Au and Ti-TiN-Pt-Au metallization systems for an optoelectronic application. Both Chromium and Titanium are used to promote adhesion between semiconductor substrates and sputtered gold films. However, both will be oxidized if they diffuse to the gold surface and result in the degradation of the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr-Au and Ti-TiN-Pt-Au, annealing, and CAN etch processes, on …

Investigation Of The Lead-Free Solder Joint Shear Performance, James Webster, Jianbiao Pan, Brian J. Toleno

Industrial and Manufacturing Engineering

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC …

Estimation Of Liquidus Temperature When Snagcu Bga/Csp Components Are Soldered With Snpb Paste, Jianbiao Pan

Industrial and Manufacturing Engineering

Recently, the soldering of lead-free components with SnPb paste, or lead-free backward compatibility, is becoming a hot topic. One of the major challenges in backward compatibility assembly is the development of a right reflow profile for the soldering of SnAgCu Ball Grid Array (BGA)/Chip Scale Package (CSP) components with SnPb paste. If the SnAgCu reflow profile is used, the reflow temperature may be too high for other SnPb components in the same board during assembly according to the component rating per IPC/JEDEC J-STD-020C. In addition, the flux in SnPb solder paste may not function properly in such a high reflow …

A Comparative Study Of Various Loss Functions In The Economic Tolerance Design, Jehnan Pan, Jianbiao Pan

Industrial and Manufacturing Engineering

Engineering tolerance design plays an important role in modern manufacturing. In this paper, the Kapur's model was modified so that the economic specification limits for both symmetric and asymmetric losses can be established. Three different loss functions: (1) Taguchi's quadratic loss function; (2) Inverted Normal Loss Function; (3) Revised Inverted Normal Loss Function are compared in the economic tolerance design. The relationships between the three loss functions and process capability indices for symmetric tolerance are established. The results suggest that the revised inverted normal loss function be used in determination of economic specification limits.

Plotting A Bright Future For Manufacturing Education: Results Of A Brainstorming Session, Daniel Waldorf, Sema E. Alptekin, Robert Bjurman

Industrial and Manufacturing Engineering

Manufacturing industries worldwide have undergone dramatic changes in recent years and now demand more from graduating manufacturing engineers. The effects of globalization have forever changed the parameters for success in manufacturing. Our educational institutions must respond to these changes with innovation. That agenda formed the basis for a special SME/CIRP international conference on manufacturing engineering education called “Looking Forward: Innovations in Manufacturing Engineering Education,” held in San Luis Obispo, California, June 22-25, 2005. At the meeting, manufacturing education professionals from around the world came together to share their own innovative ideas and to brainstorm ways to shape the future of …

Processing Model For Tungsten Powders And Extention To Nanoscale Size Range, Randall M. German, J. Ma, X. Wang, E. Olevsky

Industrial and Manufacturing Engineering

Nanoscale tungsten powders promise access to very hard, strong and wear resistant materials via the press–sinter route. A small particle size changes the response during sintering, requiring lower temperatures and shorter times to attain dense but small grain size structures. On the other hand, oxide reduction and impurity evaporation favour high sintering temperatures and long hold times. Accordingly, press–sinter processing encounters conflicting constraints when applied to small particles. Presented here is an analysis of press–sinter tungsten particle processing to isolate conditions that balance the temperature and size dependent effects. The calculations are pinned by existing data. Opportunities are identified for …

The Effect Of Reflow Profile On Snpb And Snagcu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee

Industrial and Manufacturing Engineering

Purpose –The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.

Design/methodology/approach –Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three levels of peak temperature (230°C, 240°C, and 250°C for Sn3.0Ag0.5Cu; and 195°C, 205°C, and 215°C for Sn37Pb) and three levels of time above solder liquidus temperature (30, 60, and 90 s). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different …

A Simplified Model For Ploughing Forces In Turning, Daniel Waldorf

Industrial and Manufacturing Engineering

This paper aims to provide experimental data in support of a modified theoretical model for quantifying the effect of cutting tool edge geometry on machining forces. A previously published slip-line model is simplified and extended to the case of turning. Several sets of machining experiments were run with custom-fabricated cutting inserts of varying edge hone radius and chamfer geometry. Cutting forces were measured using a dynamometer during cutting. Results show that varying edge geometry can have a major effect on cutting forces. The developed model effectively captures the edge phenomenon and its effect on cutting forces and also offers a …

Optimization Of The Fuzzy Logic Controller For An Autonomous Uav, Jon C. Ervin, Sema E. Alptekin, Dianne J. Deturris

Industrial and Manufacturing Engineering

In this paper, we describe the optimization of membership functions in an application employing a hierarchical Fuzzy Logic Controller. The size of the rule base is made manageable by using a unique formulation, known as Combs method, to help control the problem of ‘exponential rule expansion’. The optimization is performed using a steady state genetic algorithm with a dynamic fitness function. The controller being developed is designed to fly a small, autonomous parafoil, suitable for short-range reconnaissance and land survey applications. The optimization process is performed in the Matlab/Simulink software environment and incorporates fuzzy logic modules developed in the Matlab …

Knowledge Representation, Organization, And Formalization For Simulation Modeling Of Discrete Manufacturing System, Jung Hung Ma

All-Inclusive List of Electronic Theses and Dissertations

Simulation is an useful tool that helps managers making decision by designing models for real systems. It helps companies to study behaviors of real systems hy analyzing computer models and improve the systems based on the experiments' results. However, cross-domain knowledge requirement and lack of tools facilitate modeling are the main reasons that make industries hesitate to use simulation to assist making decision. This research is an attempt to develop robust knowledge representations for discrete manufacturing system and conceptual simulation model. A modeling methodology was proposed to utilize these knowledge representations (KRs) for developing conceptual simulation models from application domain …

Stability Analysis For Forging Of Porous Bodies, Xuan Wang, Eugene Olevsky, Alain Molinari

Industrial and Manufacturing Engineering

The continuum theory of sintering is used for the analysis of the stability of forging of a cylindrical powder specimen. The constitutive properties of the powder material are assumed to follow a power-law creep relationship. Temperature-coupled linear non-uniform stability analyses are carried out. Stability maps are obtained for forging of copper powder components.

The Effectiveness Analysis Of The Online Tools For Engineering Faculty Needs, Ismail Fidan, Jianbiao Pan, Leijun Li

Industrial and Manufacturing Engineering

As the use of Internet is increasing dramatically, many faculty members are using it in their teaching, research, and services. The Internet also provides faculty easy access to employee benefits and other information. Many universities are using or plan to use online teaching. Lately, many editorial and funding agencies have also started to initiate online review and decision-making system. These systems have eased the burden on both reviewers and agencies. In this study, a survey was prepared and conducted to investigate the effectiveness of the online tools for faculty needs in authors’ institutions and some other United States universities. The …

Sequential Deposition Of Copper/Alumina Composites, X. Wang, J. Ma, A. Maximenko, E.A. Olevsky, M.B. Stern, B.M. Guenin

Industrial and Manufacturing Engineering

No abstract provided.

Pnl Applied To Economics, Barbara Diaz, Tomohiro Takagi, Sema E. Alptekin

Industrial and Manufacturing Engineering

This work is a continuation of Zadeh’s research on Precisiated Natural language. Precisiated Natural Language (PNL) provides a system for computation and deduction of propositions expressed in a natural language. The importance of PNL for economics is discussed. The improved process of PNL is presented using a real world example from economics.

A Case Study On Implementation Of Quality Function Deployment Into The Design Process Of A Small Job Shop, Benjamin A. Thomson

All-Inclusive List of Electronic Theses and Dissertations

The majority of research involving Quality Function Deployment (QFD) was focused on large consumer based companies and not small job shop business-to-business companies. This case study involved the implementation of QFD into the design process at Reynolds & Co., a small job shop in Terre Haute, IN. The specific objectives of the research were to find the QFD concepts that apply to the improvement of Reynolds & Co.'s (small job shop) design process. The next objective was to reduce the average design time associated with Reynolds & Co.'s design process. The final objective of this case study was to reduce …

Development Of A Statistical Model For Process Control To Eliminate Sink Marks In Injection Molded Products, Kurt Frederick Hayden

Masters Theses

Customer demands for high-quality, defect-free injection-molded products are ever increasing. In order to satisfy these quality requirements, much effort is spent monitoring and controlling variable data such as cycle time, part weight, and dimensions. Attribute defects such as sink or splay are often overlooked in the development of process control systems. However, customers reject products because of these attribute defects. Industrial control systems based upon process variables and product design variables can detect conditions that may result in the molding of products with attribute defects. The systems can then correct the process prior to the molding of these defective products. …

Machine Vision Course For Manufacturing Engineering Undergraduate Students, Jose Macedo, Kurt Colvin, Daniel Waldorf

Industrial and Manufacturing Engineering

A 10-week course was designed with funding from the Society of Manufacturing Engineers (SME) and input from industry representatives, to offer upper division engineering students a course on advanced automation. The objective was to provide engineering students theoretical and hands-on practical experience with automation technologies that will be of prime importance over the next decade: data acquisition and instrumentation, machine vision and motion control. This paper describes the machine vision portion of that class. It describes important concepts, hands-on equipment, and labs developed for this course, as well as examples of student projects from Spring Quarter, 2004. The course and …

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand for replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concerns. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI …

The Limits Of Reflexive Design In A Secrecy-Based Organization, Michael W. Stebbins, Tali Freed, A.B. (Rami) Shani, Kenneth H. Doerr

Industrial and Manufacturing Engineering

No abstract provided.

Development Of A Flying Eye: A Project-Based Learning Experience, Sema E. Alptekin, Dianne Deturris, Daniel J. Macy, Jon E. Ervin

Industrial and Manufacturing Engineering

The paper describes the design for manufacturability of a prototype product as part of a manufacturing engineering capstone course. The product chosen was a vertically launched unmanned aerial vehicle (UAV)—the “Flying Eye.” The Flying Eye is an autonomous parafoil surveillance platform quipped with sensors, controllers, mechanical components, and software. Once the autonomous UAV is deployed, it is designed to follow a predetermined flight path down to the ground. The design effort of the prototype device took place over a three-year period as a collaborative effort between the Aerospace Engineering and Industrial and Manufacturing Engineering departments at California Polytechnic State University. …

Comparison Of Sampling Methods For Flatness Evaluation Using Cmm, Ashish Singhal

All-Inclusive List of Electronic Theses and Dissertations

Efficient part feature verification using Coordinate Measuring Machine (CMM) requires efficient sample point selection as well as accurate zone fitting. This work deals with flatness tolerance evaluation and the Least- Square (LS) technique is used to compute tolerance zone. In regard to the sampling strategy there are several methods commonly employed in Coordinate Measuring Machine inspection literature. The appropriate method is selected according to the accuracy requirement, the geometry features of the work piece, and the condition of the machine producing the work piece. This research focuses on the five sampling methods: Hammersley sequence sampling, Halton-Zaremba sequence sampling, Random sampling, …

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI …

Work Flow Policy And Within-Worker And Between-Workers Variability In Performance, Kenneth Howard Doerr, Tali Freed, Terence R. Mitchell, Chester A. Schriesheim, Xiaohua Zhou

Industrial and Manufacturing Engineering

Work flow policies are shown to induce a change in average between-workers variability (worker heterogeneity) and within-worker variability in performance times. In a laboratory experiment, the authors measured the levels of worker heterogeneity and within-worker variability under an individual performance condition, a work sharing condition, and a fixed assignment condition. The work sharing policy increased the levels of worker heterogeneity and worker variability, whereas the fixed assignment policy decreased them. These effects, along with work flow policy main effects on mean performance times and variability are examined. This article represents an initial step in understanding effects that may be important …

Wire Bonding Challenges In Optoelectronics Packaging, Jianbiao Pan, Patrice Fraud

Industrial and Manufacturing Engineering

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to have deep access capability. In this paper, the wire bonding technologies are reviewed and ball bonding and wedge bonding are compared. The variables that affect the wire bonding process are then discussed. Finally, the challenges of wire bonding in optoelectronics packaging are presented in detail.

Effect Of Chromium-Gold And Titanium-Titanium Nitride-Platinum-Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications require good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr/Au and Ti/TiN/Pt/Au metallization systems. Both chromium and titanium are used to promote adhesion between substrates and sputtered gold films. Both can diffuse the gold surface after annealing and degrade the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr/Au and Ti/TiN/Pt/Au, annealing, and CAN etch processes on 25.4 times; 254 μm (1 × 10 mil) ribbon bonding. All bonds were …

Combining Systematic Layout Planning And Computer Simulation In The Design Of Manufacturing Facilities, Akintoye M. Akinyoade

All-Inclusive List of Electronic Theses and Dissertations

In this study, the systematic layout planning (SLP) and computer simulation were combined to improve the layout design of a manufacturing facility using a case study.

Critical Variables Of Solder Paste Stencil Printing For Micro-Bga And Fine-Pitch Qfp, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Stencil printing continues to be the dominant method of solder deposition in high-volume surface-mount assembly. Control of the amount of solder paste deposited is critical in the case of fine-pitch and ultrafine-pitch surface-mount assembly. The process is still not well understood as indicated by the fact that industry reports 52-71% surface-mount technology (SMT) defects are related to the solder paste stencil printing process. The purpose of this paper is to identify the critical variables that influence the volume, area, and height of solder paste deposited. An experiment was conducted to investigate the effects of relevant process parameters on the amount …

A Supply Chain Management Tool For Linking Courses In Manufacturing Engineering , Daniel Waldorf, Sema E. Alptekin

Industrial and Manufacturing Engineering

A Recent Society of Manufacturing Engineers (SME) grant received by Manufacturing Engineering Program at Cal Poly has provided funds to strengthen its curricular focus on supply chain management, flexibility, business skills, quality, and process controls. New courses and laboratories are developed in electronics manufacturing, information technology, and supply chain management. A functioning supply chain environment has been developed to provide vertical integration among several courses. A software tool being developed in-house integrates the activities of the students who play the roles of customers and suppliers. Details of the various components of this comprehensive project are presented in this paper.

Why Toyota And Honda Topped The 2002 J.D. Power Quality Study, Susan Lightle, Kenneth Yale Rosenzweig, John Talbott

Accounting Faculty Publications

Toyota again topped the annual J. D. Power and Associates quality study released in late May of 2002. Toyota scored the highest mark ever with l 07 defects per l 00 vehicles, while Honda came in second with 113 defects. The study was based on responses of approximately 65,000 new car owners queried during their first 90-days of ownership.

These results do not surprise us, as we have been fortunate to make numerous sojourns to the Toyota plant in Georgetown, Kentucky, and observe the manufacturing processes. These trips were normally facilitated by a former Japanese student of ours, Minako Yanke, …