Operations Research, Systems Engineering and Industrial Engineering Commons^™

Hazard Identification, Risk Assessment And Risk Control (Hirarc) In A Steel Foundry., Lee Hooi Nee

Student Works (2010-2019)

Abstract NA

Drop Impact Reliability Of Edge-Bonded Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board. The test boards were subjected to drop tests at several impact pulses, including a peak acceleration of 900 Gs with a pulse duration of 0.7 ms, a peak acceleration of 1500 Gs with a pulse duration of 0.5 ms, and a peak acceleration of 2900 Gs with a pulse duration of 0.3 ms. A high-speed dynamic resistance measurement system was used to monitor the failure of the solder joints. Two edge-bond materials used in …

Teaming Multi-Level Classes On Industry Projects, Lizabeth Schlemer, Jose Macedo

Industrial and Manufacturing Engineering

For the past few years we experimented with teaming students from a sophomore-level class and a senior-level class to work on industry projects. The classes are “work design” and “facilities design.” Projects are selected to require the application of knowledge from both disciplines. In addition, the projects are selected from small local companies. The intent of this paper is to describe the benefits and difficulties associated with this methodology. While specific classes in this experience are typical of an industrial engineering curriculum, the lessons learned and benefits could translate to other disciplines.

Optimization Of Engineering Tolerance Design Using Revised Loss Functions, Jeh-Nan Pan, Jianbiao Pan

Industrial and Manufacturing Engineering

Engineering tolerance design plays an important role in modern manufacturing. Both symmetric and asymmetric tolerances are common in many manufacturing processes. Recently, various revised loss functions have been proposed for overcoming the drawbacks of Taguchi's loss function. In this article, Kapur's economic tolerance design model is modified and the economic specification limits for both symmetric and asymmetric losses are established. Three different loss functions are compared in the optimal symmetric and asymmetric tolerance design: a revised Taguchi quadratic loss function, an inverted normal loss function and a revised inverted normal loss function. The relationships among the three loss functions and …

Finding And Optimising The Key Factors For The Multiple-Response Manufacturing Process, Jeh-Nan Pan, Jianbiao Pan, Chun-Yi Lee

Industrial and Manufacturing Engineering

With the advent of modern technology, manufacturing processes became so sophisticated that a single quality characteristic cannot reflect the true product quality. Thus, it is essential to perform the key factor analysis for the manufacturing process with multiple-input (factors) and multiple-output (responses). In this paper, an integrated approach of using the desirability function in conjunction with the Mahalanobis-Taguchi-Gram Schmit (MTGS) system is proposed in order to find and optimise the key factors for a multiple-response manufacturing process. The aim of using the MTGS method is to standardise and orthogonalise the multiple responses so that the Mahalanobis distance for each run …

Effects Of Reflow Profile And Thermal Conditioning On Intermetallic Compound Thickness For Snagcu Soldered Joints, Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno

Industrial and Manufacturing Engineering

Purpose – The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Design/methodology/approach – A four-factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding to pads over an organic substrate with gold metallizations. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequencies of 60 KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through the design of experimental methodology for four different cases: 25.4 mm wire at 60 kHz, 25.4 mm wire at 120 kHz, 17.8 mm wire at 60 kHz, …

Analysis Of Possible Use Of Identification Technologies In Disassembly, Vukica Jovanović, Sreten Filipović, Gordana Ostojić, Stevan Stankovski, Milovan Lazarević

Engineering Technology Faculty Publications

The barcodes and Radio Frequency Identification tags that are being used during manufacturing, assembly, warehousing, and distribution could also be reused at the end of the product lifecycle for an identification of the correct disassembly process that would result in recycling of its components. The barcodes or RFID tags can be helpful in identifying objects in terms of sustainable development, regarding disassembly, recycling and reuse. In this paper, the analysis of the current applications of RFID Technology in the final phase of the product lifecycle will be presented. The simulation of the disassembly process supported by both barcode and RFID-enabled …

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The integrity of wire bonds …

Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan

Industrial and Manufacturing Engineering

This paper presents the failure analysis results of board level drop tests. In this study, the test vehicle was designed according to the requirements of the Joint Electron Device Engineering Council (JEDEC) drop test board. The test vehicle was assembled with 15 chip scale packages (CSPs) each having 228 daisy-chained 0.5 mm pitch solder joints using Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) lead free solder. Assemblies were drop tested using three different peak accelerations of 900 G, 1500 G, 2900 G, with 0.7 ms, 0.5 ms, and 0.3 ms pulse durations, respectively. Scanning electron microscopy (SEM) with energy dispersive spectroscopy …

Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught in isolation followed by a single culminating senior design or capstone project experience. In the senior design class students being to synthesize the knowledge and skills that they acquired through the engineering curriculum. This paper presents lower and upper division course and curricular changes made to accommodate learning objectives that better prepare students for project-based learning. These learning experiences and skills include: systems level design, experience with state-of-the-art Computer Aided Design (CAD) tools, printed circuit board (PBC) design, design for manufacturability, electronics assembly, project management, …

Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan

Industrial and Manufacturing Engineering

This study examines the performance of a new class of wear-resistant but economical cutting tools produced by varying the binder composition of standard cemented carbide composites. By replacing some or all of the cobalt binder with rhenium and nickel-based superalloy, a stronger composite tool results, potentially capable of machining heat-resistant superalloys at significantly higher cutting speeds. Sample tools with alternative binder were produced and compared to standard tools bound with cobalt only. Turning experiments on Inconel 718 were run to evaluate wear resistance and tool life for several grades. The experimentation also examined the effects of varying the relative proportions …

A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello

Industrial and Manufacturing Engineering

This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of this course is to provide lower-division engineering students a hands-on experience involving actual printed circuit board (PCB) design, layout, fabrication, assembly, and testing. Through project-based learning, students not only learn technical skills in designing and manufacturing an electronic device, but also develop their project management and communication skills early in their course of study at the university. The course outline and examples of the student projects are presented in this paper as well as project evaluations and students’ feedback. This paper also presents the selection …

Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

Undergraduate computer and electrical engineering programs often partition the curriculum into several courses based on related topics taught in isolation. Students are expected to synthesize their knowledge in a senior design project. It is the authors’ experience that students often struggle during their senior design project since they have not gained the appropriate knowledge or mastered necessary skills needed to work on a significant or team-based engineering design project. Specifically, students need to be able to define system requirements, partition the design into subcomponents, design, build, test, and verify that the system requirements have been met. The authors have enhanced …

Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat

Industrial and Manufacturing Engineering

The Cal Poly/Allan Hancock team is developing a learning module that will allow all lower division engineering students to design, fabricate, assemble, and test an electronic system implemented on a printed circuit board (PCB). All the services necessary to perform this laboratory experiment will be provided with low-cost vendors available on the . The learning module is being developed so that it can be integrated into the existing electrical engineering lower division courses that are required by all engineering students. The laboratory learning module will use operational amplifiers (op amp), resistors, capacitors and other common electronic components to study the …

Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin

Industrial and Manufacturing Engineering

In this paper, we describe various techniques used to make Intuitionistic Fuzzy Logic Systems amenable to operating on applications with large numbers of inputs. A rule reduction technique known as Combs method is combined with an automated tuning process based on Particle Swarm Optimization. A second stage of tuning on rule weights results in improved performance and further reduction in the size of the rule-base. The entire process has been developed to operate within the Matlab software environment. The technique is tested against the Wisconsin Breast Cancer Database. The use of these tools shows great promise in significantly expanding the …

Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a peak acceleration of 2900 G …

The Effects Of Build Orientation, Diameter And Printhead Life On The Cylindricity Of Three-Dimensionally Printed Parts, Troy E. Ollison

All-Inclusive List of Electronic Theses and Dissertations

Rapid prototyping (RP) technologies have become more than just a fast and inexpensive way to produce prototypes. Today RP is widely used to produce functional prototypes, end-use parts and tooling as well as visual prototypes. When RP is used for end-use parts with interconnected moving assemblies or for producing metal casting molds which must have sufficient material for machining tolerances, accuracy is very critical. However, in general, accuracy of the finished RP parts is relatively low lll compared to parts produced by traditional manufacturing processes. The understanding of why some of these accuracy differences exist is either unknown or not …

Designing And Manufacturing Microelectronic Packages For High-Power Light-Emitting Diodes, Brian Wright, Jianbiao Pan, Richard Savage

Industrial and Manufacturing Engineering

A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was to build a package that enables the LED to operate with currents as high as 2 Amps. An innovative thin-film interface has been developed to electrically connect the cathode of the LED die to a 22AWG Cu wire. This thin-film interface is wirebondable and solderable, and consists of three layers: Au, Ni93/V7, and Si. Four 1 mil Au wirebonds, supporting 2A of maximum current, connect the Au thin-film to the LED die cathode. Sn96Ag4 solder is used for connecting the Ni93/V7 thin-film to the 22AWG …

In-House Development Of Scheduling Decision Support Systems: Case Study For Scheduling Semiconductor Device Test Operations, Tali Freed, K. H. Doerr, T. Chang

Industrial and Manufacturing Engineering

Most manufacturing processes can benefit from an automated scheduling system. However;: the design of a fast, computerised scheduling system that achieves high-quality results and requires minimal resources is a difficult undertaking. Efficient .. scheduling of a semiconductor device test facility requires an information system that provides good schedules quickly. Semiconductor device testing-is the last stage of the long semiconductor manufacturing process, and therefore. is subjected to customer service pressures. The cost of an off-the-shelf computerised scheduling system may he prohibitive for many companies. In addition, many companies are taken aback by other characteristics of off-the-shelf scheduling systems, such as code …

Fabrication Of Functionally Graded 3a/5a Zeolites By Electrophoretic Deposition, X. Wang, E. A. Olevsky, E. Bruce, M. B. Stern, D. T. Hayhurst

Industrial and Manufacturing Engineering

Functionally graded zeolites of molecular sieve type 3A and 5A are deposited by electrophoretic deposition (EPD) from acetone suspension with 8% volume concentration of n-butylamine as particle charging agent. The EPD characteristics of both 3A and 5A suspensions are studied. Functionally graded zeolite 3A/5A deposits are obtained at 200 V DC. Energy dispersive X-ray dispersion (EDX) analysis results confirm the graded structure. The deposited zeolites are also analysed by scanning electron microscopy (SEM). The factors influencing the deposition process are discussed.

The Benefits Of Automatic Data Collection In The Fresh Produce Supply Chain, Ryan Charles Panos, Tali Freed

Industrial and Manufacturing Engineering

The potential for RFID based systems to improve the safety and efficiency of a supply chain with rapidly decaying products and strict health standards is creating pressure to adopt RFID in several agricultural industries. A handful of fresh produce industry leaders currently participate in mandated pilot projects, while the industry as a whole is still intimidated by the perceived cost of RFID. Therefore in this study we attempt to validate the correlation between performance and automated data collection, paving the way to economic justification of investment in data collection technologies, such as barcode and RFID.

The majority of product in …

Case Studies On Usage Of Axiomatic Design Methodology In The U.S. Industries, Alireza Alavizadeh

All-Inclusive List of Electronic Theses and Dissertations

Axiomatic Design, originally developed by Nam Suh, is a design methodology that attempts to systematize the design practices and to provide a basis on which design can be carried out and optimized according to two main axioms, namely, Independence and Information axioms. Although various scholars in both academia and industry have studied the applicability and effectiveness of this methodology, the extent to which Axiomatic Design has been implemented in industry, particularly in the U.S., is unknown. l1l This study was conducted to identify the extent to which Axiomatic Design is known to the U.S. industries. Other purposes of this study …

Leanness And Agility In Job Shops: A Framework For A Survey Instrument Developed Using The Delphi Method, Zaki Kuruppalil

All-Inclusive List of Electronic Theses and Dissertations

Manufacturers are facing new challenges as competition has become global. Manufacturing companies arc looking for strategies which would help them gain an edge over their competitors. In the United States, lean manufacturing and agile manufacturing have been gaining importance among industries. Agile manufacturing was developed when the United States Department of Defense (DOD) requested Iacocca Institute at Lehigh University to develop a manufacturing framework that could give US companies an edge over their worldwide competitors whereas lean manufacturing has its roots tied to the Toyota Production System (TPS). This raises the questions: what is the clear difference between the two …

Fabrication Of Net-Shape Functionally Graded Composites By Electrophoretic Deposition And Sintering: Modeling And Experimentation, E.A. Olevsky, X. Wang, A. Maximenko, M.A. Meyers

Industrial and Manufacturing Engineering

It is shown that electrophoretic deposition (EPD) sintering is a technological sequence that is capable of producing net-shape bulk functionally graded materials (FGM). By controlling the shape of the deposition electrode, components of complex shapes can be obtained. To enable sintering net-shape capabilities, a novel optimization algorithm and procedure for the fabrication of net-shape functionally graded composites by EPD and sintering has been developed. The initial shape of the green specimen produced by EPD is designed in such a way that the required final shape is achieved after sintering-imposed distortions. The optimization is based on a special innovative iteration procedure …

An Experimental Evaluation Of Performance Variance For Internally Threaded Geometry Related To Extended Tap Wear In Low Carbon Steel, Todd E. Alberts

All-Inclusive List of Electronic Theses and Dissertations

The development of internal threads in a manufactured part is in many cases one of the final operations in the production workflow. Quality issues in thread form development can destroy a part that has previously undergone expensive machining. The issue of tap wear is one of the multi-faceted elements that have a direct correlation on the quality of threaded components. The purpose of this research centers on resultant mechanical pull performance for the stripping of internally threaded geometry in low carbon steel as measured over various increments of the tap cutting life cycle.

Investigation Of The Lead-Free Solder Joint Shear Performance, James Webster, Jianbiao Pan, Brian J. Toleno

Industrial and Manufacturing Engineering

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC …

Synthesis Of Gold Micro- And Nano-Wires By Infiltration And Thermolysis, E.A. Olevsky, X. Wang, E. Bruce, M.B. Stern, S. Wildhack, F. Aldinger

Industrial and Manufacturing Engineering

An approach for synthesizing micro- and nano-sized gold wires by infiltration and thermolysis is investigated. A porous ZrO₂ ceramic preform with aligned pores obtained by unidirectional freezing and freeze-drying is employed as an infiltration template. The sintered porous ZrO₂ preform is then infiltrated by a brushing gold solution. The thermolysis is conducted at 600 °C in air. Micro- and nano-sized gold wires are developed within the walls of the pores after thermolysis. The diameter of the gold wires ranges from several hundred nanometers to several microns.

Backward And Forward Compatibility, Jianbiao Pan, Jasbir Bath, Xiang Zhou, Dennis Willie

Industrial and Manufacturing Engineering

In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’ impending lead-free directives, the electronics industry is moving toward lead-free soldering. Total lead-free soldering requires not only lead-free solder paste but also lead-free printed circuit board (PCB) finish and lead-free component/packages. Transitioning tin-lead (SnPb) soldering to totally lead-free soldering is a complex issue and involves movement of the whole electronics industry supply chain. In reality, there is a transition period.