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- Electrodeposition (6)
- Lithium-ion batteries (5)
- Oxygen evolution reaction (5)
- Additive (4)
- Electrocatalysis (4)
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- Water splitting (4)
- Additives (3)
- Electrochemical behavior (3)
- Hydrogen evolution (3)
- Hydrogen evolution reaction (3)
- Oxygen reduction reaction (3)
- Ammonium persulfate (2)
- Ammonium sulfate (2)
- Benzotriazole (2)
- Cobalt interconnects (2)
- Electrocatalyst (2)
- Electrochemical deposition (2)
- Electrochemical reduction (2)
- Electrolysis (2)
- Electronic structure (2)
- High energy density (2)
- Initial coulombic efficiency (2)
- Leveler (2)
- Lithium-sulfur battery (2)
- Machine learning (2)
- Nitrogen reduction (2)
- Numerical simulation (2)
- Oxygen evolution (2)
- Water electrolysis (2)
- 2.5-dimension interposer (1)
Articles 31 - 60 of 91
Full-Text Articles in Chemistry
Electrochemical Deposition Of Copper Pillar Bumps With High Uniformity, Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo
Electrochemical Deposition Of Copper Pillar Bumps With High Uniformity, Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo
Journal of Electrochemistry
Electrochemical deposition of copper pillar bumps (CPBs) is one of the key technologies for the advanced packaging. In this study, the effects of the additive concentration, the electrolyte convection, the current density, and the electroplating system on the uniformity of the CPBs have been systematically investigated. The results showed that the profiles of the CPBs were mainly determined by the additive concentration, the bath convection and the current density, while the heights of the CPBs were mainly affected by the electroplating system. For the CPBs profiles, it was found that the low leveler concentration and high current density would generally …
Research Progress Of Copper Electrodeposition Filling Mechanism In Silicon Vias, Yun-Na Sun, Yong-Jin Wu, Dong-Dong Xie, Han Cai, Yan Wang, Gui-Fu Ding
Research Progress Of Copper Electrodeposition Filling Mechanism In Silicon Vias, Yun-Na Sun, Yong-Jin Wu, Dong-Dong Xie, Han Cai, Yan Wang, Gui-Fu Ding
Journal of Electrochemistry
Aiming at the electroplating filling problem of deep via TSV (through silicon via) interconnection, the multi-compatible integrated manufacturing technology team at the Shanghai Jiao Tong University has completed the numerical solution of the equations and realized the numerical simulation of TSV filling mode by applying the finite element method with arbitrary Lagrange Euler algorithm. The filling mechanisms of blind vias, the butterfly filling form for the through vias and the simultaneous filling mode of vias with different aspect ratios are analyzed by simulation, contributing to the parameter optimization and sample manufacturing. The effects of electroplating current density and heat treatment …
Research Progress In Electroless Cobalt Plating And The Bottom-Up Filling Of Electroless Plating, Yu Shen, Bing-Bing Li, Yi Ma, Zeng-Lin Wang
Research Progress In Electroless Cobalt Plating And The Bottom-Up Filling Of Electroless Plating, Yu Shen, Bing-Bing Li, Yi Ma, Zeng-Lin Wang
Journal of Electrochemistry
With the continuous improvement of semiconductor integration, the resistivity of copper interconnect lines increases rapidly. When the width of the interconnect line is close to 7 nm, the resistivity of copper becomes the same as that of cobalt. International Business Machines Corporation (IBM) and Advanced Semiconductor Incorporation (ASI) have used cobalt to replace copper as a next-generation interconnect material. However, the fabrication of the cobalt seed layer and the super filling of electroplating cobalt for the 7 nm via-holes have been still the large challenge. Electroless plating is a very simple method to form a seed layer on the surface …
Electrodeposition Mechanism And Process Of A Novel Cyanide-Free Gold Sulfite Bath, Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian
Electrodeposition Mechanism And Process Of A Novel Cyanide-Free Gold Sulfite Bath, Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian
Journal of Electrochemistry
A novel cyanide-free gold sulfite process is introduced in this paper. In the bath, chloauric acid was directly employed as the main salt, and hydroxyethylidene diphosphonic acid (HEDP) was used as the stabilizer and coating grain refiner. The bath stability, the gold coating morphology and the mechanism of gold electrodeposition were studied in detail. The results showed that HEDP could significantly improve the bath stability. Moreover, the grains of the gold coating obtained from the gold sulfite bath without HEDP was rod-like, which grew gradually with the increasing of the deposition time, resulting in that the appearance of the coating …
Preface To Special Issue On Electronic Electroplating, Zhi-Dong Chen, Chong Wang, Wei He, Ming Li
Preface To Special Issue On Electronic Electroplating, Zhi-Dong Chen, Chong Wang, Wei He, Ming Li
Journal of Electrochemistry
No abstract provided.
Mechanism And Application Of Nickel Nano-Cone By Electrodeposition On A Flexible Substrate, Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, Yong-Jie Du
Mechanism And Application Of Nickel Nano-Cone By Electrodeposition On A Flexible Substrate, Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, Yong-Jie Du
Journal of Electrochemistry
Nano-array structure possesses promising prospect in power supply, optical device and electronic manufacturing. In this paper, a black nickel nano-cone array was prepared on a flexible substrate by galvanostatic deposition and the corresponding factors involved in the fabrication of nickel nano-cone array was explored. Experimental results showed that a large current density and low main salt concentration were not favored to the formation of cone nickel structure. It was also found that ammonium chloride, as the crystal modifier, was crucial to deposit the uniform nano-cone array. In addition, the growth mechanism of nickel nano-cone was further studied by molecular dynamics …
Effect Of Corrosion Inhibitors On Copper Etching To Form Thick Copper Line Of Pcb In Acidic Etching Solution, Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, Yuan-Ming Chen
Effect Of Corrosion Inhibitors On Copper Etching To Form Thick Copper Line Of Pcb In Acidic Etching Solution, Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, Yuan-Ming Chen
Journal of Electrochemistry
The chemical compounds of 2-mercaptobenzothiazole (2-MBT), benzotriazole (BTA) and phenoxyethanol (MSDS) as corrosion inhibitors were used to inhibit the copper etching to form the thick copper line of PCB in the acidic etching solution. The inhibition status was characterized with contact angle measurement, electrochemical test and etch factor calculation, while the corrosion morphology of copper surface was studied by scanning electron microscope. The adsorption mechanism of corrosion inhibitors on copper surface is analyzed by molecular dynamics and quantum chemistry calculations. The results indicated that the synergistic function of the two inhibitors could effectively promote their adsorption on the copper surface …
Investigation Of Through-Hole Copper Electroplating With Methyl Orange As A Special Leveler, Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen
Investigation Of Through-Hole Copper Electroplating With Methyl Orange As A Special Leveler, Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen
Journal of Electrochemistry
Methyl Orange (MO) with two kinds of functional groups can act as both an accelerator and an inhibitor, which has been used as a special leveler to simplify the electroplating additive system in the through-hole (TH) copper electroplating experiments. In this work, the role of MO in TH electroplating is characterized by molecular dynamics simulations and quantum chemical calculations. It is suggested that MO can spontaneously flatten the copper surface and be well adsorbed on the cathode surface, which inhibit the copper electrodeposition on the cathode. Electrochemical behavior of MO was evaluated by galvanostatic measurements (GM) and cyclic voltammetry (CV) …
Study On Weak Alkaline Cyanide-Free Silver Plating Process For Etching Lead Frame, Jian-Wei Zhao, Hai-Feng Zhu, Xiao-Hui Yu, Gui-Yun Yuan, Zhi Sun
Study On Weak Alkaline Cyanide-Free Silver Plating Process For Etching Lead Frame, Jian-Wei Zhao, Hai-Feng Zhu, Xiao-Hui Yu, Gui-Yun Yuan, Zhi Sun
Journal of Electrochemistry
As a new development direction of integrated circuit chip carrier, etched lead frame has been gradually applied in microelectronics industry in recent years. Since the preparation of the etched lead frame requires the use of multiple layers of non-alkali-resistant photoresist films with specific patterns, and the traditional cyanide silver plating is unable to meet this requirement, making that the development of weakly alkaline cyanide free silver plating process has great significance. In this paper, a weak alkaline silver plating process based on 5,5-dimethylhydantoin (DMH) cyanide-free silver plating system was studied. The electrodeposition behavior of the system and the nucleation mechanism …
Introduction Of Development And Application Technology Of Organic Additives For Acid Copper Electroplating, Hao-Bin Zou, Chao-Li Tan, Wei Xiong, Dao-Lin Xi, Bin-Yun Liu
Introduction Of Development And Application Technology Of Organic Additives For Acid Copper Electroplating, Hao-Bin Zou, Chao-Li Tan, Wei Xiong, Dao-Lin Xi, Bin-Yun Liu
Journal of Electrochemistry
Acid copper electroplating is one of the key technologies in buildup multilayer PCB (BUM-PCB) manufacture process and the most important technique to achieve electrical interconnection between any layer and high-density interconnection in a substrate. This article introduces the research focus of organic additives used in acid copper electroplating, and developing different kinds of micro-via filling copper electroplating technique applied in various scenarios, and some other technical problems from applications. First of all, according to the chronopotentiometric (CP) experiment results, the levelers with different polymeric molecular structures exhibited various responses of cupric deposition potential along with their increased concentrations, which is …
Influences Of Suppressing Additive Malachite Green On Superconformal Cobalt Filling And Nucleation, Xiao-Chuan Ma, Ya-Qiang Li, Pei-Xia Yang, Jin-Qiu Zhang, Mao-Zhong An
Influences Of Suppressing Additive Malachite Green On Superconformal Cobalt Filling And Nucleation, Xiao-Chuan Ma, Ya-Qiang Li, Pei-Xia Yang, Jin-Qiu Zhang, Mao-Zhong An
Journal of Electrochemistry
As the semiconductor integrated circuits evolve into 7 nm technology and beyond, the resistance of the Cu filling at back-end-of-line interconnects no longer linearly scales with dimension. The metal Co with lower mean free path can be used to replace Cu for reducing the line resistance caused by the scattering on the outer surface and grain boundary in the smaller and smaller size. In this study, CoSO4 was used as the main salt, boric acid as a buffer and malachite green (MG) as an inhibitor for further research. According to the electrochemical cyclic voltammetric (CV) curves by using a …
Application Of Numerical Simulation Method In Periodic Pulse Reverse Electroplating Through Hole, Yuan-Hang Zhang, Mao-Zhong An, Pei-Xia Yang, Jin-Qiu Zhang
Application Of Numerical Simulation Method In Periodic Pulse Reverse Electroplating Through Hole, Yuan-Hang Zhang, Mao-Zhong An, Pei-Xia Yang, Jin-Qiu Zhang
Journal of Electrochemistry
The upgrade of the fifth generation (5G) communication technology increases the number of communication backplane layers and the aspect ratio of through holes on the board, making it more difficult to use traditional direct current deposition for interconnection. Direct current electrodeposition is more prone to uneven coating in the hole, resulting in poor contact between the coating and components, and open circuit. This has a serious impact on the stability of printed circuit board. The periodic pulse reverse plating method can significantly improve the uniformity of high aspect ratio through-hole plating and improve the production quality of through-hole plating through …
Optimization Of Pulse Plating Additives And Plating Parameters For High Aspect Ratio Through Holes, Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, Zeng-Kun Wu
Optimization Of Pulse Plating Additives And Plating Parameters For High Aspect Ratio Through Holes, Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, Zeng-Kun Wu
Journal of Electrochemistry
As an important component in electronic products, printed circuit board (PCB) plays a supporting and interconnecting role for the electronic components in it. With the development of communication technology, electronic products are developing in the direction of “thin, light and small”, and high density interconnection (HDI) comes into being. Due to the high-density interconnection characteristics of HDI boards, the thickness of the board is increasing. At the same time, in order to reserve space for the laying of fine lines on the subsequent board surface, the diameter of the through holes on the board is also decreasing, so the depth-diameter …
Microstructure Of Electrodeposited Copper Foil: Discussion On The Mechanism Model Of Three-Dimensional Electrocrystallization, Ren-Zhi Liu, Ping-Ling Xie, Chong Wang
Microstructure Of Electrodeposited Copper Foil: Discussion On The Mechanism Model Of Three-Dimensional Electrocrystallization, Ren-Zhi Liu, Ping-Ling Xie, Chong Wang
Journal of Electrochemistry
The manufacturing of electrolytic copper foil has attracted more and more attention with the extensive applications of printed circuit board and lithium battery. The industrial scale is still extending. Compared with the developments of electroplating equipment and electroplating process, there is limited research on the mechanism of electrodeposition. This paper summarizes the manufacturing process of electrodeposited copper foil and analyzes the differences of various electroplating parameters in different electrodeposited copper technologies, and points out the important role of electrodeposition current density in the formation of copper foil. By showing and comparing the microstructures of different electrodeposited copper foils, the influences …
An Investigation On The Interface Corrosion Behaviors Of Cobalt Interconnects In Chemical Mechanical Polishing Slurry, Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, Tao Hang
An Investigation On The Interface Corrosion Behaviors Of Cobalt Interconnects In Chemical Mechanical Polishing Slurry, Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, Tao Hang
Journal of Electrochemistry
Cobalt is widely regarded as the most promising interconnect material for 10 nm node and beyond. The development of a chemical mechanical planarization (CMP) slurry suitable for cobalt interconnect is a critical component for the application of cobalt interconnect. During CMP process of the interconnect layer, the achievement of high-quality surface after planarization is greatly challenged by the metal corrosion in CMP slurry. In this contribution, the corrosion behavior of cobalt in a slurry with potassium persulfate (KPS) as an oxidizer, glycine as a complexing agent, and benzotriazole (BTA) as an inhibitor was investigated. Static erosion rates (SER) of cobalt …
Development Status Of Copper Electroplating Filling Technology In Through Glass Via For 3d Interconnections, Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li
Development Status Of Copper Electroplating Filling Technology In Through Glass Via For 3d Interconnections, Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li
Journal of Electrochemistry
With the slow development of Moore's Law, the high density and miniaturization of microelectronic devices put forward higher requirements for advanced packaging technology. As a key technology in 2.5D/3D packaging, interposer technology has been extensively studied. According to different interposer materials, it is mainly divided into organic interposer, silicon interposer and glass interposer. Compared with the through silicon via (TSV) interconnection, the through glass via (TGV) interposer has received extensive attention in the 2.5D/3D advanced packaging field for its advantages of excellent high-frequency electrical characteristics, simple process, low cost, and adjustable coefficient of thermal expansion (CTE). However, the thermal conductivity …
Study On Low Voltage Electrodeposition Of Diamond-Like Carbon Film, Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, Zhi-Dong Chen
Study On Low Voltage Electrodeposition Of Diamond-Like Carbon Film, Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, Zhi-Dong Chen
Journal of Electrochemistry
Diamond-like carbon (DLC) films are receiving a lot of attention from the scientific community, thanks to the promise of DLC films for applications in microelectronics and optoelectronics. Usually, electrodeposition is the preferred common technique because of low cost, large deposition area and simplicity of the setup. However, when carbon films are electrodeposited on a stainless steel, high cell voltages (≥1000 V) are required owing to the low electric conductivity of the organic solvents. This work has developed a new electrolyte system that could achieve carbon deposition on a stainless steel under a low applied cell voltage. The DLC films were …
Research Progresses Of Cobalt Interconnect And Superfilling By Electroplating In Chips, Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, Su Wang
Research Progresses Of Cobalt Interconnect And Superfilling By Electroplating In Chips, Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, Su Wang
Journal of Electrochemistry
Copper interconnect using dual damascene technology has always been the main means for metallization in the back end of line process. However, with the size effect becoming more and more obvious due to feature size reduction, copper interconnect can no longer meet the demand for high circuit speed in Post-Moore era. Following copper interconnection, cobalt interconnection in chips attracts much attention as an interconnect technology by the next generation, which has been introduced in 7 nm node of integrated circuit manufacturing and below. The electron mean free path of cobalt (~10 nm) is much shorter than copper’s (39 nm), thus …
Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder, Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu
Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder, Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu
Journal of Electrochemistry
Sn-Ag-Cu ternary alloy is the most ideal substitute for Sn-Pb alloy at present, and can be prepared by electrodeposition with high production efficiency, simple equipment, easy maintenance and excellent coating performance. The coordination system of the electroplating solution was investigated through the Hull cell experiment. The type of brighteners used in the plating solution and the ratio of the two brighteners were determined through the microscopic morphologic characterization, electrochemical corrosion test and cathodic polarization curve test. In addition, the dispersant and stabilizer were studied by observing the microscopic morphology and measuring the concentration change of Sn2+ ions in the plating …
Electrochemical Sers Study Of Benzotriazole And 3-Mercapto-1-Propanesulfonate In Acidic Solution On Copper Electrode, Yin-Fei Shen, Yan-Li Chen, Sheng-Xu Wang, Ye Zhu, Wen-Chang Wang, Min-Xian Wu, Zhi-Dong Chen
Electrochemical Sers Study Of Benzotriazole And 3-Mercapto-1-Propanesulfonate In Acidic Solution On Copper Electrode, Yin-Fei Shen, Yan-Li Chen, Sheng-Xu Wang, Ye Zhu, Wen-Chang Wang, Min-Xian Wu, Zhi-Dong Chen
Journal of Electrochemistry
Since the development of acid copper plating technology, the role of additives is indispensable. In addition to the main salt copper sulfate and supporting electrolyte sulfuric acid, suppressors, accelerators, levelers and chlorine ions (Cl-) are also required to be added into the plating solution. Appropriate additive system can have a significant impact on the coating or the plating solution, which can help improve the quality of the coating and increase the brightness of the coating. Through electrochemical measurement, vibrational spectroscopy, scanning probe microscopy, molecular dynamics simulation and other methods, researches have a deeper understanding in the adsorption configuration …
Effect Of Sodium Alcohol Thiyl Propane Sulfonate On Electrolysis Of High Performance Copper Foil For Lithium Ion Batteries, Sen Yang, Wen-Chang Wang, Ran Zhang, Shui-Ping Qin, Min-Xian Wu, Naotoshi Mitsuzaki, Zhi-Dong Chen
Effect Of Sodium Alcohol Thiyl Propane Sulfonate On Electrolysis Of High Performance Copper Foil For Lithium Ion Batteries, Sen Yang, Wen-Chang Wang, Ran Zhang, Shui-Ping Qin, Min-Xian Wu, Naotoshi Mitsuzaki, Zhi-Dong Chen
Journal of Electrochemistry
Electrolytic copper foils have been widely used in printed circuit boards and lithium-ion batteries due to their simple production process and high economic value. In the process of electrolysis foil making, additives can greatly improve the performance of electrolytic copper foils. In this work, the copper foils were prepared in a self-designed plate electrodeposition device of which the operating principles were in accordance with those of actual industrial production. A series of the Virgin Make-up Solution (VMS: 312.5 g·L-1 CuSO4·5H2O, 100 g·L-1 H2SO4, 50 mg·L-1 Cl-) containing different additives was investigated to …
Simultaneous Hydrogen And (Nh4)2So4 Productions From Desulfurization Wastewater Electrolysis Using Mea Electrolyser, Ju-Cai Wei, Lin Shi, Xu Wu
Simultaneous Hydrogen And (Nh4)2So4 Productions From Desulfurization Wastewater Electrolysis Using Mea Electrolyser, Ju-Cai Wei, Lin Shi, Xu Wu
Journal of Electrochemistry
It is preferred to simultaneously recover resource and energy from waster. Sulfur dioxide, SO2, a common air pollutant, a potential energy resource, is a key link to sulfur nature circulation. SO2 can be conversed to NH4HSO3 and (NH4)2SO3 during the ammonia desulfurization process, which can be used to produce (NH4)2SO4 fertilizer. For high quality (NH4)2SO4 fertilizer and high heat transfer efficiency of the evaporative crystallization, HSO3- or SO32- needs to be oxidized to form SO …
Preparation And Properties Of Gcp-Supported Palladium Particles Composite Towards Electrochemical Ammonia Synthesis, Ying-Chao Wang, Zi-Zai Ma, Yi-Fan Wu, Xiao-Guang Wang
Preparation And Properties Of Gcp-Supported Palladium Particles Composite Towards Electrochemical Ammonia Synthesis, Ying-Chao Wang, Zi-Zai Ma, Yi-Fan Wu, Xiao-Guang Wang
Journal of Electrochemistry
Ammonia (NH3) plays an essential role in agriculture and modern industries. Electrochemical fixation of nitrogen (N2) to ammonia (NRR) under ambient conditions with renewable electricity is a promising strategy to replace the industrial Haber-Bosch method. However, it usually suffers from extremely poor ammonia yield and low Faraday efficiency due to the poor electrocatalysts. Therefore, intensive studies have been devoted to developing efficient NRR catalysts till now. Among them, palladium (Pd) can capture protons in the aqueous phase to form stable α-PdH, which balances the competitive adsorption between nitrogen and protons as well as reduces the …
Study And Improvement On Expansion Property Of Silicon Oxide, Wei-Chuan Qiao, Fang-Ru Li, Jin-Lin Xiao, Li-Juan Qu, Xiao Zhao, Meng Zhang, Chun-Lei Pang, Zi-Kun Li, Jian-Guo Ren, Xue-Qin He
Study And Improvement On Expansion Property Of Silicon Oxide, Wei-Chuan Qiao, Fang-Ru Li, Jin-Lin Xiao, Li-Juan Qu, Xiao Zhao, Meng Zhang, Chun-Lei Pang, Zi-Kun Li, Jian-Guo Ren, Xue-Qin He
Journal of Electrochemistry
The silicon-based anode materials have the potential to meet the ever-increasing demand for energy density in lithium-ion batteries market owing to their high theoretical specific capacity. Unfortunately, their commercialization was hindered by the continuous volume expansion. Herein, the expansion characteristics and corresponding mechanism of the silicon oxide and graphite-silicon oxide composites were investigated by in-situ displacement detection systematically. The results showed that the expansion property was improved by material process modifications. During the de/lithiation processes of graphite, the expansion ratio in 30% ~ 50% SOC changed little because of the small interlayer spacing variation of the intercalated graphite. …
Effect Of Chloride Ion On Electrochemical Behavior Of Silver Electrodeposition In Chcl-Urea Low Eutectic Solvent, Chong-Bo Zhan, Run-Jia Zhang, Xu Fu, Hai-Jing Sun, Xin Zhou, Bao-Jie Wang, Jie Sun
Effect Of Chloride Ion On Electrochemical Behavior Of Silver Electrodeposition In Chcl-Urea Low Eutectic Solvent, Chong-Bo Zhan, Run-Jia Zhang, Xu Fu, Hai-Jing Sun, Xin Zhou, Bao-Jie Wang, Jie Sun
Journal of Electrochemistry
Metallic silver coating has been widely used in the fields of microelectronics industry, catalyst, sensor and preparation of magnetoresistive materials because of its excellent corrosion resistance, good lubricity, high conductivity, excellent decoration and high catalysis. Compared with the traditional aqueous solution system, the research on metal electrodeposition in ionic liquid system is developing rapidly. In addition, additives are the key factors in the silver plating process. Adding a small amount of organic or inorganic additives to the plating solution will significantly change the coating properties, such as improving brightness, hardness and ductility. In this paper, using choline chloride urea (ChCl-Urea) …
Biofouling Behaviors Of Pure Titanium Surface Polarized At Different Potentials, Zhao-Xia Dai, Da-Jiang Zheng, Guang-Ling Song, Dan-Qing Feng, Pei Su
Biofouling Behaviors Of Pure Titanium Surface Polarized At Different Potentials, Zhao-Xia Dai, Da-Jiang Zheng, Guang-Ling Song, Dan-Qing Feng, Pei Su
Journal of Electrochemistry
Titanium (Ti) and its alloys are commonly used as engineering materials. Although they have been widely used in marine environments, they are also facing serious threats of biofouling. Therefore, it is necessary to investigate the relationship between electrochemical behavior and bioaffinity of titanium oxide film in seawater to explore effective surface treatment technology to reduce biofouling. In this work, the cathodic potential of -0.8 VSCE and the passivation potential of 0.5 VSCE were directly applied to the TA2 Ti in artificial seawater for potentionstatic polarization treatment to prepare two kinds of surface films with different states and then …
Electrocatalytic “Volcano-Type” Effect Of Nano-Tio2 (A)/(R) Phase Content In Pt/Tio2-CnX Catalyst, Ai-Lin Cui, Yang Bai, Hong-Ying Yu, Hui-Min Meng
Electrocatalytic “Volcano-Type” Effect Of Nano-Tio2 (A)/(R) Phase Content In Pt/Tio2-CnX Catalyst, Ai-Lin Cui, Yang Bai, Hong-Ying Yu, Hui-Min Meng
Journal of Electrochemistry
The relationship between the electrochemical activity of fuel cell catalysts and Pt particle size, as well as the catalyst support and co-catalyst is still unclear. In this work, FESEM, XRD, BET, TEM and CV techniques were adopted to investigate the effects of TiO2 anatase (A)/rutile (R) phases content on the electrochemical activity of Pt electrocatalyst. The results showed that the anatase-rutile phase transformation occurred during the heat treatment of TiO2 at 700 ~ 900 oC accompanied by the growth of two-phase crystalline size, and anatase was completely transformed into rutile at 900 oC. TEM results revealed that the …
Electrochemical Synthesis Of Acetylpyrazine, Lin Mao, Dong-Fang Niu, Shuo-Zhen Hu, Xin-Sheng Zhang
Electrochemical Synthesis Of Acetylpyrazine, Lin Mao, Dong-Fang Niu, Shuo-Zhen Hu, Xin-Sheng Zhang
Journal of Electrochemistry
Acetylpyrazine is naturally presented in hazelnuts, peanuts, and sesame seeds. As an important food additive, it is widely used in baked foods, meat, sesame and tobacco. At the same time, acetylpyrazine is also an important pharmaceutical intermediate, which is used in the syntheses of anti-tuberculosis drugs, anti-tumor, anti-malaria, anti-viral, antibacterial and treatments of epilepsy, pain and Parkinson’s drugs. At present, the synthesis methods of acetylpyrazine include oxidation method, multi-step method and Grignard reagent method, which have the disadvantages of low yield, cumbersome process, severe reaction conditions and high cost. In this study, acetylation of pyrazine was used to synthesize acetylpyrazine …
Electrochemical Voltammetric Behavior Of Sulfur Mustard On The Bare Pt Electrode, Yu-Lin Yang, Jie Sun, Tian Zhou, Ji-Gang Li, Shou-Ping Wei
Electrochemical Voltammetric Behavior Of Sulfur Mustard On The Bare Pt Electrode, Yu-Lin Yang, Jie Sun, Tian Zhou, Ji-Gang Li, Shou-Ping Wei
Journal of Electrochemistry
The sulfur mustard (bis(2-chloroethyl) sulphide, HD), one of highly toxic chemical weapon agents, can damage the alive tissue cells (such as skin, lung, respiratory mucosa and so on), and cause carcinogenic and mutagenic effects for a long time exposure, which imposes a great threat not only to the human health, but also to the sustainable development of the society. With its convenience, high sensitivity and rapid response, electrochemical technology exhibits considerable potential in the field-deployed detection toward HD, but the related reports are rare. Herein, the electrochemical behavior of HD on the bare Pt electrode was investigated by electrochemical measurements, …
Multi-Scale Simulation Revealing The Decomposition Mechanism Of Electrolyte On Lithium Metal Electrode, Yan-Yan Zhang, Yue Liu, Yi-Ming Lu, Pei-Ping Yu, Wen-Xuan Du, Bing-Yun Ma, Miao Xie, Hao Yang, Tao Cheng
Multi-Scale Simulation Revealing The Decomposition Mechanism Of Electrolyte On Lithium Metal Electrode, Yan-Yan Zhang, Yue Liu, Yi-Ming Lu, Pei-Ping Yu, Wen-Xuan Du, Bing-Yun Ma, Miao Xie, Hao Yang, Tao Cheng
Journal of Electrochemistry
Lithium metal is considered as an ideal anode material for next-generation high energy density batteries with its high specific capacity and low electrode potential. However, the high activity of lithium metal can lead to a series of safety issues. For example, lithium metal will continuously react chemically with the electrolyte, forming unstable the solid electrolyte (SEI) films. In addition, lithium dendrites can be formed during cycling, which can puncture the SEI film and cause short circuits in the battery. These drawbacks greatly hinder the commercial application of lithium metal. To solve the above problems, it is important to understand the …