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Full-Text Articles in Chemistry
Electrochemical Deposition Of Copper Pillar Bumps With High Uniformity, Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo
Electrochemical Deposition Of Copper Pillar Bumps With High Uniformity, Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo
Journal of Electrochemistry
Electrochemical deposition of copper pillar bumps (CPBs) is one of the key technologies for the advanced packaging. In this study, the effects of the additive concentration, the electrolyte convection, the current density, and the electroplating system on the uniformity of the CPBs have been systematically investigated. The results showed that the profiles of the CPBs were mainly determined by the additive concentration, the bath convection and the current density, while the heights of the CPBs were mainly affected by the electroplating system. For the CPBs profiles, it was found that the low leveler concentration and high current density would generally …
Study On Low Voltage Electrodeposition Of Diamond-Like Carbon Film, Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, Zhi-Dong Chen
Study On Low Voltage Electrodeposition Of Diamond-Like Carbon Film, Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, Zhi-Dong Chen
Journal of Electrochemistry
Diamond-like carbon (DLC) films are receiving a lot of attention from the scientific community, thanks to the promise of DLC films for applications in microelectronics and optoelectronics. Usually, electrodeposition is the preferred common technique because of low cost, large deposition area and simplicity of the setup. However, when carbon films are electrodeposited on a stainless steel, high cell voltages (≥1000 V) are required owing to the low electric conductivity of the organic solvents. This work has developed a new electrolyte system that could achieve carbon deposition on a stainless steel under a low applied cell voltage. The DLC films were …