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Full-Text Articles in Chemistry
Electrochemical Deposition Of Copper Pillar Bumps With High Uniformity, Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo
Electrochemical Deposition Of Copper Pillar Bumps With High Uniformity, Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo
Journal of Electrochemistry
Electrochemical deposition of copper pillar bumps (CPBs) is one of the key technologies for the advanced packaging. In this study, the effects of the additive concentration, the electrolyte convection, the current density, and the electroplating system on the uniformity of the CPBs have been systematically investigated. The results showed that the profiles of the CPBs were mainly determined by the additive concentration, the bath convection and the current density, while the heights of the CPBs were mainly affected by the electroplating system. For the CPBs profiles, it was found that the low leveler concentration and high current density would generally …
Investigation Of Through-Hole Copper Electroplating With Methyl Orange As A Special Leveler, Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen
Investigation Of Through-Hole Copper Electroplating With Methyl Orange As A Special Leveler, Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen
Journal of Electrochemistry
Methyl Orange (MO) with two kinds of functional groups can act as both an accelerator and an inhibitor, which has been used as a special leveler to simplify the electroplating additive system in the through-hole (TH) copper electroplating experiments. In this work, the role of MO in TH electroplating is characterized by molecular dynamics simulations and quantum chemical calculations. It is suggested that MO can spontaneously flatten the copper surface and be well adsorbed on the cathode surface, which inhibit the copper electrodeposition on the cathode. Electrochemical behavior of MO was evaluated by galvanostatic measurements (GM) and cyclic voltammetry (CV) …
Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder, Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu
Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder, Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu
Journal of Electrochemistry
Sn-Ag-Cu ternary alloy is the most ideal substitute for Sn-Pb alloy at present, and can be prepared by electrodeposition with high production efficiency, simple equipment, easy maintenance and excellent coating performance. The coordination system of the electroplating solution was investigated through the Hull cell experiment. The type of brighteners used in the plating solution and the ratio of the two brighteners were determined through the microscopic morphologic characterization, electrochemical corrosion test and cathodic polarization curve test. In addition, the dispersant and stabilizer were studied by observing the microscopic morphology and measuring the concentration change of Sn2+ ions in the plating …
Effect Of Chloride Ion On Electrochemical Behavior Of Silver Electrodeposition In Chcl-Urea Low Eutectic Solvent, Chong-Bo Zhan, Run-Jia Zhang, Xu Fu, Hai-Jing Sun, Xin Zhou, Bao-Jie Wang, Jie Sun
Effect Of Chloride Ion On Electrochemical Behavior Of Silver Electrodeposition In Chcl-Urea Low Eutectic Solvent, Chong-Bo Zhan, Run-Jia Zhang, Xu Fu, Hai-Jing Sun, Xin Zhou, Bao-Jie Wang, Jie Sun
Journal of Electrochemistry
Metallic silver coating has been widely used in the fields of microelectronics industry, catalyst, sensor and preparation of magnetoresistive materials because of its excellent corrosion resistance, good lubricity, high conductivity, excellent decoration and high catalysis. Compared with the traditional aqueous solution system, the research on metal electrodeposition in ionic liquid system is developing rapidly. In addition, additives are the key factors in the silver plating process. Adding a small amount of organic or inorganic additives to the plating solution will significantly change the coating properties, such as improving brightness, hardness and ductility. In this paper, using choline chloride urea (ChCl-Urea) …