Chemistry Commons^™

Application Of Peo-Ppo-Peo Triblock Copolymers In Synthesis Of Silica And Organosilica Nanomaterials, Shu Zhang

Dissertations, Theses, and Capstone Projects

In this dissertation, the research work focused on the application of Pluronic triblock copolymers, poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) (PEO-PPO-PEO), in the synthesis of mesoporous material, such as double-helical silica nanotube structures as well as bridged organosilica nanotubes by using swollen micelles of Pluronic surfactants and their mixtures. Chapter 1 introduced the background and several important mesoporous structures, and the relevant topics in this dissertation, such as, silica nanotubes, helical silica nanotubes, silica vesicles and organosilica nanotubes. Chapter 2, continued research works from earlier published paper (ACS Nano 2021, 15, 1016-1029), discussed static treatment and stirring effect on the formation of …

Engineering Rare-Earth Based Color Centers In Wide Bandgap Semiconductors For Quantum And Nanoscale Applications, Gabriel I. López-Morales

Dissertations, Theses, and Capstone Projects

For many years, atomic point-defects have been readily used to tune the bulk properties of solid-state crystalline materials, for instance, through the inclusion of elemental impurities (doping) during growth, or post-processing treatments such as ion bombardment or high-energy irradiation. Such atomic point-defects introduce local ‘incompatible’ chemical interactions with the periodic atomic arrangement that makes up the crystal, resulting for example in localized electronic states due to dangling bonds or excess of electrons. When present in sufficient concentrations, the defects interact collectively to alter the overall bulk properties of the host material. In the low concentration limit, however, point-defects can serve …

Growth, Optimization, And Characterization Of Topological Insulator Nanostructures By Molecular Beam Epitaxy, Ido Levy

Dissertations, Theses, and Capstone Projects

Topological insulators (TIs) have been the subject of much research since their discovery in 2009. The unique band structure of the TIs makes them attractive in research of exotic physical phenomena, such as the realization of the quantum anomalous Hall effect, as well as novel applications, including quantum computing, spintronics, and more. From a crystal growth perspective, their van-der-Waals structure also provides new opportunities, for example, by enabling the growth on a large selection of substrates. This thesis presents the growth of three-dimensional TI layers, heterostructures and magnetic TIs by molecular beam epitaxy (MBE). First, we show the improvement of …

Quantitative Lithium Composite As 3d Lithium Foam Anode For Lithium Metal Battery, Hu-Dong Li, Wei-Shang Jia, Xin-Xiu Yan, Yao-Yue Yang

Journal of Electrochemistry

Lithium (Li) metal as an anode material for batteries has extremely high specific capacity and extremely low redox potential, which can significantly improve the energy density of the battery. However, the main problems faced by the use of Li metal anodes are Li dendrite growth, interfacial side reaction and volumetric change of electrode. Herein, a strategy to prepare the three-dimensional (3D) Li foam by combining 3D scaffold with quantitative Li was proposed to suppress Li dendrites growth and alleviate electrode volumetric change. The 3D Li foam facilitated the efficient utilization of Li metal by suppressing the Li dendrite growth, mitigating …

Optimized Electrochemical Performance Of Si@C Prepared By Hydrothermal Reaction And Glucose Carbon Source, Si Chen, Song-Sheng Zheng, Lei-Ming Zheng, Ye-Han Zhang, Zhao-Lin Wang

Journal of Electrochemistry

Silicon (Si) has been considered as the potential material for the next-generation lithium-ion batteries (LIBs) for its high capacity (4200 mAh·g^-1, Li₂₂Si₅) and suitable working voltage (about 0.25 V vs. Li/Li⁺). However, the cycling stability and electrochemical performance of Si anode become significant challenges because of low intrinsic conductivity and huge volume variation (about 400%) during cycling processes. In addition, the repeated formation and destruction of surface solid electrolyte interphase (SEI) film will continuously consume the electrolyte and cause damage to LIBs. Carbon (C) materials, such as graphite, carbon spheres and tubes, …

Facile One-Step Solid-State Synthesis Of Ni-Rich Layered Oxide Cathodes For Lithium-Ion Batteries, Jing-Yue Wang, Rui Wang, Shi-Qi Wang, Li-Fan Wang, Chun Zhan

Journal of Electrochemistry

Nickel-rich layered oxide is one of the dominate cathode materials in the lithium ion batteries, due to its high specific energy density meeting the range requirement of the electric vehicles. Typically, the commercial Ni-rich layered oxides are synthesized from co-precipitated precursors, while precision control is required in the co-precipitation process to ensure the atomic level mixing of the cations such as Ni, Co and Mn, et.al. In this work, a one-step solid-state method was successfully applied to synthesize the Ni-rich layered oxide materials with ultra-high Ni content. By choosing the nickel hydroxides as the precursor with layered structure similar to …

A Novel Electrochemical Sensor Based On Au/Rgo/Feooh For One-Step Detection Of Nitrite, Da-Juan Luo, Bing-Qian Liu, Meng-Yan Qin, Rong Gao, Li-Xia Su, Yong-Huan Su

Journal of Electrochemistry

Nitrite, a widespread raw material, is harmful to human health for long-term consumption. At present, the detection methods of nitrite mainly include chemical analysis, fluorescence, ultraviolet spectrophotometry and chromatography. These methods have ideal sensitivity and selectivity, but also have some characteristics: cumbersome operation, expensive equipment and professional personnel. Therefore, the development of a simple and sensitive nitrite assay is of great significance. In this paper, the Au/rGO/FeOOH composite materials, which revealed good synergistic catalytic performance among the three elements in the composite, were prepared by simple hydrothermal method and reduction method for the first time with large specific surface area …

Low-Crystallinity And Heterostructured Aupt-Ru@Cnts As Highly Efficient Multifunctional Electrocatalyst, Tuan-Jie Gan, Jian-Ping Wu, Shi Liu, Wen-Jun Ou, Ling Bin, Xiong-Wu Kang

Journal of Electrochemistry

The catalytic activity of the catalysts is strongly dependent on the structure of the catalysts, and the exploration of their correlation and structure-controlled synthesis of the high-performance catalysts are always at the central. Currently, platinum (Pt) is the optimum catalyst for hydrogen evolution reaction (HER), oxygen reduction reaction (ORR) and alcohol oxidation reaction, while ruthenium (Ru) behaves as the champion catalyst for oxygen evolution reaction (OER) during water splitting. Preparing alloy catalysts with these precious metals can modulate the catalytic activity of these catalysts from the perspective of strain effect, ensemble effect and ligand effect. Here, we developed a strategy …

Synthesis And Physicochemical Characterization Of Noncentrosymmetric Quaternary Sulfides With Potential Nonlinear Optical Applications, Andrew J. Craig

Electronic Theses and Dissertations

In this work, several new quaternary sulfides were synthesized and investigated for their potential applications in optics. Chapter 1 provides an overview of nonlinear optical (NLO) materials in general, including their applications, ideal characteristics, current deficiencies, and strategies for the discovery of new candidate NLO materials, particularly those for use in the infrared (IR). Two families of compounds are investigated in this work, including Ln₃LiTS₇ (3-1-1-7) compounds and I₄-II-IV₂-VI₇ (4-1-2-7) diamond-like semiconductors (DLSs). All products were synthesized via traditional high-temperature, solid-state synthesis and their structures were solved and refined through single crystal …

Understanding Dynamics Of Polymers Under Confinement: A Molecular Dynamics And Neutron Scattering Study, Supun Samindra Kamkanam Mohottalalage

All Dissertations

The current study probes the structure, dynamics, and rheological behavior of associating polymers including ionomers in melts and solutions as well as conjugated polymers confined into nanoparticles, using molecular dynamics (MD) simulations and neutron scattering techniques. The study focuses on two families of associative polymers, ion containing macromolecules and conjugated polymers.

Polymers that consist of ionizable groups along their backbone found uses in a broad range of applications. Examples include light weight energy storage and generation systems, and biomedical applications, where the polymers act as ion exchange membranes, and actuators. The ionic groups tend to form clusters that are in …

Synthesis, Derivatives, And Applications Of Structured Nanomaterials, Md Shahidul Islam Khan

LSU New Orleans Theses and Dissertations

Nanomaterials offer abundant applications not accessible in regular bulk structures. A nanotubular structure (nanoscroll or nanotube) is a 1D architecture with distinct properties varying from that of the parent material. The new structure for example provides more surface area and presents more active sites on the structure exterior, interior, or edges. In this research, different nanotubular materials were targeted including nanopeapods (NPPs), nanoscrolls (NScs), and their various derivatives.

Halloysite nanotubes (HNT) were used as pod materials to grow noble metal NPs in their lumen. The synthesis was done rapidly, within 2 minutes at 55 ^⸰C. This allows the growth …

Competition Between Halogen And Chalcogen Bonding And Their Role In Probing Organic Transformations, Andrew Peloquin

All Dissertations

Halogen bonding, the attractive interaction of an electrophilic region on a halogen atom with a nucleophilic region on another atom or molecule, provides a highly directional tool in forming solid-state motifs. This interaction, along with the related chalcogen bonding interactions, forms powerful synthons, which, when combined with other typical intermolecular attractions such as hydrogen bonding, allow for the design of supramolecular structures and inputs to crystal engineering. This dissertation research serves two primary purposes: (1) to catalog halogen and chalcogen bonding interactions with various donor molecules and (2) to utilize these interactions to probe interesting organic transformations.

In order to …

Electrodeposition Mechanism And Process Of A Novel Cyanide-Free Gold Sulfite Bath, Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian

Journal of Electrochemistry

A novel cyanide-free gold sulfite process is introduced in this paper. In the bath, chloauric acid was directly employed as the main salt, and hydroxyethylidene diphosphonic acid (HEDP) was used as the stabilizer and coating grain refiner. The bath stability, the gold coating morphology and the mechanism of gold electrodeposition were studied in detail. The results showed that HEDP could significantly improve the bath stability. Moreover, the grains of the gold coating obtained from the gold sulfite bath without HEDP was rod-like, which grew gradually with the increasing of the deposition time, resulting in that the appearance of the coating …

Electrochemical Deposition Of Copper Pillar Bumps With High Uniformity, Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo

Journal of Electrochemistry

Electrochemical deposition of copper pillar bumps (CPBs) is one of the key technologies for the advanced packaging. In this study, the effects of the additive concentration, the electrolyte convection, the current density, and the electroplating system on the uniformity of the CPBs have been systematically investigated. The results showed that the profiles of the CPBs were mainly determined by the additive concentration, the bath convection and the current density, while the heights of the CPBs were mainly affected by the electroplating system. For the CPBs profiles, it was found that the low leveler concentration and high current density would generally …

Investigation Of Through-Hole Copper Electroplating With Methyl Orange As A Special Leveler, Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen

Journal of Electrochemistry

Methyl Orange (MO) with two kinds of functional groups can act as both an accelerator and an inhibitor, which has been used as a special leveler to simplify the electroplating additive system in the through-hole (TH) copper electroplating experiments. In this work, the role of MO in TH electroplating is characterized by molecular dynamics simulations and quantum chemical calculations. It is suggested that MO can spontaneously flatten the copper surface and be well adsorbed on the cathode surface, which inhibit the copper electrodeposition on the cathode. Electrochemical behavior of MO was evaluated by galvanostatic measurements (GM) and cyclic voltammetry (CV) …

Research Progress In Electroless Cobalt Plating And The Bottom-Up Filling Of Electroless Plating, Yu Shen, Bing-Bing Li, Yi Ma, Zeng-Lin Wang

Journal of Electrochemistry

With the continuous improvement of semiconductor integration, the resistivity of copper interconnect lines increases rapidly. When the width of the interconnect line is close to 7 nm, the resistivity of copper becomes the same as that of cobalt. International Business Machines Corporation (IBM) and Advanced Semiconductor Incorporation (ASI) have used cobalt to replace copper as a next-generation interconnect material. However, the fabrication of the cobalt seed layer and the super filling of electroplating cobalt for the 7 nm via-holes have been still the large challenge. Electroless plating is a very simple method to form a seed layer on the surface …

Research Progress Of Copper Electrodeposition Filling Mechanism In Silicon Vias, Yun-Na Sun, Yong-Jin Wu, Dong-Dong Xie, Han Cai, Yan Wang, Gui-Fu Ding

Journal of Electrochemistry

Aiming at the electroplating filling problem of deep via TSV (through silicon via) interconnection, the multi-compatible integrated manufacturing technology team at the Shanghai Jiao Tong University has completed the numerical solution of the equations and realized the numerical simulation of TSV filling mode by applying the finite element method with arbitrary Lagrange Euler algorithm. The filling mechanisms of blind vias, the butterfly filling form for the through vias and the simultaneous filling mode of vias with different aspect ratios are analyzed by simulation, contributing to the parameter optimization and sample manufacturing. The effects of electroplating current density and heat treatment …

Effect Of Corrosion Inhibitors On Copper Etching To Form Thick Copper Line Of Pcb In Acidic Etching Solution, Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, Yuan-Ming Chen

Journal of Electrochemistry

The chemical compounds of 2-mercaptobenzothiazole (2-MBT), benzotriazole (BTA) and phenoxyethanol (MSDS) as corrosion inhibitors were used to inhibit the copper etching to form the thick copper line of PCB in the acidic etching solution. The inhibition status was characterized with contact angle measurement, electrochemical test and etch factor calculation, while the corrosion morphology of copper surface was studied by scanning electron microscope. The adsorption mechanism of corrosion inhibitors on copper surface is analyzed by molecular dynamics and quantum chemistry calculations. The results indicated that the synergistic function of the two inhibitors could effectively promote their adsorption on the copper surface …

Preface To Special Issue On Electronic Electroplating, Zhi-Dong Chen, Chong Wang, Wei He, Ming Li

Journal of Electrochemistry

No abstract provided.

Mechanism And Application Of Nickel Nano-Cone By Electrodeposition On A Flexible Substrate, Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, Yong-Jie Du

Journal of Electrochemistry

Nano-array structure possesses promising prospect in power supply, optical device and electronic manufacturing. In this paper, a black nickel nano-cone array was prepared on a flexible substrate by galvanostatic deposition and the corresponding factors involved in the fabrication of nickel nano-cone array was explored. Experimental results showed that a large current density and low main salt concentration were not favored to the formation of cone nickel structure. It was also found that ammonium chloride, as the crystal modifier, was crucial to deposit the uniform nano-cone array. In addition, the growth mechanism of nickel nano-cone was further studied by molecular dynamics …

Electrodeposition Of Functional Epitaxial Films For Electronics, Kui Huang, Rong-Jiao Huang, Su-Qin Liu, Zhen He

Journal of Electrochemistry

Electrodeposition is a solution-based synthesis technique that can be used to fabricate various functional materials on conductive or semiconductive substrates under ambient conditions. Electrodeposition is usually triggered by an artificial electric stimulation (i.e., applied potential/current) to the substrate to oxidize or reduce ions, molecules, or complexes in the deposition solution layer near the substrate surface, which drives this solution layer to depart from its thermodynamic equilibrium and consequently causes the assembly of targeted deposits on the substrate. During electrodeposition, many experimental parameters could affect the properties of the deposits in different ways. To date, many elements (both metals and nonmetals), …

Designing Dynamic And Degradable Polymeric Materials With Thiol-X Chemistries, Reese Sloan

Dissertations

With plastic production poised to increase in coming years, there arises a need to develop new polymeric materials designed to combat the global pollution crisis. A commonly utilized approach in addressing this challenge is to employ a responsive functional moiety into the polymer architecture. Thiol-X reactions, a commonly utilized class of “click” reactions, have garnered broad implementation in new stimuli-responsive materials. This work specifically focuses on utilizing radical-mediated thiol-ene coupling and base-catalyzed thiol-isocyanate reactions to develop a library of ternary thiol-ene/thiourethane covalent adaptable networks (CANs) and hydrolytically labile poly(thioether ketal) thermoplastics. CANs are a class of network materials capable of …

Introduction Of Development And Application Technology Of Organic Additives For Acid Copper Electroplating, Hao-Bin Zou, Chao-Li Tan, Wei Xiong, Dao-Lin Xi, Bin-Yun Liu

Journal of Electrochemistry

Acid copper electroplating is one of the key technologies in buildup multilayer PCB (BUM-PCB) manufacture process and the most important technique to achieve electrical interconnection between any layer and high-density interconnection in a substrate. This article introduces the research focus of organic additives used in acid copper electroplating, and developing different kinds of micro-via filling copper electroplating technique applied in various scenarios, and some other technical problems from applications. First of all, according to the chronopotentiometric (CP) experiment results, the levelers with different polymeric molecular structures exhibited various responses of cupric deposition potential along with their increased concentrations, which is …

Study On The Effect Of Additives In The Electrodeposition Of Sn-Ag-Cu Ternary Alloy Solder, Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu

Journal of Electrochemistry

Sn-Ag-Cu ternary alloy is the most ideal substitute for Sn-Pb alloy at present, and can be prepared by electrodeposition with high production efficiency, simple equipment, easy maintenance and excellent coating performance. The coordination system of the electroplating solution was investigated through the Hull cell experiment. The type of brighteners used in the plating solution and the ratio of the two brighteners were determined through the microscopic morphologic characterization, electrochemical corrosion test and cathodic polarization curve test. In addition, the dispersant and stabilizer were studied by observing the microscopic morphology and measuring the concentration change of Sn²⁺ ions in the …

Optimization Of Pulse Plating Additives And Plating Parameters For High Aspect Ratio Through Holes, Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, Zeng-Kun Wu

Journal of Electrochemistry

As an important component in electronic products, printed circuit board (PCB) plays a supporting and interconnecting role for the electronic components in it. With the development of communication technology, electronic products are developing in the direction of “thin, light and small”, and high density interconnection (HDI) comes into being. Due to the high-density interconnection characteristics of HDI boards, the thickness of the board is increasing. At the same time, in order to reserve space for the laying of fine lines on the subsequent board surface, the diameter of the through holes on the board is also decreasing, so the depth-diameter …

An Investigation On The Interface Corrosion Behaviors Of Cobalt Interconnects In Chemical Mechanical Polishing Slurry, Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, Tao Hang

Journal of Electrochemistry

Cobalt is widely regarded as the most promising interconnect material for 10 nm node and beyond. The development of a chemical mechanical planarization (CMP) slurry suitable for cobalt interconnect is a critical component for the application of cobalt interconnect. During CMP process of the interconnect layer, the achievement of high-quality surface after planarization is greatly challenged by the metal corrosion in CMP slurry. In this contribution, the corrosion behavior of cobalt in a slurry with potassium persulfate (KPS) as an oxidizer, glycine as a complexing agent, and benzotriazole (BTA) as an inhibitor was investigated. Static erosion rates (SER) of cobalt …

Electrochemical Sers Study Of Benzotriazole And 3-Mercapto-1-Propanesulfonate In Acidic Solution On Copper Electrode, Yin-Fei Shen, Yan-Li Chen, Sheng-Xu Wang, Ye Zhu, Wen-Chang Wang, Min-Xian Wu, Zhi-Dong Chen

Journal of Electrochemistry

Since the development of acid copper plating technology, the role of additives is indispensable. In addition to the main salt copper sulfate and supporting electrolyte sulfuric acid, suppressors, accelerators, levelers and chlorine ions (Cl^-) are also required to be added into the plating solution. Appropriate additive system can have a significant impact on the coating or the plating solution, which can help improve the quality of the coating and increase the brightness of the coating. Through electrochemical measurement, vibrational spectroscopy, scanning probe microscopy, molecular dynamics simulation and other methods, researches have a deeper understanding in the adsorption configuration …

Development Status Of Copper Electroplating Filling Technology In Through Glass Via For 3d Interconnections, Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li

Journal of Electrochemistry

With the slow development of Moore's Law, the high density and miniaturization of microelectronic devices put forward higher requirements for advanced packaging technology. As a key technology in 2.5D/3D packaging, interposer technology has been extensively studied. According to different interposer materials, it is mainly divided into organic interposer, silicon interposer and glass interposer. Compared with the through silicon via (TSV) interconnection, the through glass via (TGV) interposer has received extensive attention in the 2.5D/3D advanced packaging field for its advantages of excellent high-frequency electrical characteristics, simple process, low cost, and adjustable coefficient of thermal expansion (CTE). However, the thermal conductivity …

Study On Low Voltage Electrodeposition Of Diamond-Like Carbon Film, Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, Zhi-Dong Chen

Journal of Electrochemistry

Diamond-like carbon (DLC) films are receiving a lot of attention from the scientific community, thanks to the promise of DLC films for applications in microelectronics and optoelectronics. Usually, electrodeposition is the preferred common technique because of low cost, large deposition area and simplicity of the setup. However, when carbon films are electrodeposited on a stainless steel, high cell voltages (≥1000 V) are required owing to the low electric conductivity of the organic solvents. This work has developed a new electrolyte system that could achieve carbon deposition on a stainless steel under a low applied cell voltage. The DLC films were …

Study On Weak Alkaline Cyanide-Free Silver Plating Process For Etching Lead Frame, Jian-Wei Zhao, Hai-Feng Zhu, Xiao-Hui Yu, Gui-Yun Yuan, Zhi Sun

Journal of Electrochemistry

As a new development direction of integrated circuit chip carrier, etched lead frame has been gradually applied in microelectronics industry in recent years. Since the preparation of the etched lead frame requires the use of multiple layers of non-alkali-resistant photoresist films with specific patterns, and the traditional cyanide silver plating is unable to meet this requirement, making that the development of weakly alkaline cyanide free silver plating process has great significance. In this paper, a weak alkaline silver plating process based on 5,5-dimethylhydantoin (DMH) cyanide-free silver plating system was studied. The electrodeposition behavior of the system and the nucleation mechanism …