Characterization Of Tomographic Piv System For Single-Phase Immersion Cooling Applications, Joel Joshua Oommen

Mechanical and Aerospace Engineering Theses

As the rapid expansion of Artificial Intelligence (AI) infrastructure and High-Performance Computing (HPC) pushes power requirements to new heights, traditional air-cooling methods have become inadequate for modern server demands. Consequently, single-phase immersion cooling (SPIC) has emerged as one of the effective and sustainable alternatives, utilizing dielectric fluids to remove heat through direct contact with electronic components. Despite numerous thermal and reliability studies, the complex three-dimensional movement of buoyant thermal plumes around intricate component shapes are not yet fully understood in confined spaces.

This thesis provides a detailed characterization of Tomo-PIV and a component level experimental study of flow patterns in …

Computational Study Of Rotating Detonation Combustors, Aditya Balasubramaniam

Mechanical and Aerospace Engineering Theses

Rotating detonation combustors (RDCs) are pressure-gain combustion devices that sustain one or more continuously rotating detonation waves, offering potential thermodynamic and performance advantages over conventional deflagration-based systems. Their behavior depends strongly on combustor geometry and operating conditions. Understanding these effects is therefore essential for the design and optimization of practical RDCs. Accordingly, this thesis numerically investigates annular RDCs with two primary objectives: (1) to evaluate the effects of propellant mass flux and (2) to assess the influence of annular width on detonation-wave dynamics and combustor performance.

A finite-volume framework is used to solve the compressible reactive Euler equations with hydrogen–air …

Experimental Thermal Characterization And Comparison Of Direct Liquid Cooling And Air Cooling For A High-Density Gpu Server Thermal Test Vehicle, Oluwagbolahan Esan

Mechanical and Aerospace Engineering Theses

As the power density of artificial intelligence (AI) and high-performance computing (HPC) servers escalates, air cooling is approaching fundamental scaling limits set by air's low convective heat transfer coefficient and rising parasitic fan power. This thesis presents an experimental comparison of direct-to-chip liquid cooling and air cooling for a high-density GPU server, using a Thermal Test Vehicle (TTV) that emulates the device layout and power-density regime of an 8-GPU SXM5-class baseboard (eight emulated GPU blocks and four NVLink Switch modules). The liquid configuration was tested at 8.8 kW (8.0 kW GPU, 800 W switch) across three Coolant Distribution Unit (CDU) …

Experimental And Numerical Modelling-Based Optimization Of Additive Manufacturing Processes, Vishnu V. Ganesan

Mechanical and Aerospace Engineering Dissertations - Archive

ABSTRACT

Experimental and Numerical Modeling-Based Optimization of Additive Manufacturing Processes

Vishnu V Ganesan, Ph.D.

The University of Texas at Arlington, 2025

Supervising Professor: Dr. Ankur Jain

Experimental and numerical modeling play a pivotal role in advancing additive manufacturing technologies by enabling a deeper understanding of complex, multi-physics processes that govern part quality, performance, and reliability. These manufacturing techniques—ranging from Powder Bed Fusion (PBF) and Material Extrusion (MEX) to Automated Fiber Placement (AFP)—involve tightly coupled thermal, mechanical, and material phenomena that are challenging to capture through empirical observation alone. Experimental methods offer critical validation and insights into real-world behavior, while numerical …

Deep Neural Network Models For Heatsink Performance Prediction And Optimization In Single Phase Immersion Cooling: Framework For Future Design Tools And Digital Twin Integration, Braxton J. Smith

Mechanical and Aerospace Engineering Theses - Archive

The rapidly rising computational power of modern computing components combined with the advanced packaging techniques being implemented has resulted in exponentially increasing thermal design powers (TDP) from CPUs and GPUs. Traditional air-cooling methods are approaching their effective cooling limits for many of these components, requiring lower supply air temperatures, higher supply air flowrates, and much larger heatsinks to remain feasible. Transitioning from air-cooling to single-phase immersion cooling offers numerous benefits in thermal performance, data-center size reduction, and energy efficiency. To leverage the merits of immersion cooling, the performance of a given heatsink must be predicted and optimized for best performance …

Materials Reliability In Direct-To-Chip Cooling: A Systematic Study Of Aluminum Corrosion In Next-Generation Data Center Coolants, Fnu Harish Gangadhara

Mechanical and Aerospace Engineering Theses - Archive

Data centers are rapidly scaling to support artificial intelligence, cloud platforms, and other high-performance workloads, driving a sharp increase in chip and rack power densities that are now approaching, and in some cases surpassing, 50–100 kW per rack. In response, direct-to-chip liquid cooling has become a key enabling technology for managing these extreme thermal loads, yet the durability of materials in contact with the coolant remains a major reliability concern over system lifetimes. Copper has traditionally been used for cold plates and cooling-loop components, but its relatively high cost, mass, and supply-chain uncertainty are motivating a shift toward aluminum as …

A Path To Commissioning Of Direct-To-Chip Liquid Cooling For Hyperscale Data Centers Using Experimental And Cfd Techniques, Himanshu Girishchandra Modi

Mechanical and Aerospace Engineering Dissertations - Archive

The escalating demand for computing power in hyperscale data centers necessitates innovative cooling solutions to enhance energy efficiency and ensure sustainable operations. Direct-to-chip liquid cooling has emerged as a promising alternative to traditional air-cooling methods, offering improved thermal management and reduced energy consumption. This dissertation explores a comprehensive approach to commissioning direct-to-chip liquid cooling systems in hyperscale data centers by integrating experimental analyses and Computational Fluid Dynamics (CFD) techniques. The study begins by examining design modifications for air-cooled servers and later analyzes the impact of different parameters for a hybrid-cooled server. It explores the fundamental principles of direct-to-chip liquid cooling …

Mathematical Modeling Of Heat And Mass Transfer In Multilayer Systems, Girish Krishnan

Mechanical and Aerospace Engineering Dissertations - Archive

Multilayer systems are commonly found in a number of engineering devices like Li-ion cells and vertically integrated semiconductor devices. Li-ion cells are widely used for various engineering applications, but they come with a drawback in the form of thermal runaway, and thermal abuse is one of the scenarios that leads to thermal runaway. On the other hand, heterogenous integration in chip and package level architectures is being implemented to keep up with Moore’s law. Modeling of heat and mass transfer in these systems is a topic of interest to improve performance and reliability.

The first segment of this dissertation will …

Dynamics Of Separated Flows In Diffusers With Vortex Generators, Sandeep Eldho James

Mechanical and Aerospace Engineering Dissertations - Archive

Flow through curved diffusers is complicated due to the possibility of flow separation and secondary flows. Vortex generators (VGs) are a class of passive flow separation control devices used to improve the flow quality in curved diffusers by suppressing flow separation. However, the literature review demands an in-depth investigation on the physical mechanisms related to flow separation control. Thus, this study aims to improve the understanding of the underlying flow physics associated with VG-induced flow separation control in confined flows. The chosen geometry for this study is a well-documented asymmetric diffuser which exhibits a mild flow separation.

The theoretical formulation …

Machine Learning-Based Methodology For Multi-Objective And Multi-Design Variable Optimization Of Finned Heat Sinks And Evaluation Of Electrochemical Additive Manufactured Heat Sink Designs For Single-Phase Immersion Cooling, Joseph F. Herring Ii

Mechanical and Aerospace Engineering Dissertations - Archive

Traditional air-cooling along with corresponding heat sinks are beginning to reach performance limits, requiring lower air-supply temperatures and higher air-supply flowrates, in order to meet the rising thermal management requirements of high power-density electronics. A switch from air-cooling to single-phase immersion cooling provides significant thermal performance improvement and reliability benefits. When hardware which is designed for air cooling is implemented within a single-phase immersion cooling regime, optimization of the heat sinks provides additional thermal performance improvements. This work investigates performance of a machine learning (ML) approach to building a predictive model of the multi objective and multi-design variable optimization of …

Design And Analysis Of Electrochemical Additive Manufacturing Based Cold Plates And Heat Sinks For Enhanced Electronics Cooling And Temperature-Dependent Density Characterization Of Phase Change Materials, Jacob Lamotte-Dawaghreh

Mechanical and Aerospace Engineering Dissertations - Archive

The body of work that comprises this dissertation is divided into two main sections. The first section is regarding novel heat sink and cold plate designs that leverage a metal additive manufacturing process called electrochemical additive manufacturing (ECAM) to drive increased thermal performance. The continuous advancements in electronics computational capabilities have resulted in ever-increasing thermal loads at the component and data center server level. These strides within the field are soon to be compounded by the rise of artificial intelligence and machine learning technologies. Traditionally, high performance electronics components have been able to be cooled by forced-air cooling; however, the …

Numerical Simulation And Optimization Of Fin Configurations For Enhanced Heat Sink Performance In Aluminum And Copper Materials, Rimpy Singh

Mechanical and Aerospace Engineering Theses - Archive

The constant evolution of data centers and high-power electronic systems has raised critical challenges in heat dissipation and thermal management. Single-phase immersion cooling, where electronic components are submerged in a thermally conductive but non-electrically conductive liquid (dielectric liquid), offers improved heat dissipation capabilities and emerges as a promising alternative to traditional air-cooling methods, which often fail to meet the thermal demands of densely packed, high-power systems. This study investigates and compares the thermal performance of aluminum and copper heat sinks with fin thicknesses of 0.33 mm and 0.54 mm, respectively, using finite element analysis based on computational fluid dynamics (CFD) …

Advanced Thermal Management Solutions For High-Powered Chips: A Comprehensive Study On Immersion Cooling And Electrochemical Additive Manufacturing-Based Cold Plates, Gautam Gupta

Mechanical and Aerospace Engineering Dissertations - Archive

This dissertation investigates advanced thermal management strategies for high-performance computing systems to address the escalating thermal challenges posed by increasing power densities and computational demands. Chapter 1 evaluates the efficacy of forced convection Single-Phase Immersion Cooling (SPIC) with a dielectric fluid (EC-110) compared to traditional air cooling for a 776 W server. Computational Fluid Dynamics (CFD) simulations demonstrate significant reductions in chip junction temperatures, maximum Dual In-line Memory Module (DIMM) temperatures, and server pressure drop with immersion cooling, highlighting its superior heat dissipation capabilities.

Chapter 2 delves into the comparative analysis of forced and natural convection Single-Phase Immersion Cooling techniques. …