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Copper

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Full-Text Articles in Materials Science and Engineering

Nucleation, Wetting And Agglomeration Of Copper And Copper-Alloy Thin Films On Metal Liner Surfaces, Stephanie Florence Labarbera Jan 2011

Nucleation, Wetting And Agglomeration Of Copper And Copper-Alloy Thin Films On Metal Liner Surfaces, Stephanie Florence Labarbera

Legacy Theses & Dissertations (2009 - 2024)

One of the key challenges in fabricating narrower and higher aspect ratio interconnects using damascene technology has been achieving an ultra-thin (~2 nm) and continuous Cu seed coverage on trench sidewalls. The thin seed is prone to agglomeration because of poor Cu wetting on the Ta liner. Using in-situ conductance measurements, the effect of lowering the substrate temperature during Cu seed deposition has been studied on tantalum (Ta) and ruthenium (Ru) liner surfaces. On a Ta surface, it was found that lowering the deposition temperature to -65°C increases the nucleation rate of the Cu thin film, and reduces the minimum …

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Microstructural Effects During Chemical Mechanical Planarization Of Copper, Patrick J. Andersen, Mariela N. Bentancur, Amy J. Moll, Megan Frary Jan 2010

Microstructural Effects During Chemical Mechanical Planarization Of Copper, Patrick J. Andersen, Mariela N. Bentancur, Amy J. Moll, Megan Frary

Materials Science and Engineering Faculty Publications and Presentations

Novel die-stacking schema using through-wafer interconnects require vias to be filled with electroplated Cu, resulting in thick copper films, and requiring an aggressive first-step CMP. This work investigates the effects of microstructure on CMP of copper films, which are not presently well understood. Bulk and local removal rates were investigated for several different microstructures. Surface orientation maps were created and the orientations of individual grains were correlated with topographical data to elucidate local removal behavior. Cu removal depends on the details of the microstructure, and certain microstructures allowed for either faster or more uniform removal of thick Cu films.

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Electronic And Structural Properties Of Molybdenum Thin Films As Determined By Real Time Spectroscopic Ellipsometry, J. D. Walker, H. Khatri, V. Ranjan, Jian Li, R. W. Collins, S. Marsillac Jan 2009

Electronic And Structural Properties Of Molybdenum Thin Films As Determined By Real Time Spectroscopic Ellipsometry, J. D. Walker, H. Khatri, V. Ranjan, Jian Li, R. W. Collins, S. Marsillac

Electrical & Computer Engineering Faculty Publications

Walker, J.D., Khatri, H., Ranjan, V., Li, J., Collins, R.W., & Marsillac, S. (2009). Electronic and structural properties of molybdenum thin films as determined by real-time spectroscopic ellipsometry. Applied Physics Letters, 94(14). doi: 10.1063/1.3117222

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Effects Of Sulfide Ions On The Inhibiting Efficiency Of Eda As A Copper Corrosion Inhibitor In Dilute Hcl Solution, Wen-Juan Qu, Rong-Gui Du, Chang-Jian Lin Feb 2006

Effects Of Sulfide Ions On The Inhibiting Efficiency Of Eda As A Copper Corrosion Inhibitor In Dilute Hcl Solution, Wen-Juan Qu, Rong-Gui Du, Chang-Jian Lin

Journal of Electrochemistry

The anticorrosion action of EDA on copper in dilute HCl solution and the effect of sulfide ions on the inhibiting efficiency were studied by the Tafel plot method.The corrosion potential of Cu shifted to more positive value and the corrosion current density decreased after the addition of Na2S to the solution.The results indicated that sulphide ions could increase the inhibiting efficiency of EDA because of the synergistic inhibition effect between EDA and Na2S,resulting from the adsorption of HS- on the surface of Cu,facilitated the adsorption of EDA to form a highly protective adsorbed layer which …

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Copper Electrodeposition Under The Perturbation Of Hard Particles, Zeng-Wei Zhu, Di Zhu Nov 2005

Copper Electrodeposition Under The Perturbation Of Hard Particles, Zeng-Wei Zhu, Di Zhu

Journal of Electrochemistry

Copper electrodepositon was carried out on the rotating cathode,with hard particles(such as ceramic beads) filling between the electrodes. The rotation of cathode led hard particles to polish and impact the surface of deposit during electrodeposition.Copper deposits with a mass of cuspidal nodules were produced in acid sulfate solutions while brittle deposits without nodules were produced in alkaline sulfate solutions. It was also found that brightening and smoothing deposit could be obtained from the alkaline solution, and the deposit was approximatively disordered orientation with granular morphology of about 100~300 nm. The results show that the polishing and impact of hard particles …

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Electrodeposition Of Copper Into Trenches Under Rotating Hydrodynamic Condition, Jian-Jun Sun, Bu-Gao Xie, Wen-Hui Yin, Guo-Nan Chen May 2004

Electrodeposition Of Copper Into Trenches Under Rotating Hydrodynamic Condition, Jian-Jun Sun, Bu-Gao Xie, Wen-Hui Yin, Guo-Nan Chen

Journal of Electrochemistry

Silicon chips patterned with treneches were fixed onto a rotating electrode. Copper was electrodeposited into the trenches under rotating hydrodynamic conditions The sizes of the trenches are 1 m in height and 0.35 m, 0.50 m and 0.70 m in width, respectively. The effects of rotating of the chip, the current density and the concentration of Cu2+ on the filling of thetrenches were studied. It is found that lower current density and moderate concentration of Cu2+ resulted in a void free filling of the trenches.

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Effect Of Dissolved Oxygen On The Corrosion Behavior Of Coalesced Copper And Stainless Steel-206 In Acetic Solutions, Rong-Zong Hu, Xiong-Cao Zhao, Yu-Hua Weng, Chang-Jian Lin Nov 2002

Effect Of Dissolved Oxygen On The Corrosion Behavior Of Coalesced Copper And Stainless Steel-206 In Acetic Solutions, Rong-Zong Hu, Xiong-Cao Zhao, Yu-Hua Weng, Chang-Jian Lin

Journal of Electrochemistry

Linear sweeping technique and dissolving oxygen sensor were used to study the effect of dissolved oxygen and relating factors on the corrosion behavior of coalesced copper and stainless steel-206 in acetic solutions. It was found: 1. The existing of dissolved oxygen is one of the important factors, which strongly influenced the corrosion behavior of coalesced copper and stainless steel-206 in acetic solution. 2. The existing of dissolved oxygen is benefitial to the preventing stainless steel-206 from corrosion in acetic solutions, but damage to the preventing coalesced copper from corrosion. 3. At the high temperature since the dissolved oxygen was escaping …

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Polishing Rate And Dependent Factors Of Copper In Nh3 ·H2O Aqueous Solution Containing K3Fe(Cn)6 During Cmp, Han-Wei He, Yue-Hua Hu, Ke-Long Huang May 2002

Polishing Rate And Dependent Factors Of Copper In Nh3 ·H2O Aqueous Solution Containing K3Fe(Cn)6 During Cmp, Han-Wei He, Yue-Hua Hu, Ke-Long Huang

Journal of Electrochemistry

Dependence of polishing rates of copper on concentrations of NH3·H2O, passivator K3[Fe(CN)6], γ-Al2O3 abrasives and polishing pressures, polishing rotative rates were studied. Dependent mechanisms were explained. It was shown a linear relation between polishing and polishing pressures and rotative rates within some range, non-linear relation between polishing and various reagent concentrations. Preston coefficient was varied. CMP recipe of the best polishing rate was gained: 4%K3Fe(CN)6+1%NH3·H2O+25%γ-Al2O3, Kp=0.02383. Technics conditions were 300 rpm and 80 kpa. The …

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Determination Of Copper In The Waste Water Of Plating By Chronocoulometry For Flowing Solution, Xin-Hua Lin, Wei Chen Feb 2002

Determination Of Copper In The Waste Water Of Plating By Chronocoulometry For Flowing Solution, Xin-Hua Lin, Wei Chen

Journal of Electrochemistry

The chronocoulometry for flowing solution was devoloped and applied to the detemination of copper(Ⅱ) in the waste water of plating. The linear range of copper(Ⅱ) was 2～16mg/L, and the relative standard deviation was less than 0.1% (n =8). The recovery was 98%～103% for copper(Ⅱ) in the waste water.Chronocoulometry for flowing solution overcomed noise disturbance resulting from capacity current and variety of property of electrode surface. This method was sensitive,accurate and well reproducible.

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High-Efficiency Solar Cells Based On Cu(Inal)Se[Sub 2] Thin Films, S. Marsillac, P. D. Paulson, M. W. Haimbodi, R. W. Birkmire, W. N. Shafarman Jan 2002

High-Efficiency Solar Cells Based On Cu(Inal)Se[Sub 2] Thin Films, S. Marsillac, P. D. Paulson, M. W. Haimbodi, R. W. Birkmire, W. N. Shafarman

Electrical & Computer Engineering Faculty Publications

A Cu(InAl)Se2solar cell with 16.9% efficiency is demonstrated using a Cu(InAl)Se2thin film deposited by four-source elemental evaporation and a device structure of glass/Mo/Cu(InAl)Se2/CdS/ZnO/indium tin oxide/(Ni/Algrid)/MgF2. A key to high efficiency is improved adhesion between the Cu(InAl)Se2 and the Mo back contact layer, provided by a 5-nm-thick Ga interlayer, which enabled the Cu(InAl)Se2 to be deposited at a 530 °C substrate temperature. Film and device properties are compared to Cu(InGa)Se2 with the same band gap of 1.16 eV. The solar cells have similar behavior, with performance limited by recombination through …

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Spontaneous, Non-Aqueous Electrochemical Deposition Of Copper And Palladium On Al And Al(Cu) Thin Films, R. Fang, H. Gu, Matthew O'Keefe, Thomas J. O'Keefe, W. S. Shih, K. D. Leedy, R. Cortez Jan 2001

Spontaneous, Non-Aqueous Electrochemical Deposition Of Copper And Palladium On Al And Al(Cu) Thin Films, R. Fang, H. Gu, Matthew O'Keefe, Thomas J. O'Keefe, W. S. Shih, K. D. Leedy, R. Cortez

Materials Science and Engineering Faculty Research & Creative Works

Copper and palladium seed layers have been successfully deposited from organic solutions onto patterned and unpatterned pure aluminum and Al (0.5%Cu) thin films using an immersion displacement process. The reaction occurs at ambient temperature and pressure by a spontaneous electrochemical mechanism. Copper and palladium deposition using the organic solution was studied as a function of reaction time and Cu or Pd concentration in the solution. It was found that both time and the initial ionic metal concentration significantly influence deposit morphology, particle size and shape, and adherence. Nucleation of Cu or Pd sub-micron particles on both Al and Al (Cu) …

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Behavior Of Copper In Hydrogen Storage Alloy Microencapsulated By Copper, Dawei Zhang, Huatang Yuan, Huabin Yang, Zuoxiang Zhou, Yunshi Zhang Aug 1997

Behavior Of Copper In Hydrogen Storage Alloy Microencapsulated By Copper, Dawei Zhang, Huatang Yuan, Huabin Yang, Zuoxiang Zhou, Yunshi Zhang

Journal of Electrochemistry

Negative electrode made from Cu microencapsulated hydrogen storage alloy was studied by using cyclic voltammetry method. The results showed that copper as a coating material was of a certain stability in 5 mol/L KOH solution within the range of charge and discharge voltage. But when expanding the sweep voltage, the CV curve showed a pair of distinct oxidation reduction current peaks of Cu2O formation at E = -0.3 V and Cu2O reduction at E =-0.6 V. With charging discharging cycles, copper is liable to be oxidized to Cu2O and further oxidized into CuO2 …

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Corrosion Behaviour Of Copper Covered With Ion Selective Phenolic Coatings By Eis, Zhoucheng Wang, Yingzhou Zhang, Shaomin Zhou Aug 1997

Corrosion Behaviour Of Copper Covered With Ion Selective Phenolic Coatings By Eis, Zhoucheng Wang, Yingzhou Zhang, Shaomin Zhou

Journal of Electrochemistry

Electrochemical impedance spectroscopy(EIS) technique was employed to study the corrosion behaviour of copper painted with the anion selective, cation selective and bipolar phenolic coatings in 3% NaCl solution. From the impedance spectrum characteristics, the models of equivalent circuit for these different coating systems were established, and the methods for the analysis of experimental impedance diagrams in terms of coating and interface properties were discussed. The research results show that the composition and structure of ion selective coatings have significant influence on corrosion behaviour of copper. The bipolar coating consisting of an anion selective inner layer and a cation selective outer …

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Electrochemical Studies On Chemical Polishing Of Copper, Keping Han, Jingli Fang Aug 1996

Electrochemical Studies On Chemical Polishing Of Copper, Keping Han, Jingli Fang

Journal of Electrochemistry

Changes in specular reflectivity,weight loss,surface topograph and potential with time and current-potential curves during chemical polishing were determined. The results showed that chemical polishing was composed of the etching, polishing and pitting stage. The passivating film theory also applied to the chemical polishing.

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Electrochemical Study Of The Corrosion Behavior Of Coalesced Copper And Sw-206 Stainless Steel In The Acetic-Acid Solution, Rongzong Hu, Changjian Lin, Jianguang Tan, Zhanmei Sun, Xueqin Wu, Biao Wang Aug 1996

Electrochemical Study Of The Corrosion Behavior Of Coalesced Copper And Sw-206 Stainless Steel In The Acetic-Acid Solution, Rongzong Hu, Changjian Lin, Jianguang Tan, Zhanmei Sun, Xueqin Wu, Biao Wang

Journal of Electrochemistry

In order to provide a theoretic and experimental consideration for the material selection and anit-corrosion in the petrochemical industries the corrosion behavior of coalesced copper and sw-206 stainless steel in the acetic acid solution was studied by electrochemical impedance spectroscopy and polarization techniques. The effects of the temperature, acetic acid concentration and solubilized oxygen in the acetic acid solution on the corrosion process of this two metals were analyzed. It was found that these effects obviously accelerate corrosion process for the coalesced copper, but no apparent influnce for the sw-206 stainless steel.In the the acetic acid solution, containing water and …

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Cyclic Voltammetric Calorimetry Studying The Deposition Of Copper Of Pt Electrodes, Yongchun Zhu, Robin. H. J. Clark Nov 1995

Cyclic Voltammetric Calorimetry Studying The Deposition Of Copper Of Pt Electrodes, Yongchun Zhu, Robin. H. J. Clark

Journal of Electrochemistry

In the present paper, cyclic voltammetric calorimetry has been used to study thedeposition of copper on platinum electrode from LiClO4 aqueous solution. Cyclic voltammetric thermogram and cyclic voltammetric differential thermogram show that the deposition of copper on theelectrode is an exothermal process with a strong interaction between copper and platinum layer (-3227.0 kJ /mol). The electrochemical oxidation of the deposited copper is composed of twoprocesses: an endothermal activation process with 747.0 kJ/mol of activation enthalpy, and an exothermal oxidation reaction with -189.9 kJ/mol of the reaction enthalpy, which are accord with the data from the theoritical estimation and thermodynamic …

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Electrochemically Modified Glassy Carbon Electrode And Determination Of Copper By Anodic Stripping Voltammetry, Jinrui Xu, Yie Liu, Xiurun Zhuang, Tomoo Miwa, Toyohide Takeuchi May 1995

Electrochemically Modified Glassy Carbon Electrode And Determination Of Copper By Anodic Stripping Voltammetry, Jinrui Xu, Yie Liu, Xiurun Zhuang, Tomoo Miwa, Toyohide Takeuchi

Journal of Electrochemistry

This paper reported the glassy carbon electrode modified by cyclic voltammetrybetween -0.1 and +1.5 V (vs. SCE) in an aqueous solution containing catechol, for maldehyde and talium hydroxide. The modified electrode can be applied to the determination of copper(Ⅱ) in water, and its sensitivity is about 35 times higher than that of unmedified glassy carbon electrode, The quantitative limit with this modified electrode is 0.1 ng/ml.

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Compensation And Characterization Of Gallium Arsenide, Randy A. Roush Jan 1995

Compensation And Characterization Of Gallium Arsenide, Randy A. Roush

Electrical & Computer Engineering Theses & Dissertations

The properties of transition metals in gallium arsenide have been previously investigated extensively with respect to activation energies, but little effort has been made to correlate processing parameters with electronic characteristics. Diffusion of copper in gallium arsenide is of technological importance due to the development of GaAs:Cu bistable photoconductive devices. Several techniques are demonstrated in this work to develop and characterize compensated gallium arsenide wafers. The material is created by the thermal diffusion of copper into silicon-doped GaAs. Transition metals generally form deep and shallow acceptors in GaAs, and therefore compensation is possible by material processing such that the shallow …

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Influence Of Processing Techniques On Copper Deep Levels Formation And On Photoconductivity In Silicon Doped Gallium Arsenide, Lucy M. Thomas Apr 1993

Influence Of Processing Techniques On Copper Deep Levels Formation And On Photoconductivity In Silicon Doped Gallium Arsenide, Lucy M. Thomas

Electrical & Computer Engineering Theses & Dissertations

Diffusion of copper in silicon doped gallium arsenide under different diffusion conditions is studied. Copper compensated silicon doped gallium arsenide (GaAs:Si:Cu) is used as switch material for bulk optically controlled semiconductor switch, and on-state photoconductivity of the switch is primarily due to the properties of the copper deep levels introduced in the material during diffusion. Gallium arsenide being a compound semiconductor, presence of vacancies and defects make the study of diffusion a complex process. The objective of the current research is twofold: a) to study the influence of diffusion conditions and processing techniques on copper deep level formation in silicon …

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Influence Of Copper Doping On The Performance Of Optically Controlled Gaas Switches, St. T. Ko, V. K. Lakdawala, K. H. Schoenbach, M. S. Mazzola Jan 1990

Influence Of Copper Doping On The Performance Of Optically Controlled Gaas Switches, St. T. Ko, V. K. Lakdawala, K. H. Schoenbach, M. S. Mazzola

Electrical & Computer Engineering Faculty Publications

The influence of the copper concentration in silicon-doped gallium arsenide on the photoionization and photoquenching of charge carriers was studied both experimentally and theoretically. The studies indicate that the compensation ratio (NCu/NSi) is an important parameter for the GaAs:Si:Cu switch systems with regard to the turn-on and turn-off performance. The optimum copper concentration for the use of GaAs:Si:Cu as an optically controlled closing and opening switch is determined.

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An Optically Controlled Closing And Opening Semiconductor Switch, K. H. Schoenbach, V. K. Lakdawala, R. Germer, S. T. Ko Jan 1988

An Optically Controlled Closing And Opening Semiconductor Switch, K. H. Schoenbach, V. K. Lakdawala, R. Germer, S. T. Ko

Electrical & Computer Engineering Faculty Publications

A concept for a bulk semiconductor switch is presented, where the conductivity is increased and reduced, respectively, through illumination with light of different wavelengths. The increase in conductivity is accomplished by electron ionization from deep centers and generation of bound holes. The reduction of conductivity is obtained by hole ionization from the excited centers and subsequent recombination of free electrons and holes. The transient behavior of electron and hole density in a high power semiconductor (GaAs:Cu) switch is computed by means of a rate equation model. Changes in conductivity by five orders of magnitude can be obtained.

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Copper Converter: Basic Research Testing With A Plastic Model Converter And Four Types Of Refractories, Arthur C. Bigley Jr. May 1960

Copper Converter: Basic Research Testing With A Plastic Model Converter And Four Types Of Refractories, Arthur C. Bigley Jr.

Bachelors Theses and Reports, 1928 - 1970

In recent years there has appeared an increasing number of papers on converting operations as related to thermodynamics. This approach is a powerful, potential tool. However, the development of new ideas and changes must rely on accurate basic information.

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Secondary Recrystallization In Copper, James E. Thompson May 1960

Secondary Recrystallization In Copper, James E. Thompson

Bachelors Theses and Reports, 1928 - 1970

The purpose of this thesis is to study the conditions under which secondary recrystallization will take place in copper. The variables considered were the time annealing, the temperature of annealing, and the degree of cold work undergone by the specimen before it was subjected to the heat treatment.

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Stress-Induced Martensite Transformation In An Alloy Of The Copper-Aluminum-Nickel System, Gary D. Alexander May 1959

Stress-Induced Martensite Transformation In An Alloy Of The Copper-Aluminum-Nickel System, Gary D. Alexander

Bachelors Theses and Reports, 1928 - 1970

It was intended that the alloy be thoroughly investigated for martensite transformation that would make the alloy "super-elastic," but due to the many difficulties that arose this was not possible. Attempts to grow a single crystal from the cast alloy were not successful because of the difficulties that were encountered with the Kanthal resistance furnace (referred to later). Consequently, the growing of the single crystal was abandoned and the alloy was tested in the poly-crystalline form.

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Electrolytic Refining Of Copper By The Series System, Jerome Yopps May 1959

Electrolytic Refining Of Copper By The Series System, Jerome Yopps

Bachelors Theses and Reports, 1928 - 1970

The purpose of this thesis investigation was to determine the characteristics of the series system of electrolytic refining of copper.

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The Application Of Amalgam Metallurgy To Copper, Barry J. Hansen May 1958

The Application Of Amalgam Metallurgy To Copper, Barry J. Hansen

Bachelors Theses and Reports, 1928 - 1970

The object of this investigation is the application of "Amalgam Metallurgy" to the extraction of copper from its ores. "Amalgam Metallurgy" as defined by Hohn is the use of liquid mercury in the extraction of metals. The ore under study was from the Kelly Mine in Butte, Montana and contains about 1.0% copper of which about 0.1% is acid soluble.

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Effect Of Recovery On The Recrystallized Grain-Size Of High Purity Aluminum, Rodney L. Helterline Jun 1954

Effect Of Recovery On The Recrystallized Grain-Size Of High Purity Aluminum, Rodney L. Helterline

Bachelors Theses and Reports, 1928 - 1970

When a cold-worked metal is annealed, it’s physical properties hange as a result of a new grain structure. The annealing treatment is divided into three stages according to the changes that occur in the distorted metal: (1) recovery, (2) recrystallization, and (3) grain growth.

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The Application Of Electric Energy To The Metallurgy Plants In Montana, Edwin J. Duncan Sep 1953

The Application Of Electric Energy To The Metallurgy Plants In Montana, Edwin J. Duncan

Bachelors Theses and Reports, 1928 - 1970

Since the year 1800, metallurgy has been affiliated with electricity. In fact, the two industries have grown side by side, being naturally dependent upon each other and having a parallel growth.

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The Construction And Operation Of A Universal Specimen Mount With Protective Lead Shield For The Purpose Of Determining Pole Figures Using The Schulz-Decker Transmission Technique, Richard L. Fausner Jun 1953

The Construction And Operation Of A Universal Specimen Mount With Protective Lead Shield For The Purpose Of Determining Pole Figures Using The Schulz-Decker Transmission Technique, Richard L. Fausner

Bachelors Theses and Reports, 1928 - 1970

It was the purpose of this study to construct a universal mount, to construct a protective lead shield, to operate the instrument, and to provide a pole figure using the transmission method of Schulz and Decker. There are at present several lengthy x-ray methods of determining the grain orientation of metals. These methods are mainly photographic. In order to provide a rapid means of obtaining the necessary information concerning the grain orientation of a metal, a universal mount was constructed.

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Host Rocks And Gangue Minerals Associated With Copper Deposits In Plutonic Igneous Rocks, Richard D. Montgomery May 1953

Host Rocks And Gangue Minerals Associated With Copper Deposits In Plutonic Igneous Rocks, Richard D. Montgomery

Bachelors Theses and Reports, 1928 - 1970

All of the information on the various districts has come directly from published reports. The investigation was suggested by Mr. Forbes Robertson. The geographical extent of the deposits was confined to the western United States. Many of these deposits are of the disseminated porphyry type. A few of the de­posits, such as at Butte, Montana, were of the fissure vein type.

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