Open Access. Powered by Scholars. Published by Universities.®
- Institution
- Keyword
-
- 3D IC (1)
- Alcohol (1)
- Annealing (1)
- Calibration (1)
- Copper Nanowires (1)
-
- Copper Resistivity (1)
- Device-to-system Simulation (1)
- Electron Beam Lithography (1)
- Isoflurane (1)
- Liquid Phase Electron Beam Induced Deposition (1)
- Multivariate (1)
- Nanowire (1)
- Power Delivery Network (1)
- Principal component regression (PCR) (1)
- Proton exchange membrane fuel cell (PEMFC) (1)
- Routability (1)
- SRAM (1)
- Sensor (1)
- Volatile organic compound (VOC) (1)
- Publication
- Publication Type
Articles 1 - 3 of 3
Full-Text Articles in Nanotechnology Fabrication
Multivariate Analysis For The Quantification Of Transdermal Volatile Organic Compounds In Humans By Proton Exchange Membrane Fuel Cell System, Ahmed Hasnain Jalal
Multivariate Analysis For The Quantification Of Transdermal Volatile Organic Compounds In Humans By Proton Exchange Membrane Fuel Cell System, Ahmed Hasnain Jalal
FIU Electronic Theses and Dissertations
In this research, a proton exchange membrane fuel cell (PEMFC) sensor was investigated for specific detection of volatile organic compounds (VOCs) for point-of-care (POC) diagnosis of the physiological conditions of humans. A PEMFC is an electrochemical transducer that converts chemical energy into electrical energy. A Redox reaction takes place at its electrodes whereas the volatile biomolecules (e.g. ethanol) are oxidized at the anode and ambient oxygen is reduced at the cathode. The compounds which were the focus of this investigation were ethanol (C2H5OH) and isoflurane (C3H2ClF5O), but theoretically, the sensor …
Skybridge-3d-Cmos: A Fine-Grained Vertical 3d-Cmos Technology Paving New Direction For 3d Ic, Jiajun Shi
Skybridge-3d-Cmos: A Fine-Grained Vertical 3d-Cmos Technology Paving New Direction For 3d Ic, Jiajun Shi
Doctoral Dissertations
2D CMOS integrated circuit (IC) technology scaling faces severe challenges that result from device scaling limitations, interconnect bottleneck that dominates power and performance, etc. 3D ICs with die-die and layer-layer stacking using Through Silicon Vias (TSVs) and Monolithic Inter-layer Vias (MIVs) have been explored in recent years to generate circuits with considerable interconnect saving for continuing technology scaling. However, these 3D IC technologies still rely on conventional 2D CMOS’s device, circuit and interconnect mindset showing only incremental benefits while adding new challenges reliability issues, robustness of power delivery network design and short-channel effects as technology node scaling. Skybridge-3D-CMOS (S3DC) is …
Parameters Affecting The Resistivity Of Lp-Ebid Deposited Copper Nanowires, Gabriel Smith
Parameters Affecting The Resistivity Of Lp-Ebid Deposited Copper Nanowires, Gabriel Smith
Theses and Dissertations--Electrical and Computer Engineering
Electron Beam Induced Deposition (EBID) is a direct write fabrication process with applications in circuit edit and debug, mask repair, and rapid prototyping. However, it suffers from significant drawbacks, most notably low purity. Work over the last several years has demonstrated that deposition from bulk liquid precursors, rather than organometallic gaseous precursors, results in high purity deposits of low resistivity (LPEBID). In this work, it is shown that the deposits resulting from LP-EBID are only highly conductive when deposited at line doses below 25μC/cm. When the dose exceeds this value, the resulting structure is highly porous providing a poor conductive …