Nanotechnology Fabrication Commons^™

Skybridge-3d-Cmos: A Fine-Grained Vertical 3d-Cmos Technology Paving New Direction For 3d Ic, Jiajun Shi

Doctoral Dissertations

2D CMOS integrated circuit (IC) technology scaling faces severe challenges that result from device scaling limitations, interconnect bottleneck that dominates power and performance, etc. 3D ICs with die-die and layer-layer stacking using Through Silicon Vias (TSVs) and Monolithic Inter-layer Vias (MIVs) have been explored in recent years to generate circuits with considerable interconnect saving for continuing technology scaling. However, these 3D IC technologies still rely on conventional 2D CMOS’s device, circuit and interconnect mindset showing only incremental benefits while adding new challenges reliability issues, robustness of power delivery network design and short-channel effects as technology node scaling. Skybridge-3D-CMOS (S3DC) is …

Skynet: Memristor-Based 3d Ic For Artificial Neural Networks, Sachin Bhat

Masters Theses

Hardware implementations of artificial neural networks (ANNs) have become feasible due to the advent of persistent 2-terminal devices such as memristor, phase change memory, MTJs, etc. Hybrid memristor crossbar/CMOS systems have been studied extensively and demonstrated experimentally. In these circuits, memristors located at each cross point in a crossbar are, however, stacked on top of CMOS circuits using back end of line processing (BOEL), limiting scaling. Each neuron’s functionality is spread across layers of CMOS and memristor crossbar and thus cannot support the required connectivity to implement large-scale multi-layered ANNs.

This work proposes a new fine-grained 3D integrated circuit technology …

Skybridge: A New Nanoscale 3-D Computing Framework For Future Integrated Circuits, Mostafizur Rahman

Doctoral Dissertations

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, continuing the traditional way of scaling to sub-20nm technologies is proving to be very difficult as MOSFETs are reaching their fundamental performance limits [1] and interconnection bottleneck is dominating IC operational power and performance [2]. Migrating to 3-D, as a way to advance scaling, has been elusive due to inherent customization and manufacturing requirements in CMOS architecture that are incompatible with 3-D organization. Partial attempts with die-die [3] and layer-layer [4] stacking have their own limitations [5]. We …

Architecting Np-Dynamic Skybridge, Jiajun Shi

Masters Theses

With the scaling of technology nodes, modern CMOS integrated circuits face severe fundamental challenges that stem from device scaling limitations, interconnection bottlenecks and increasing manufacturing complexities. These challenges drive researchers to look for revolutionary technologies beyond the end of CMOS roadmap. Towards this end, a new nanoscale 3-D computing fabric for future integrated circuits, Skybridge, has been proposed [1]. In this new fabric, core aspects from device to circuit style, connectivity, thermal management and manufacturing pathway are co-architected in a 3-D fabric-centric manner.

However, the Skybridge fabric uses only n-type transistors in a dynamic circuit style for logic and memory …

A Novel Reconfiguration Scheme In Quantum-Dot Cellular Automata For Energy Efficient Nanocomputing, Madhusudan Chilakam

Masters Theses 1911 - February 2014

Quantum-Dot Cellular Automata (QCA) is currently being investigated as an alternative to CMOS technology. There has been extensive study on a wide range of circuits from simple logical circuits such as adders to complex circuits such as 4-bit processors. At the same time, little if any work has been done in considering the possibility of reconfiguration to reduce power in QCA devices. This work presents one of the first such efforts when considering reconfigurable QCA architectures which are expected to be both robust and power efficient. We present a new reconfiguration scheme which is highly robust and is expected to …

Parameter Variation Sensing And Estimation In Nanoscale Fabrics, Jianfeng Zhang

Masters Theses 1911 - February 2014

Parameter variations introduced by manufacturing imprecision are becoming more influential on circuit performance. This is especially the case in emerging nanoscale fabrics due to unconventional manufacturing steps (e.g., nano-imprint) and aggressive scaling. These parameter variations can lead to performance deterioration and consequently yield loss.

Parameter variations are typically addressed pre-fabrication with circuit design targeting worst-case timing scenarios. However, this approach is pessimistic and much of performance benefits can be lost. By contrast, if parameter variations can be estimated post-manufacturing, adaptive techniques or reconfiguration could be used to provide more optimal level of tolerance. To estimate parameter variations during run-time, on-chip …

N3asics: Designing Nanofabrics With Fine-Grained Cmos Integration, Pavan Panchapakeshan

Masters Theses 1911 - February 2014

Nanoscale-computing fabrics based on novel materials such as semiconductor nanowires, carbon nanotubes, graphene, etc. have been proposed in recent years. These fabrics employ unconventional manufacturing techniques like Nano-imprint lithography or Super-lattice Nanowire Pattern Transfer to produce ultra-dense nano-structures. However, one key challenge that has received limited attention is the interfacing of unconventional/self-assembly based approaches with conventional CMOS manufacturing to build integrated systems.

We propose a novel nanofabric approach that mixes unconventional nanomanufacturing with CMOS manufacturing flow and design rules to build a reliable nanowire-CMOS 3-D integrated fabric called N³ASICs with no new manufacturing constraints. In N³ASICs …

Towards Logic Functions As The Device Using Spin Wave Functions Nanofabric, Prasad Shabadi

Masters Theses 1911 - February 2014

As CMOS technology scaling is fast approaching its fundamental limits, several new nano-electronic devices have been proposed as possible alternatives to MOSFETs. Research on emerging devices mainly focusses on improving the intrinsic characteristics of these single devices keeping the overall integration approach fairly conventional. However, due to high logic complexity and wiring requirements, the overall system-level power, performance and area do not scale proportional to that of individual devices.

Thereby, we propose a fundamental shift in mindset, to make the devices themselves more functional than simple switches. Our goal in this thesis is to develop a new nanoscale fabric paradigm …