Open Access. Powered by Scholars. Published by Universities.®

Articles 1 - 7 of 7

Full-Text Articles in Electronic Devices and Semiconductor Manufacturing

Indirect Matrix Converter As Standard Power Electronic Interface, Andrés Escobar-Mejía Dec 2014

Indirect Matrix Converter As Standard Power Electronic Interface, Andrés Escobar-Mejía

Graduate Theses and Dissertations

The increase in the penetration levels of distributed generation in the modern power grid and its importance in future energy systems have accelerated the interest of developing new power electronic interfaces for the energy conversion process. The feasibility of applying the indirect matrix converter as the standard power electronic interface for applications with power ratings from several kW to few MW is addressed in this dissertation. Special attention is given to those applications where space dominates the power electronic requirements. The main motivation for using the indirect matrix converter is that eliminates the energy storage component in the way of …


Gesn Devices For Short-Wave Infrared Optoelectronics, Benjamin Ryan Conley Dec 2014

Gesn Devices For Short-Wave Infrared Optoelectronics, Benjamin Ryan Conley

Graduate Theses and Dissertations

The electronics industry has a large silicon infrastructure for the manufacture of complementary-metal oxide semiconductor (CMOS) based electronics. The increasing density of Si based circuits has set a pace that is now pushing the physical limits of connectivity between devices over conventional wire based links. This has driven the increasing interest in Si based optoelectronics and to use the groundwork already established by the electronics industry for lower cost optical communications. The greatest limitation to this effort has been the incorporation of a Si based laser, which requires integration of a direct bandgap material within this CMOS process.

The Ge1-xSnx …


Design Of A High Performance Silicon Carbide Cmos Operational Amplifier, Shaila Amin Bhuyan Dec 2014

Design Of A High Performance Silicon Carbide Cmos Operational Amplifier, Shaila Amin Bhuyan

Graduate Theses and Dissertations

This thesis presents the design, simulation, layout and test results of a silicon carbide (SiC) CMOS two-stage operational amplifier (op amp) with NMOS input stage. The circuit has been designed to provide a stable open-loop voltage gain (60 dB), unity-gain bandwidth (around 5 MHz) and maintain a high CMRR and PSRR within a useful input common mode range over process corners and a wide temperature range (25 °C - 300 °C). Between the two stages a Miller compensation topology is placed to improve the phase margin (around 45°). Due to the comparatively high threshold voltage values of transistors in SiC, …


Design, Simulation And Implementation Of Three-Phase Bidirectional Dc-Dc Dual Active Bridge Converter Using Sic Mosfets, Tariq Aldawsari Dec 2014

Design, Simulation And Implementation Of Three-Phase Bidirectional Dc-Dc Dual Active Bridge Converter Using Sic Mosfets, Tariq Aldawsari

Graduate Theses and Dissertations

The use of SiC-based martials in fabricating power semiconductor devices has shown more interest than conventional silicon-based. Its promising abilities to improve the performance of power electronic systems made it a valuable choice in building high power DC-DC converters. This thesis presents the design and implementation of a three-phase bidirectional DC-DC Dual Active Bridge using SiC MOSFETs. The proposed circuit is first built in Matlab for simulation analysis. Then a phase shift modulation controller is designed in Simulink to test the simulation circuit. The controls are then integrated through an FPGA to test the prototype. Simulations and experimental results are …


Development Of Micro-Hall Devices For Current Sensing, Thomas White Dec 2014

Development Of Micro-Hall Devices For Current Sensing, Thomas White

Graduate Theses and Dissertations

In this work, micro-Hall devices were developed for the purpose of sensing current within a high temperature and high power environment. GaAs HEMT, InGaAs pHEMT, and GaN HEMT structures were studied. These structures were grown by molecular beam epitaxy. Processing techniques including photolithography, metallization, Si deposition, wet etching, and dry etching were studied. Electrical characterization measurements including low frequency noise, Hall effect, sensitivity, capacitance-voltage, and current-voltage were performed.

Electron mobility and sheet carrier density studies were performed for both the InGaAs pHEMT and GaAs HEMT structures. Results indicated the InGaAs pHEMT was superior and thus fabricated as the micro-Hall device. …


Synthesis And Characterization Of Nanocrystals And Their Application For Photodetectors, Ahmad Nusir May 2014

Synthesis And Characterization Of Nanocrystals And Their Application For Photodetectors, Ahmad Nusir

Graduate Theses and Dissertations

Room temperature operation is considered one of the essential restrictions in the design of electronic devices. Photodetectors are unable to detect light efficiently at room temperature due to high dark currents. Semiconductor nanocrystals possess unique optical and electrical properties which make them ideal for fabricating uncooled photodetectors. In this project, nanocrystals were synthesized and implemented in devices that detect light at room temperature.

Nanocrystalline I-III-VI2 and II-VI semiconductors (CuInS2 and CdSe) were grown by a wet chemical method, and characterized using: optical absorption, photoluminescence, Raman scattering, and x-ray diffraction. The optical absorption and photoluminescence spectra of the nanocrystals were recorded …


High Temperature Ltcc Based Sic Double-Sided Cooling Power Electronic Module, Hao Zhang May 2014

High Temperature Ltcc Based Sic Double-Sided Cooling Power Electronic Module, Hao Zhang

Graduate Theses and Dissertations

This objective of this dissertation research is to investigate a module packaging technology for high temperature double-sided cooling power electronic module application. A high-temperature wire-bondless low-temperature co-fired ceramic (LTCC) based double-sided cooling power electronic module was designed, simulated and fabricated. In this module, the conventional copper base plate is removed to reduce the thermal resistance between the device junctions to the heat sink and to improve the reliability of the module by eliminating the large area solder joint between the power substrate and the copper base plate. A low-temperature co-fired ceramic (LTCC) substrate with cavities and vias is used as …