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Articles 91 - 93 of 93
Full-Text Articles in Nanoscience and Nanotechnology
Bioengineering In Vitro Human Trabecular Meshwork Models For Glaucoma Therapeutic Screening, Karen Yud Torrejon
Bioengineering In Vitro Human Trabecular Meshwork Models For Glaucoma Therapeutic Screening, Karen Yud Torrejon
Legacy Theses & Dissertations (2009 - 2024)
Glaucoma refers to a group of slowly progressing eye disorders that lead to damage to the optic nerve, resulting in irreversible vision loss. Recent statistics by the World Health Organization places glaucoma as a leading cause of blindness worldwide, affecting nearly 80 million people. Lowering intraocular pressure (IOP) is currently the only effective target for therapeutic intervention in glaucoma. IOP is mostly controlled by the outflow of the aqueous humor (AH) through the trabecular meshwork (TM). The TM and adjacent endothelium of Schlemm’s canal, known as the conventional outflow-tract, control AH outflow and thus determine IOP.
Brown Adipogenesis Of Mouse Embryonic Stem Cells In Alginate Microstrands, Andrea Mannarino Unser
Brown Adipogenesis Of Mouse Embryonic Stem Cells In Alginate Microstrands, Andrea Mannarino Unser
Legacy Theses & Dissertations (2009 - 2024)
The ability of brown adipocytes (fat cells) to dissipate energy as heat shows great promise for the treatment of obesity and other metabolic disorders. Employing pluripotent stem cells, with an emphasis on directed differentiation, may overcome many issues currently associated with primary fat cell cultures. However, brown adipocytes are difficult to transplant in vivo due to the instability of fat, in terms of necrosis and neovascularization, once injected. Thus, 3D cell culture systems that have the potential to mimic adipogenic microenvironments are needed, not only to advance brown fat implantation, but also to better understand the role of brown adipocytes …
High Frequency Signal Transmission In Through Silicon Via Based 3d Integrated Circuit, Min Xu
High Frequency Signal Transmission In Through Silicon Via Based 3d Integrated Circuit, Min Xu
Legacy Theses & Dissertations (2009 - 2024)
Through silicon vias (TSVs) enable 3-dimensional (3D) integrated circuits (ICs), which have the potential to reduce the power consumption, interconnect length and overall communication latency in modern nanoelectronics systems. High-speed signal transmission channels through stacked silicon substrates are critical for 3D heterogeneous integration. This work presents systematic analyses of fabricated 3D IC test structures. This includes test structure design, fabrication, experimental characterization, equivalent circuit modeling and full wave simulations for high-speed signal transmission of the TSV based 3D IC channels.