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Full-Text Articles in Mechanical Engineering
Modifications To Johanson's Roll Compaction Model For Improved Relative Density Predictions, Yu Liu
Modifications To Johanson's Roll Compaction Model For Improved Relative Density Predictions, Yu Liu
Open Access Theses
Johanson’s roll compaction model [J.R. Johanson, A rolling theory for granular solids, ASME Journal of Applied Mechanics E32 (1965) 842–848] is modified to improve its predictions of a compacted ribbon’s relative density. Previous work has shown that the maximum roll pressure and ribbon relative density predicted by the Johanson model are not only larger than those predicted from finite element method (FEM) simulations, but also unphysical in some cases. This over-prediction is due to a one-dimensional flow assumption in the Johanson model. Real powder velocity profiles within a roll compactor are non-uniform.
Johanson’s analysis is modified in this work to …
Experimental Characterization Of Cu Free-Air Ball And Simulations Of Dielectric Fracture During Wire Bonding, Sai Sudharsanan Paranjothy
Experimental Characterization Of Cu Free-Air Ball And Simulations Of Dielectric Fracture During Wire Bonding, Sai Sudharsanan Paranjothy
Open Access Theses
Wire bonding is the process of forming electrical connection between the integrated circuit (IC) and its structural package. ICs made of material with low dielectric constant (low-k) and ultra low-k are porous in nature, and are prone to fracture induced failure during packaging process. In recent years, there is increasing interest in copper wire bond technology as an alternative to gold wire bond in microelectronic devices due to its superior electrical performance and low cost. Copper wires are also approximately 25% more conductive than Au wires aiding in better heat dissipation. At present, validated constitutive models for the strain rate …