Mechanical Engineering Commons^™

Experimental Characterization Of Cu Free-Air Ball And Simulations Of Dielectric Fracture During Wire Bonding, Sai Sudharsanan Paranjothy

Open Access Theses

Wire bonding is the process of forming electrical connection between the integrated circuit (IC) and its structural package. ICs made of material with low dielectric constant (low-k) and ultra low-k are porous in nature, and are prone to fracture induced failure during packaging process. In recent years, there is increasing interest in copper wire bond technology as an alternative to gold wire bond in microelectronic devices due to its superior electrical performance and low cost. Copper wires are also approximately 25% more conductive than Au wires aiding in better heat dissipation. At present, validated constitutive models for the strain rate …