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Full-Text Articles in Semiconductor and Optical Materials
Application Of Electrolessplating Technology In Interconnection Manufacturing Of Ultralarge-Scale Integration, Zeng-Lin Wang
Application Of Electrolessplating Technology In Interconnection Manufacturing Of Ultralarge-Scale Integration, Zeng-Lin Wang
Journal of Electrochemistry
In this paper,research progresses in electroless plating for damascene copper process were reviewed.Electroless nickel ternary alloy deposition for barrier layer and electroless copper plating for seed layer were presented.Bottom-up copper fill high-aspect-via-hole and electroless plating after ICB-Pd catalytic layer for seed layer were mainly introduced.The applications of electroless plating in ultralarge-scale integration were discussed,and the developing tendency was also suggested.
Special Photoelectrochemical Response Of Nano-Crystalline Tio_2 Electrode, Bi-Bo Lan, Jian-Zhang Zhou, Yan-Yan Xi, Hong-Xiang Chen, Guang-Hua Yao, Zhong-Hua Lin
Special Photoelectrochemical Response Of Nano-Crystalline Tio_2 Electrode, Bi-Bo Lan, Jian-Zhang Zhou, Yan-Yan Xi, Hong-Xiang Chen, Guang-Hua Yao, Zhong-Hua Lin
Journal of Electrochemistry
The nano-crystalline TiO_2 electrodes were prepared by spread method,electrodeposition and sol-gel method.The experimental results show that the nano-crystalline TiO_2 electrodes have special photoelectrochemical response-the photocrrent-potential curves appear peaks.The special photoelectrochemical behaviors of nano-(crystalline) TiO_2 electrodes are ascribed to nano-structure as well as special light induced redox reaction mechanism of nano-crystalline semiconductor electrodes.