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Full-Text Articles in Electronic Devices and Semiconductor Manufacturing

Electrothermal Properties Of 2d Materials In Device Applications, Samantha L. Klein Apr 2023

Electrothermal Properties Of 2d Materials In Device Applications, Samantha L. Klein

Masters Theses

To keep downsizing transistors, new materials must be explored since traditional 3D materials begin to experience tunneling and other problematic physical phenomena at small sizes. 2D materials are appealing due to their thinness and bandgap. The relatively weak van der Waals forces between layers in 2D materials allow easy exfoliation and device fabrication but they also result in poor heat transfer to the substrate, which is the main path for heat removal. The impaired thermal coupling is exacerbated in few-layer devices where heat dissipated in the layers further from the substrate encounters additional interlayer thermal resistance before reaching the substrate, …


Electro-Thermal Transport In Two-Dimensional Materials And Their Heterostructures, Arnab K. Majee Jun 2021

Electro-Thermal Transport In Two-Dimensional Materials And Their Heterostructures, Arnab K. Majee

Doctoral Dissertations

”Smaller is better” is the mantra that has driven semiconductor industry for the past 50 years. The on-going quest for faster electronic switching, higher transistor density, and better device performance, has been driven by a self-fulfilling prophecy popularly known as Moore’s law, according to which the number of transistors per unit area of a chip doubles itself approximately every two years. A modern smartphone has about 8 billion transistors, which is as large as current earth’s population. Although each transistor dissipates negligible power, but the collective power dissipation from all the transistors in an electronic gadget and inefficient heat removing …