Electronic Devices and Semiconductor Manufacturing Commons^™

Electrothermal Properties Of 2d Materials In Device Applications, Samantha L. Klein

Masters Theses

To keep downsizing transistors, new materials must be explored since traditional 3D materials begin to experience tunneling and other problematic physical phenomena at small sizes. 2D materials are appealing due to their thinness and bandgap. The relatively weak van der Waals forces between layers in 2D materials allow easy exfoliation and device fabrication but they also result in poor heat transfer to the substrate, which is the main path for heat removal. The impaired thermal coupling is exacerbated in few-layer devices where heat dissipated in the layers further from the substrate encounters additional interlayer thermal resistance before reaching the substrate, …