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Electrical and Electronics

University at Albany, State University of New York

2015

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3d Integration With Coaxial Through Silicon Vias, Stephen Adamshick Jan 2015

3d Integration With Coaxial Through Silicon Vias, Stephen Adamshick

Legacy Theses & Dissertations (2009 - 2024)

3D integration using through-silicon-vias (TSVs) is gaining considerable attention due to its superior packaging efficiency resulting in higher functionality, improved performance and a reduction in power consumption. In order to implement 3D chip designs with TSV technology, robust TSV electrical models are required. Specifically, due to the increase of signal speeds into the gigahertz (GHz) spectrum, a high frequency electrical characterization best describes TSV behavior.

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