Structures and Materials Commons^™

High Heat Flux Cooling For Spacecraft Electronics, Louis C. Chow, John E. Leland

Office for Research Publications and Presentations

An experimental investigation of flow boiling in a curved channel has been performed to ascertain its value in electronics cooling applications. Results have been obtained for flow velocities of 1 to 5 m/s and subcooling of 0.5 to 40 K. These results were compared to those of straight channel under identical velocity and subcooling conditions. The critical heat flux of the curved channel was found to be greater than that of the straight channel. In some cases the increase was found to be marginal, however. An unexplained temperature shift in the nucleate boiling regime was experienced during some experiments. Because …