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Articles 1 - 6 of 6
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The Effects Of Snagcu Solder Interconnect Package’S Parameters On Electromigration Failure Mechanisms, Yi Ram Kim
The Effects Of Snagcu Solder Interconnect Package’S Parameters On Electromigration Failure Mechanisms, Yi Ram Kim
Material Science and Engineering Dissertations
The primary concern of this dissertation is the electromigration (EM) failure mechanism found in Sn-Ag-Cu (SAC) solder alloys integrated in WCSP (wafer-level chip scale package) packaging structure and factors affecting the failure mechanisms. To the end, accelerated electromigration (EM) tests are conducted on SnAgCu (SAC) solder interconnects in wafer-level chip scale packages (WCSPs or WLCSPs) with different package structures and use-condition parameters. The package structure parameters include different under bump metallization (UBM) thicknesses, Sn grain orientation, while the various in use conditions includes pulsed direct current (DC), and alternating current (AC). The major findings made in the studies are presented …
Study Of Sac Solder Interconnect Parameters In Microelectronic Semiconductor Packaging And Their Effects On Electromigration Failure Mechanisms, Allison Theresa Osmanson
Study Of Sac Solder Interconnect Parameters In Microelectronic Semiconductor Packaging And Their Effects On Electromigration Failure Mechanisms, Allison Theresa Osmanson
Material Science and Engineering Dissertations
As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve smaller devices, reduced sizes of solder joints, Cu traces, Cu pads, and other components in packages are implemented with tighter tolerances for geometries and layouts. With each incremental change in dimension or material, new reliability challenges emerge. Electromigration (EM), the directional diffusion of atoms with the flow of electrons, has been an inevitable reliability concern for microelectronic device packaging. It is one common failure mechanism in wafer-level …
Surface Modification Of Titanium By Electrolytic Plasma Processing And In-Vitro Studies, Wisanu Boonrawd
Surface Modification Of Titanium By Electrolytic Plasma Processing And In-Vitro Studies, Wisanu Boonrawd
Material Science and Engineering Dissertations
Electrolytic plasma processing (EPP) can be operated in two modes, namely plasma electrolytic saturation (PES) and plasma electrolytic oxidation (PEO). In this study, the PES was used to create hydrophilic surface profiles on titanium (Ti). The wettability, surface morphology characteristics and chemical composition of the treated samples were studied as a function of PES processing parameters. The PES profiled surfaces comprised of a characteristic “hills and valleys” morphology because of continuous surface melting and freezing cycles. A bimodal surface profile was produced with 2-3 µm height hills and valleys with nano-roughness (= 200 nm). The produced profile resulted in a …
Amorphous Silica Based Biomaterials For Musculoskeletal Tissue Regeneration Applications, Kamal Awad
Amorphous Silica Based Biomaterials For Musculoskeletal Tissue Regeneration Applications, Kamal Awad
Material Science and Engineering Dissertations
Musculoskeletal (MSK) injury includes any injuries that affect the bones, muscles, ligaments, tendons, or nerves. Open bone fracture is one of the common types of MSK traumatic injuries which results in not only bone fracture but also damage/loss of associated muscles, nerve, vasculature, endothelium, periosteum, fascia, and connective tissue. Surgical procedures and biological interventions are required to fix the broken bone, and muscle transfer is performed to compensate the skeletal muscle defects. Current treatments include fixative metal implants and regenerative biopolymer scaffolds, then muscle flap procedures to cover the bone. Yet, these treatments are inadequate because the used materials do …
Study Of Electromigration Failure Mechanism In Micro Solder Joint, Hossein Madanipour
Study Of Electromigration Failure Mechanism In Micro Solder Joint, Hossein Madanipour
Material Science and Engineering Dissertations
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables devices with far higher interconnect density and miniaturized form factors which are ideal for mobile applications. The focus of this research is to conduct comprehensive investigation on the electromigration (EM) reliability of micro solder joint. For that purpose, a series of EM tests on micro solder joints under direct current (DC) load was conducted with variation in the contributing factors to EM failure, including solder joint arrangement (change of …
Metal Nanodendrites And Their Applications As 3d Surface Enhanced Scattering (Sers) Substrates, Aseem Athavale
Metal Nanodendrites And Their Applications As 3d Surface Enhanced Scattering (Sers) Substrates, Aseem Athavale
Material Science and Engineering Dissertations
Ultrasensitive detection of chemicals and biological analytes has been a focus of a lot of studies in the recent years. In this search for the versatile detection technique, Surface Enhanced Raman Spectroscopy (SERS) has proved to be one powerful method. SERS is a powerful vibrational spectroscopy technique that allows for label free ultrasensitive detection. This method utilizes the Localized Surface Plasmon resonance (LSPR) effect of nanoparticles. LSPR effect is profound in noble metals such as silver (Ag) and gold (Au). We have developed a novel SERS substrate using Ag dendrites that can be applied as a ready-to-use device in a …