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Study Of Sac Solder Interconnect Parameters In Microelectronic Semiconductor Packaging And Their Effects On Electromigration Failure Mechanisms, Allison Theresa Osmanson
Study Of Sac Solder Interconnect Parameters In Microelectronic Semiconductor Packaging And Their Effects On Electromigration Failure Mechanisms, Allison Theresa Osmanson
Material Science and Engineering Dissertations
As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve smaller devices, reduced sizes of solder joints, Cu traces, Cu pads, and other components in packages are implemented with tighter tolerances for geometries and layouts. With each incremental change in dimension or material, new reliability challenges emerge. Electromigration (EM), the directional diffusion of atoms with the flow of electrons, has been an inevitable reliability concern for microelectronic device packaging. It is one common failure mechanism in wafer-level …
The Effects Of Snagcu Solder Interconnect Package’S Parameters On Electromigration Failure Mechanisms, Yi Ram Kim
The Effects Of Snagcu Solder Interconnect Package’S Parameters On Electromigration Failure Mechanisms, Yi Ram Kim
Material Science and Engineering Dissertations
The primary concern of this dissertation is the electromigration (EM) failure mechanism found in Sn-Ag-Cu (SAC) solder alloys integrated in WCSP (wafer-level chip scale package) packaging structure and factors affecting the failure mechanisms. To the end, accelerated electromigration (EM) tests are conducted on SnAgCu (SAC) solder interconnects in wafer-level chip scale packages (WCSPs or WLCSPs) with different package structures and use-condition parameters. The package structure parameters include different under bump metallization (UBM) thicknesses, Sn grain orientation, while the various in use conditions includes pulsed direct current (DC), and alternating current (AC). The major findings made in the studies are presented …
Study Of Electromigration Failure Mechanism In Micro Solder Joint, Hossein Madanipour
Study Of Electromigration Failure Mechanism In Micro Solder Joint, Hossein Madanipour
Material Science and Engineering Dissertations
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables devices with far higher interconnect density and miniaturized form factors which are ideal for mobile applications. The focus of this research is to conduct comprehensive investigation on the electromigration (EM) reliability of micro solder joint. For that purpose, a series of EM tests on micro solder joints under direct current (DC) load was conducted with variation in the contributing factors to EM failure, including solder joint arrangement (change of …