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Study Of Electromigration Failure Mechanism In Micro Solder Joint, Hossein Madanipour
Study Of Electromigration Failure Mechanism In Micro Solder Joint, Hossein Madanipour
Material Science and Engineering Dissertations
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables devices with far higher interconnect density and miniaturized form factors which are ideal for mobile applications. The focus of this research is to conduct comprehensive investigation on the electromigration (EM) reliability of micro solder joint. For that purpose, a series of EM tests on micro solder joints under direct current (DC) load was conducted with variation in the contributing factors to EM failure, including solder joint arrangement (change of …