Industrial Engineering Commons^™

The Effect Of Reflow Profile On Snpb And Snagcu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee

Industrial and Manufacturing Engineering

Purpose –The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.

Design/methodology/approach –Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three levels of peak temperature (230°C, 240°C, and 250°C for Sn3.0Ag0.5Cu; and 195°C, 205°C, and 215°C for Sn37Pb) and three levels of time above solder liquidus temperature (30, 60, and 90 s). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different …

A Simplified Model For Ploughing Forces In Turning, Daniel Waldorf

Industrial and Manufacturing Engineering

This paper aims to provide experimental data in support of a modified theoretical model for quantifying the effect of cutting tool edge geometry on machining forces. A previously published slip-line model is simplified and extended to the case of turning. Several sets of machining experiments were run with custom-fabricated cutting inserts of varying edge hone radius and chamfer geometry. Cutting forces were measured using a dynamometer during cutting. Results show that varying edge geometry can have a major effect on cutting forces. The developed model effectively captures the edge phenomenon and its effect on cutting forces and also offers a …

Optimization Of The Fuzzy Logic Controller For An Autonomous Uav, Jon C. Ervin, Sema E. Alptekin, Dianne J. Deturris

Industrial and Manufacturing Engineering

In this paper, we describe the optimization of membership functions in an application employing a hierarchical Fuzzy Logic Controller. The size of the rule base is made manageable by using a unique formulation, known as Combs method, to help control the problem of ‘exponential rule expansion’. The optimization is performed using a steady state genetic algorithm with a dynamic fitness function. The controller being developed is designed to fly a small, autonomous parafoil, suitable for short-range reconnaissance and land survey applications. The optimization process is performed in the Matlab/Simulink software environment and incorporates fuzzy logic modules developed in the Matlab …

Stability Analysis For Forging Of Porous Bodies, Xuan Wang, Eugene Olevsky, Alain Molinari

Industrial and Manufacturing Engineering

The continuum theory of sintering is used for the analysis of the stability of forging of a cylindrical powder specimen. The constitutive properties of the powder material are assumed to follow a power-law creep relationship. Temperature-coupled linear non-uniform stability analyses are carried out. Stability maps are obtained for forging of copper powder components.

The Effectiveness Analysis Of The Online Tools For Engineering Faculty Needs, Ismail Fidan, Jianbiao Pan, Leijun Li

Industrial and Manufacturing Engineering

As the use of Internet is increasing dramatically, many faculty members are using it in their teaching, research, and services. The Internet also provides faculty easy access to employee benefits and other information. Many universities are using or plan to use online teaching. Lately, many editorial and funding agencies have also started to initiate online review and decision-making system. These systems have eased the burden on both reviewers and agencies. In this study, a survey was prepared and conducted to investigate the effectiveness of the online tools for faculty needs in authors’ institutions and some other United States universities. The …

Sequential Deposition Of Copper/Alumina Composites, X. Wang, J. Ma, A. Maximenko, E.A. Olevsky, M.B. Stern, B.M. Guenin

Industrial and Manufacturing Engineering

No abstract provided.

Pnl Applied To Economics, Barbara Diaz, Tomohiro Takagi, Sema E. Alptekin

Industrial and Manufacturing Engineering

This work is a continuation of Zadeh’s research on Precisiated Natural language. Precisiated Natural Language (PNL) provides a system for computation and deduction of propositions expressed in a natural language. The importance of PNL for economics is discussed. The improved process of PNL is presented using a real world example from economics.

Machine Vision Course For Manufacturing Engineering Undergraduate Students, Jose Macedo, Kurt Colvin, Daniel Waldorf

Industrial and Manufacturing Engineering

A 10-week course was designed with funding from the Society of Manufacturing Engineers (SME) and input from industry representatives, to offer upper division engineering students a course on advanced automation. The objective was to provide engineering students theoretical and hands-on practical experience with automation technologies that will be of prime importance over the next decade: data acquisition and instrumentation, machine vision and motion control. This paper describes the machine vision portion of that class. It describes important concepts, hands-on equipment, and labs developed for this course, as well as examples of student projects from Spring Quarter, 2004. The course and …

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand for replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concerns. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI …

The Limits Of Reflexive Design In A Secrecy-Based Organization, Michael W. Stebbins, Tali Freed, A.B. (Rami) Shani, Kenneth H. Doerr

Industrial and Manufacturing Engineering

No abstract provided.

Development Of A Flying Eye: A Project-Based Learning Experience, Sema E. Alptekin, Dianne Deturris, Daniel J. Macy, Jon E. Ervin

Industrial and Manufacturing Engineering

The paper describes the design for manufacturability of a prototype product as part of a manufacturing engineering capstone course. The product chosen was a vertically launched unmanned aerial vehicle (UAV)—the “Flying Eye.” The Flying Eye is an autonomous parafoil surveillance platform quipped with sensors, controllers, mechanical components, and software. Once the autonomous UAV is deployed, it is designed to follow a predetermined flight path down to the ground. The design effort of the prototype device took place over a three-year period as a collaborative effort between the Aerospace Engineering and Industrial and Manufacturing Engineering departments at California Polytechnic State University. …

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI …

Work Flow Policy And Within-Worker And Between-Workers Variability In Performance, Kenneth Howard Doerr, Tali Freed, Terence R. Mitchell, Chester A. Schriesheim, Xiaohua Zhou

Industrial and Manufacturing Engineering

Work flow policies are shown to induce a change in average between-workers variability (worker heterogeneity) and within-worker variability in performance times. In a laboratory experiment, the authors measured the levels of worker heterogeneity and within-worker variability under an individual performance condition, a work sharing condition, and a fixed assignment condition. The work sharing policy increased the levels of worker heterogeneity and worker variability, whereas the fixed assignment policy decreased them. These effects, along with work flow policy main effects on mean performance times and variability are examined. This article represents an initial step in understanding effects that may be important …

Wire Bonding Challenges In Optoelectronics Packaging, Jianbiao Pan, Patrice Fraud

Industrial and Manufacturing Engineering

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to have deep access capability. In this paper, the wire bonding technologies are reviewed and ball bonding and wedge bonding are compared. The variables that affect the wire bonding process are then discussed. Finally, the challenges of wire bonding in optoelectronics packaging are presented in detail.

Effect Of Chromium-Gold And Titanium-Titanium Nitride-Platinum-Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications require good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr/Au and Ti/TiN/Pt/Au metallization systems. Both chromium and titanium are used to promote adhesion between substrates and sputtered gold films. Both can diffuse the gold surface after annealing and degrade the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr/Au and Ti/TiN/Pt/Au, annealing, and CAN etch processes on 25.4 times; 254 μm (1 × 10 mil) ribbon bonding. All bonds were …

Critical Variables Of Solder Paste Stencil Printing For Micro-Bga And Fine-Pitch Qfp, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Stencil printing continues to be the dominant method of solder deposition in high-volume surface-mount assembly. Control of the amount of solder paste deposited is critical in the case of fine-pitch and ultrafine-pitch surface-mount assembly. The process is still not well understood as indicated by the fact that industry reports 52-71% surface-mount technology (SMT) defects are related to the solder paste stencil printing process. The purpose of this paper is to identify the critical variables that influence the volume, area, and height of solder paste deposited. An experiment was conducted to investigate the effects of relevant process parameters on the amount …

A Supply Chain Management Tool For Linking Courses In Manufacturing Engineering , Daniel Waldorf, Sema E. Alptekin

Industrial and Manufacturing Engineering

A Recent Society of Manufacturing Engineers (SME) grant received by Manufacturing Engineering Program at Cal Poly has provided funds to strengthen its curricular focus on supply chain management, flexibility, business skills, quality, and process controls. New courses and laboratories are developed in electronics manufacturing, information technology, and supply chain management. A functioning supply chain environment has been developed to provide vertical integration among several courses. A software tool being developed in-house integrates the activities of the students who play the roles of customers and suppliers. Details of the various components of this comprehensive project are presented in this paper.

A Taxonomy Of Scheduling Problems In Semiconductor Device Test Operations, Tali Freed, Robert C. Leachman, Kenneth H. Doerr

Industrial and Manufacturing Engineering

Semiconductor device test facilities differ not only by production volume and tester brands. The complexity of the devices and the characteristics of the testers affect the scheduling methodologies as well. Goals and strategies vary from one firm to another, leading to a variety of objectives and performance measures. Due to random yield lot size is variable and lot priorities are common. Changeover times are oftentimes sequence-dependent. Since semiconductor device testing systems are very costly, scheduling methods that increase the throughput of the facility are financially significant. In this paper we describe a variety of semiconductor device testing environments, develop mathematical …

Computer-Aided Engineering For Tool Design In Manufacturing Engineering Curriculum, Daniel J. Waldorf

Industrial and Manufacturing Engineering

At Cal Poly – San Luis Obispo, a variety of tool design issues are covered in a junior-level manufacturing engineering course called Tool Engineering. In the course, designing fixtures – for any process – is a major component of the content. The process of designing a fixture is similar to the method a mechanical engineer would use to design a new product. The course is therefore an excellent opportunity to teach design principles to manufacturing engineers. This project involves an attempt to introduce computer-aided methods, including the finite element method (FEM), for analysis of tool design into the Tool Engineering …

Teaching Factory, Sema E. Alptekin, Reza Pouraghabagher, Patricia Mcquaid, Daniel Waldorf

Industrial and Manufacturing Engineering

Academia must develop a new approach to teaching in order to better prepare engineering students to function efficiently and adjust readily within the framework of the factories in the real world. Some engineering programs emphasize theory, while others emphasize application as isolated blocks. The "Teaching Factory" being developed at Cal Poly combines both theory and applications. It makes use of state-of-the-art industrial grade production equipment, computer hardware and software in the form of the following two systems: 1) a functioning "real" factory hardware environment, and 2) a Production Planning and Control Center.

Plastic Solder Paste Stencil For Surface Mount Technology, Christopher K. Wong, Daniel Waldorf

Industrial and Manufacturing Engineering

Solder paste masks or stencils are an integral part of the manufacturing process for surface mount PCBs. This study examines the feasibility of a process for rapid creation of a solder paste stencil using thermoplastic material. CNC laser cutting of the stencil geometry is replacing traditional use of chemical etching on metal sheets to produce stencils. Laser cutting has been used to improve process speed, accuracy, and cost. This research attempts to continue to simplify and reduce costs in the stencil making process by proposing as the stencil material a common thermoplastic that can be cut easily and quickly using …

Product Flexibility In Selecting Manufacturing Planning And Control Strategy, Emine Persentili, Sema E. Alptekin

Industrial and Manufacturing Engineering

The manufacturing systems capable of producing several products simultaneously are frequently subject to changes in product types due to demand fluctuations. In such systems a product flexible manufacturing planning and control (MPC) strategy is needed to change from one product type to another with minimum deterioration to system performance levels. The objective of this research is to develop a systematic analysis and evaluation approach in order to compare the MRP-push and JIT-pull strategies quantitatively based on a product flexibility measure. A new product flexibility measure is developed based on the sensitivity to change concept and presented together with the implementation …

Simtrainer: A Management Training Tool, Wade Stark, Sema E. Alptekin

Industrial and Manufacturing Engineering

Abstract published of poster paper presented at conference.

Scheduling Semiconductor Device Test Operations On Multihead Testers, Tali Freed, Robert C. Leachman

Industrial and Manufacturing Engineering

Past attempts to devise scheduling methods for the device test operations of semiconductor manufacturing firms fail to address a significant characteristic of multiple-head test systems—the dependency of processing rates on the lots processed simultaneously on the testers. Since the problem has never been modeled accurately in the scheduling literature, feasibility and performance of previously proposed scheduling methodologies for multihead testers may not be accurately assessed. In this paper, we describe the multihead tester scheduling problem, present an enumeration solution procedure, and illustrate the problems of previously suggested tester scheduling algorithms.

An Evaluation Of Ploughing Models For Orthogonal Machining, Daniel J. Waldorf, Richard E. Devor, Shiv G. Kapoor

Industrial and Manufacturing Engineering

An analytical comparison is made between two basic models of the flow of workpiece material around the edge of an orthogonal cutting tool during steady-state metal removal. Each has been the basis for assumptions in previous studies which attempt to model the machining process, but no direct comparison had been made to determine which, if either, is an appropriate model. One model assumes that a separation point exists on the rounded cutting edge while the other includes a stable build-up adhered to the edge and assumes a separation point at the outer extreme of the build-up. Theories of elastic-plastic deformation …

Gauge Repeatability & Reproducibility Study For A 3-D Solder Paste Inspection System, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Due to the increased use of Ball Grid Arrays (BGAs) and fine pitch and ultra fine pitch Quad Flat Packages (QFPs), there is a dramatic increase in demand for solder paste inspection after the stencil printing process. The important response variables of the printing process are deposited solder paste volume, area, height and position. To identify and remove defects at the earliest possible process step, a 3-D solder paste inspection system should be used to monitor solder paste deposited on all pads on every board before component placement. An example is a fully automatic laser-based 3-D triangulation solder paste inspection …

Critical Variables Of Solder Paste Stencil Printing For Micro-Bga And Fine Pitch Qfp, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Stencil printing continues to be the dominant method of solder deposition in high volume surface mount assembly. Control of the amount of solder paste deposited is critical for fine pitch and ultra-fine pitch SMT assembly. The process is still not well understood as indicated by the fact that industry reports 52-71% of SMT defects are related to the solder paste stencil printing process. The purpose of this paper is to identify the critical variables that influence the deposited solder paste volume, area, and height. An experiment was conducted to investigate the effects of relevant process parameters on the amount of …

Screen Printing Process Design Of Experiments For Fine Line Printing Of Thick Film Ceramic Substrates, Jianbiao Pan, Gregory L. Tonkay, Alejandro Quintero

Industrial and Manufacturing Engineering

Screen printing has been the dominant method of thick film deposition because of its low cost. Many experiments in industry have been done and many models of the printing process have been developed since the 1960's. With a growing need for denser packaging and a drive for higher pin count, screen printing has been refined to yield high resolution prints. However, fine line printing is still considered by industry to be difficult. In order to yield high resolution prints with high first pass yields and manufacturing throughput, the printing process must be controlled stringently.

This paper focuses on investigating the …

Industrial Engineering Made Simple, Deena Daggett, Sema E. Alptekin

Industrial and Manufacturing Engineering

Many high school students these days do not quickly recognize or identify Industrial Engineering (IE) procedures, practices, and products. Recruitment of qualified students into IE programs requires continuous planning, publicizing, and networking. Traditional recruitment efforts have included high school visits, brochures & flyers, and university-sponsored workshops. However, these techniques have only achieved mediocre success. Currently, a need exists for new promotional materials that utilize visual tools and provide a “hands-on” approach. We have developed several exercises that successfully introduce IE. Two such exercises are explained in this paper. The first exercise demonstrates the differences between Assembly line and Cellular Manufacturing …

Worn Tool Forces Based On Ploughing Stresses, Daniel Waldorf, Shiv G. Kapoor, Richard E. Devor

Industrial and Manufacturing Engineering

Recent work in modeling of the ploughing mechanism in basic metal machining may provide a means of estimating the additional forces to be expected when cutting with a worn tool. The results predict the rubbing stresses due to the finite radius of an unworn tool edge. Since an unworn tool can be thought of as a worn tool with a wear land width VB = 0, these stresses can make up part of a strategy for predicting the additional forces incurred by a worn tool. This paper develops a wear model by proposing a technique for utilizing the stresses predicted …