Industrial Engineering Commons^™

Finding And Optimising The Key Factors For The Multiple-Response Manufacturing Process, Jeh-Nan Pan, Jianbiao Pan, Chun-Yi Lee

Industrial and Manufacturing Engineering

With the advent of modern technology, manufacturing processes became so sophisticated that a single quality characteristic cannot reflect the true product quality. Thus, it is essential to perform the key factor analysis for the manufacturing process with multiple-input (factors) and multiple-output (responses). In this paper, an integrated approach of using the desirability function in conjunction with the Mahalanobis-Taguchi-Gram Schmit (MTGS) system is proposed in order to find and optimise the key factors for a multiple-response manufacturing process. The aim of using the MTGS method is to standardise and orthogonalise the multiple responses so that the Mahalanobis distance for each run …

Effects Of Reflow Profile And Thermal Conditioning On Intermetallic Compound Thickness For Snagcu Soldered Joints, Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno

Industrial and Manufacturing Engineering

Purpose – The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Design/methodology/approach – A four-factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding to pads over an organic substrate with gold metallizations. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequencies of 60 KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through the design of experimental methodology for four different cases: 25.4 mm wire at 60 kHz, 25.4 mm wire at 120 kHz, 17.8 mm wire at 60 kHz, …

Lean Erp Systems: Existence And Viability In Today's Manufacturing Industry, Miroslav Djuric

Master's Theses

This thesis evaluates the existence and viability of lean ERP systems in today’s manufacturing industry. Results from the research show that current practitioners of lean – who also utilize ERP systems – do not have a strong enough link between the two to consider their ERP systems, and overall organizations, as being truly lean.

Few articles and research papers in today’s body of knowledge contain information on the concept of lean ERP. A survey, sent to numerous industry professionals and posted on lean manufacturing websites, provided the results necessary for statistical analysis. The conclusions obtained from this survey analysis provided …

Optimization Of Lifeguard Towers, Equipment, And Sign Placement With Human Factors Considerations For The Cal Poly Recreation Center Expansion, Brian J. Henrikson

Industrial and Manufacturing Engineering

Cal Poly’s Recreation Center serves many faculty, students and alumni by providing them with a safe and fun environment to work out and swim. An overwhelming majority of students voted for a Recreation Center expansion to handle the increased usage of the Center over the past few years. The focus of this report is the safe and effective operations of the pool deck and the lifeguard staff. Three surveys were created to see what the lifeguard staff, as well as pool users, thought about the current pool deck and what they would like to see in the new pool deck …

A Computer-Based Economic Analysis For Manufacturing Process Selection, Manocher Djassemi

Industrial Technology and Packaging

An important part of financial planning in product development is considering whether the capital expenditures meet volume and cost goals. A good business plan should provide investors with the implications of process selection on the company's bottom line. It is estimated that there are least 1000 manufacturing processes and sub-processes. Considering the number of process choices and quantity of cost data, an economic analysis for process selection may pose a challenge for decision makers. This paper provides an insight to Ashby’s cost modeling method for generating an estimate of unit product cost. The cost model provides a broad indicator for …

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The integrity of wire bonds …

Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan

Industrial and Manufacturing Engineering

This paper presents the failure analysis results of board level drop tests. In this study, the test vehicle was designed according to the requirements of the Joint Electron Device Engineering Council (JEDEC) drop test board. The test vehicle was assembled with 15 chip scale packages (CSPs) each having 228 daisy-chained 0.5 mm pitch solder joints using Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) lead free solder. Assemblies were drop tested using three different peak accelerations of 900 G, 1500 G, 2900 G, with 0.7 ms, 0.5 ms, and 0.3 ms pulse durations, respectively. Scanning electron microscopy (SEM) with energy dispersive spectroscopy …

Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught in isolation followed by a single culminating senior design or capstone project experience. In the senior design class students being to synthesize the knowledge and skills that they acquired through the engineering curriculum. This paper presents lower and upper division course and curricular changes made to accommodate learning objectives that better prepare students for project-based learning. These learning experiences and skills include: systems level design, experience with state-of-the-art Computer Aided Design (CAD) tools, printed circuit board (PBC) design, design for manufacturability, electronics assembly, project management, …

Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan

Industrial and Manufacturing Engineering

This study examines the performance of a new class of wear-resistant but economical cutting tools produced by varying the binder composition of standard cemented carbide composites. By replacing some or all of the cobalt binder with rhenium and nickel-based superalloy, a stronger composite tool results, potentially capable of machining heat-resistant superalloys at significantly higher cutting speeds. Sample tools with alternative binder were produced and compared to standard tools bound with cobalt only. Turning experiments on Inconel 718 were run to evaluate wear resistance and tool life for several grades. The experimentation also examined the effects of varying the relative proportions …

A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello

Industrial and Manufacturing Engineering

This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of this course is to provide lower-division engineering students a hands-on experience involving actual printed circuit board (PCB) design, layout, fabrication, assembly, and testing. Through project-based learning, students not only learn technical skills in designing and manufacturing an electronic device, but also develop their project management and communication skills early in their course of study at the university. The course outline and examples of the student projects are presented in this paper as well as project evaluations and students’ feedback. This paper also presents the selection …

Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

Undergraduate computer and electrical engineering programs often partition the curriculum into several courses based on related topics taught in isolation. Students are expected to synthesize their knowledge in a senior design project. It is the authors’ experience that students often struggle during their senior design project since they have not gained the appropriate knowledge or mastered necessary skills needed to work on a significant or team-based engineering design project. Specifically, students need to be able to define system requirements, partition the design into subcomponents, design, build, test, and verify that the system requirements have been met. The authors have enhanced …

Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat

Industrial and Manufacturing Engineering

The Cal Poly/Allan Hancock team is developing a learning module that will allow all lower division engineering students to design, fabricate, assemble, and test an electronic system implemented on a printed circuit board (PCB). All the services necessary to perform this laboratory experiment will be provided with low-cost vendors available on the . The learning module is being developed so that it can be integrated into the existing electrical engineering lower division courses that are required by all engineering students. The laboratory learning module will use operational amplifiers (op amp), resistors, capacitors and other common electronic components to study the …

Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin

Industrial and Manufacturing Engineering

In this paper, we describe various techniques used to make Intuitionistic Fuzzy Logic Systems amenable to operating on applications with large numbers of inputs. A rule reduction technique known as Combs method is combined with an automated tuning process based on Particle Swarm Optimization. A second stage of tuning on rule weights results in improved performance and further reduction in the size of the rule-base. The entire process has been developed to operate within the Matlab software environment. The technique is tested against the Wisconsin Breast Cancer Database. The use of these tools shows great promise in significantly expanding the …

Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a peak acceleration of 2900 G …

Designing And Manufacturing Microelectronic Packages For High-Power Light-Emitting Diodes, Brian Wright, Jianbiao Pan, Richard Savage

Industrial and Manufacturing Engineering

A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was to build a package that enables the LED to operate with currents as high as 2 Amps. An innovative thin-film interface has been developed to electrically connect the cathode of the LED die to a 22AWG Cu wire. This thin-film interface is wirebondable and solderable, and consists of three layers: Au, Ni93/V7, and Si. Four 1 mil Au wirebonds, supporting 2A of maximum current, connect the Au thin-film to the LED die cathode. Sn96Ag4 solder is used for connecting the Ni93/V7 thin-film to the 22AWG …

In-House Development Of Scheduling Decision Support Systems: Case Study For Scheduling Semiconductor Device Test Operations, Tali Freed, K. H. Doerr, T. Chang

Industrial and Manufacturing Engineering

Most manufacturing processes can benefit from an automated scheduling system. However;: the design of a fast, computerised scheduling system that achieves high-quality results and requires minimal resources is a difficult undertaking. Efficient .. scheduling of a semiconductor device test facility requires an information system that provides good schedules quickly. Semiconductor device testing-is the last stage of the long semiconductor manufacturing process, and therefore. is subjected to customer service pressures. The cost of an off-the-shelf computerised scheduling system may he prohibitive for many companies. In addition, many companies are taken aback by other characteristics of off-the-shelf scheduling systems, such as code …

Fabrication Of Functionally Graded 3a/5a Zeolites By Electrophoretic Deposition, X. Wang, E. A. Olevsky, E. Bruce, M. B. Stern, D. T. Hayhurst

Industrial and Manufacturing Engineering

Functionally graded zeolites of molecular sieve type 3A and 5A are deposited by electrophoretic deposition (EPD) from acetone suspension with 8% volume concentration of n-butylamine as particle charging agent. The EPD characteristics of both 3A and 5A suspensions are studied. Functionally graded zeolite 3A/5A deposits are obtained at 200 V DC. Energy dispersive X-ray dispersion (EDX) analysis results confirm the graded structure. The deposited zeolites are also analysed by scanning electron microscopy (SEM). The factors influencing the deposition process are discussed.

The Benefits Of Automatic Data Collection In The Fresh Produce Supply Chain, Ryan Charles Panos, Tali Freed

Industrial and Manufacturing Engineering

The potential for RFID based systems to improve the safety and efficiency of a supply chain with rapidly decaying products and strict health standards is creating pressure to adopt RFID in several agricultural industries. A handful of fresh produce industry leaders currently participate in mandated pilot projects, while the industry as a whole is still intimidated by the perceived cost of RFID. Therefore in this study we attempt to validate the correlation between performance and automated data collection, paving the way to economic justification of investment in data collection technologies, such as barcode and RFID.

The majority of product in …

Fabrication Of Net-Shape Functionally Graded Composites By Electrophoretic Deposition And Sintering: Modeling And Experimentation, E.A. Olevsky, X. Wang, A. Maximenko, M.A. Meyers

Industrial and Manufacturing Engineering

It is shown that electrophoretic deposition (EPD) sintering is a technological sequence that is capable of producing net-shape bulk functionally graded materials (FGM). By controlling the shape of the deposition electrode, components of complex shapes can be obtained. To enable sintering net-shape capabilities, a novel optimization algorithm and procedure for the fabrication of net-shape functionally graded composites by EPD and sintering has been developed. The initial shape of the green specimen produced by EPD is designed in such a way that the required final shape is achieved after sintering-imposed distortions. The optimization is based on a special innovative iteration procedure …

Investigation Of The Lead-Free Solder Joint Shear Performance, James Webster, Jianbiao Pan, Brian J. Toleno

Industrial and Manufacturing Engineering

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC …

Synthesis Of Gold Micro- And Nano-Wires By Infiltration And Thermolysis, E.A. Olevsky, X. Wang, E. Bruce, M.B. Stern, S. Wildhack, F. Aldinger

Industrial and Manufacturing Engineering

An approach for synthesizing micro- and nano-sized gold wires by infiltration and thermolysis is investigated. A porous ZrO₂ ceramic preform with aligned pores obtained by unidirectional freezing and freeze-drying is employed as an infiltration template. The sintered porous ZrO₂ preform is then infiltrated by a brushing gold solution. The thermolysis is conducted at 600 °C in air. Micro- and nano-sized gold wires are developed within the walls of the pores after thermolysis. The diameter of the gold wires ranges from several hundred nanometers to several microns.

Backward And Forward Compatibility, Jianbiao Pan, Jasbir Bath, Xiang Zhou, Dennis Willie

Industrial and Manufacturing Engineering

In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’ impending lead-free directives, the electronics industry is moving toward lead-free soldering. Total lead-free soldering requires not only lead-free solder paste but also lead-free printed circuit board (PCB) finish and lead-free component/packages. Transitioning tin-lead (SnPb) soldering to totally lead-free soldering is a complex issue and involves movement of the whole electronics industry supply chain. In reality, there is a transition period.

Effect Of Chromium–Gold And Titanium–Titanium Nitride–Platinum–Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason B. Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications requires good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr-Au and Ti-TiN-Pt-Au metallization systems for an optoelectronic application. Both Chromium and Titanium are used to promote adhesion between semiconductor substrates and sputtered gold films. However, both will be oxidized if they diffuse to the gold surface and result in the degradation of the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr-Au and Ti-TiN-Pt-Au, annealing, and CAN etch processes, on …

Investigation Of The Lead-Free Solder Joint Shear Performance, James Webster, Jianbiao Pan, Brian J. Toleno

Industrial and Manufacturing Engineering

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC …

Estimation Of Liquidus Temperature When Snagcu Bga/Csp Components Are Soldered With Snpb Paste, Jianbiao Pan

Industrial and Manufacturing Engineering

Recently, the soldering of lead-free components with SnPb paste, or lead-free backward compatibility, is becoming a hot topic. One of the major challenges in backward compatibility assembly is the development of a right reflow profile for the soldering of SnAgCu Ball Grid Array (BGA)/Chip Scale Package (CSP) components with SnPb paste. If the SnAgCu reflow profile is used, the reflow temperature may be too high for other SnPb components in the same board during assembly according to the component rating per IPC/JEDEC J-STD-020C. In addition, the flux in SnPb solder paste may not function properly in such a high reflow …

A Comparative Study Of Various Loss Functions In The Economic Tolerance Design, Jehnan Pan, Jianbiao Pan

Industrial and Manufacturing Engineering

Engineering tolerance design plays an important role in modern manufacturing. In this paper, the Kapur's model was modified so that the economic specification limits for both symmetric and asymmetric losses can be established. Three different loss functions: (1) Taguchi's quadratic loss function; (2) Inverted Normal Loss Function; (3) Revised Inverted Normal Loss Function are compared in the economic tolerance design. The relationships between the three loss functions and process capability indices for symmetric tolerance are established. The results suggest that the revised inverted normal loss function be used in determination of economic specification limits.

Plotting A Bright Future For Manufacturing Education: Results Of A Brainstorming Session, Daniel Waldorf, Sema E. Alptekin, Robert Bjurman

Industrial and Manufacturing Engineering

Manufacturing industries worldwide have undergone dramatic changes in recent years and now demand more from graduating manufacturing engineers. The effects of globalization have forever changed the parameters for success in manufacturing. Our educational institutions must respond to these changes with innovation. That agenda formed the basis for a special SME/CIRP international conference on manufacturing engineering education called “Looking Forward: Innovations in Manufacturing Engineering Education,” held in San Luis Obispo, California, June 22-25, 2005. At the meeting, manufacturing education professionals from around the world came together to share their own innovative ideas and to brainstorm ways to shape the future of …

Processing Model For Tungsten Powders And Extention To Nanoscale Size Range, Randall M. German, J. Ma, X. Wang, E. Olevsky

Industrial and Manufacturing Engineering

Nanoscale tungsten powders promise access to very hard, strong and wear resistant materials via the press–sinter route. A small particle size changes the response during sintering, requiring lower temperatures and shorter times to attain dense but small grain size structures. On the other hand, oxide reduction and impurity evaporation favour high sintering temperatures and long hold times. Accordingly, press–sinter processing encounters conflicting constraints when applied to small particles. Presented here is an analysis of press–sinter tungsten particle processing to isolate conditions that balance the temperature and size dependent effects. The calculations are pinned by existing data. Opportunities are identified for …