Industrial Engineering Commons^™

Evolving A Summer Engineering Camp Through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, Teana Fredeen

Industrial and Manufacturing Engineering

EPIC (Engineering Possibilities in College) is a one-week summer program for high school students (entering 9th-12th grades) to learn about engineering and experience hands-on labs in a university atmosphere. It's an opportunity for students to explore the different types of engineering available at many universities. The aim of EPIC is to expand the College of Engineering mission to K-12 students: "To educate students for careers of service, leadership and distinction in engineering or other fields by using a participatory, learn by doing, ‘hands-on’ approach".

Design Projects With Out-Of-Town Companies, Lizabeth Schlemer

Industrial and Manufacturing Engineering

The capstone design class in the industrial engineering department at California Polytechnic State University, San Luis Obispo (Cal Poly) includes projects with companies. The projects are large ambiguous facilities design problems that allow students to incorporate many aspects of the IE curriculum. For the past 15 years students have been participating in these projects with local companies. Over the past several years, companies from out of town (200 miles to the north in Mountain View or 200 miles to the south in Oxnard) have participated. These out of town companies have presented certain logistical issues, but they have proven to …

Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, Patrick Hyland

Industrial and Manufacturing Engineering

Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads, especially wire-bondable high frequency packages, where the gold thickness requirement for wirebonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this study is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au thicknesses using …

Improving Compressed Air Energy Efficiency In Automotive Plants: Practical Examples And Implementation, Nasr Alkadi, J. Kelly Kissock

Mechanical and Aerospace Engineering Faculty Publications

The automotive industry is the largest industry in the United States in terms of the dollar value of production [1]. U.S. automakers face tremendous pressure from foreign competitors, which have an increasing manufacturing presence in this country. The Big Three North American Original Equipment Manufacturers (OEMs)-General Motors, Ford, and Chrysler-are reacting to declining sales figures and economic strain by working more efficiently and seeking out opportunities to reduce production costs without negatively affecting the production volume or the quality of the product. Successful, cost-effective investment and implementation of the energy efficiency technologies and practices meet the challenge of maintaining the …

High-Resolution, Non-Contact Angular Measurement System For Psa/Rsa, Ronald D. Sloat

Master's Theses

A non-contact angular measurement system for Pitch Static Attitude (PSA) and Roll Static Attitude (RSA) of hard disk drive sliders is designed and built. Real-time sampling at over 15 KHz is achieved with accuracy of +/- 0.05 degrees over a range of approximately 2-3 degrees. Measuring the PSA and RSA is critical for hard drive manufacturers to control and improve the quality and reliability of hard drives. Although the hard drive industry is able to measure the PSA and RSA at the subassembly level at this time, there is no system available that is able to measure PSA/RSA at the …

Perspectives On Quality Coordination And Assurance In Global Supply Chains, Ling Li, John N. Warfield

Information Technology & Decision Sciences Faculty Publications

The 2007 recall of Berko Electric Toe-Space Heaters made in the US, the recall of backpack blowers made in Japan, the recalls of toys and pet food produced in China have exposed the potential of global supply chain disruptions. This product recall storm leads to the issue of quality assurance in global supply chain management. Product recalls indicate that manufacturing companies are particularly vulnerable to ensure quality when they source via a global supply chain with poor visibility. Obviously, a supply chain cannot afford this kind of sourcing and supply structure that threatens the supply-chain integrity. This special issue on …

Estimating Industrial Building Energy Savings Using Inverse Simulation, Franc Server, J. Kelly Kissock, Dan Brown, Steve Mulqueen

Mechanical and Aerospace Engineering Faculty Publications

Estimating energy savings from retrofitting existing building systems is traditionally a time intensive process, accomplished by developing a detailed building simulation model, running the model with actual weather data, calibrating the model to actual energy use data, modifying the model to include the proposed changes, then running the base and proposed models with typical weather data to estimate typical energy savings. This paper describes a less time-intensive method of estimating energy savings in industrial buildings using actual monthly energy consumption and weather data. The method begins by developing a multivariate three-parameter changepoint regression model of facility energy use. Next, the …

Benefits Of Cpfr And Vmi Collaboration Strategies In A Variable Demand Environment, Dattaraj Kamalapurkar

Dissertations

In recent years, practitioners and academic researchers have emphasized that organizations need to collaborate with suppliers and customers to improve their competitive advantage. The availability of cost efficient information technologies like EDI, XML, etc. have made it possible to develop and implement many forms of collaboration strategies. Among them, Vendor Managed Inventory (VMI) and Collaborative Planning, Forecasting and Replenishment (CPFR) are most popular, which are considered for this study. While many studies have identified the benefits of demand information sharing in supply chains; however the benefits gained by implementing collaboration strategies like VMI and CPFR in a variable demand environment …

Determination Of Cap Model Parameters Using Numerical Optimization Method For Powder Compaction, Cong Lu

Dissertations (1934 -)

Many advantages are inherent to the successful powder metallurgy (P/M) process especially in high volume manufacturing. The strength/density distribution of the compacted product is crucial to overall success. The finite element analysis (FEA) method has become an effective way to numerically simulate strength/density distribution in a P/M compact. The modified Drucker-Prager cap (DPC) model has been shown to be a suitable constitutive relationship for metal powder compaction simulation. The calibration of the modified DPC model involves a procedure known as a triaxial compression test. Equipment for completing a triaxial compression test on metal powders is neither readily available nor standardized …

Development Of A Task Assignment Tool To Customize Job Descriptions And Close Person-Job Fit Gaps, Bryan W. Booker

Dissertations

Does the knowledge worker fit the job or should the job fit the knowledge worker? This research developed a methodology and a tool to customize a knowledge worker’s job design to better fit their knowledge, skills, abilities and characteristics. The research outcomes support the customization of the job design to improve person-job fit, the documentation of the customized job design as a position description, and the use of a structured person-task assignment process. The recommended task assignment process includes a job aid that uses multivariate equations to predict expected task performance. Data were collected from two knowledge worker sub-groups: lean …

Testing The Test: Validity And Reliability Of Senior Exit Exam, Lizabeth Schlemer, Daniel Waldorf

Industrial and Manufacturing Engineering

A senior exit exam is considered an excellent direct measure of student learning for ABET assessment, but the usefulness of the information gathered is related to the validity and reliability of the test itself. The Industrial and Manufacturing Engineering Department at California Polytechnic State University, San Luis Obispo has used a content exam for several years. This paper will discuss test development, administration, and the role it plays in the assessment process. In addition, the test is evaluated using the standard psychometric techniques of reliability and validity. The results of the evaluation are used to refine the test. The importance …

Development And Assessment Of A Pcb Layout And Manufacturong Laboratory Module In Introductory Electric Circuits For Ee And Non-Ee Majors, Albert Liddicoat, Jianbiao Pan, James G. Harris, Gary Perks, Linda Shepherd

Industrial and Manufacturing Engineering

In standard introductory electric circuits laboratories for electrical engineering (EE) majors and non-EE majors, prototype boards are typically used to construct and test electric circuits. Students typically do not learn how to design and manufacture Printed Circuit Boards (PCB) that are commonly used in more sophisticated design projects and other engineering applications. This paper will present the development and assessment of a PCB layout and manufacturing laboratory module that has been used in introductory electric circuits laboratories for EE and non-EE majors. The feasibility of integrating the new PCB layout and manufacturing module into the electric circuit course will be …

Assessing Curriculum Improvement Through Senior Projects, Jianbiao Pan, Albert Liddicoat, James G. Harris, Linda Shepherd

Industrial and Manufacturing Engineering

Senior project and/or capstone design courses are intended to provide a culminating design experience for students and to demonstrate their understanding of engineering knowledge and their ability to apply that knowledge to practical problems. It is expected that the quality and attributes of students’ senior design projects can be used as a good measure of determining how well the curriculum prepares students to engage in engineering design as well as a measure of faculty teaching and student learning. This paper reports the results of a study designed to assess whether the new computer engineering curriculum implemented at Cal Poly over …

Laser Clean Room Re-Design: A Manufacturing Facility Re-Layout, Jennifer J. Siu

Industrial and Manufacturing Engineering

Alcon’s Laser Clean Room fosters inefficient production practices, is outdated for its current process, and lacking in clear process/product flow. A facility re-design is applied to bring order, efficiency, and optimize flow in the laser production lines.

Deliverables include a new layout that decreases product travel distances and increases productivity as well as an implementation plan and cost/savings analysis. Major design decisions include downsizing the clean room, sorting to find waste and establishing clear process/product flows. The design was implemented within three weeks and results yield 29% reduction of product travel distance, 10.4 hrs/day saved from eliminated gowning time and …

Optimum Failure Truncated Testing Strategies, Erik Kostandyan

Dissertations

Accumulated fatigue damage on mechanical components due to random stress loads eventually causes failure. Therefore products with lower failure rates are more desirable. Testing mechanical components for their intended purpose under predetermined working conditions is a common practice used by industries to prevent failures. Fatigue tests are categorized as Time Truncated or Failure Truncated, known in the literature as Type I and Type II tests, respectively. In failure truncated tests, the mechanical components are tested until the desired number of results is obtained. The parameters of a typical failure truncated test include the capacity of the test facility, the actual …

Using Sports Coaching Techniques To Enhance Project Based Learning Instruction, Lizabeth Schlemer, Faith Mimnaugh

Industrial and Manufacturing Engineering

As instructors attempt to apply project based learning as a preferred pedagogy for many aspects of engineering education, countless questions are raised. For instance, how do instructors assess individual performance in a team based environment? How do instructors prepare students for the culminating presentation or report? How do instructors develop the students individually? After reviewing literature on both project based learning and exceptional coaching, we have found that much can be learned from John Wooden, Phil Jackson and other coaches. This paper will organize some of the best practices in sports coaching and draw parallels that will enhance student learning …

Design For Manufacturing Of Sports Equipment, Cedrick Bit, Christopher L. Head

Industrial and Manufacturing Engineering

The purpose of this project was to validate industrial designs for a product in its conceptual stage and suggest/implement design changes that suit the contracting company’s needs while assuring the product maintains its basic functional requirements. Techniques and methods used to validate the design include 3‐D solid modeling, physical product application using rapid prototyping to produce the product. Methods of design for manufacturing were analyzed in the design. Processes used in the validation and verification of the design include solid modeling design, methods of measurements, fixture design and manufacturing processes. Full design specifications and solid model files were finalized and …

Drop Impact Reliability Of Edge-Bonded Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board. The test boards were subjected to drop tests at several impact pulses, including a peak acceleration of 900 Gs with a pulse duration of 0.7 ms, a peak acceleration of 1500 Gs with a pulse duration of 0.5 ms, and a peak acceleration of 2900 Gs with a pulse duration of 0.3 ms. A high-speed dynamic resistance measurement system was used to monitor the failure of the solder joints. Two edge-bond materials used in …

Teaming Multi-Level Classes On Industry Projects, Lizabeth Schlemer, Jose Macedo

Industrial and Manufacturing Engineering

For the past few years we experimented with teaming students from a sophomore-level class and a senior-level class to work on industry projects. The classes are “work design” and “facilities design.” Projects are selected to require the application of knowledge from both disciplines. In addition, the projects are selected from small local companies. The intent of this paper is to describe the benefits and difficulties associated with this methodology. While specific classes in this experience are typical of an industrial engineering curriculum, the lessons learned and benefits could translate to other disciplines.

Optimization Of Engineering Tolerance Design Using Revised Loss Functions, Jeh-Nan Pan, Jianbiao Pan

Industrial and Manufacturing Engineering

Engineering tolerance design plays an important role in modern manufacturing. Both symmetric and asymmetric tolerances are common in many manufacturing processes. Recently, various revised loss functions have been proposed for overcoming the drawbacks of Taguchi's loss function. In this article, Kapur's economic tolerance design model is modified and the economic specification limits for both symmetric and asymmetric losses are established. Three different loss functions are compared in the optimal symmetric and asymmetric tolerance design: a revised Taguchi quadratic loss function, an inverted normal loss function and a revised inverted normal loss function. The relationships among the three loss functions and …

Finding And Optimising The Key Factors For The Multiple-Response Manufacturing Process, Jeh-Nan Pan, Jianbiao Pan, Chun-Yi Lee

Industrial and Manufacturing Engineering

With the advent of modern technology, manufacturing processes became so sophisticated that a single quality characteristic cannot reflect the true product quality. Thus, it is essential to perform the key factor analysis for the manufacturing process with multiple-input (factors) and multiple-output (responses). In this paper, an integrated approach of using the desirability function in conjunction with the Mahalanobis-Taguchi-Gram Schmit (MTGS) system is proposed in order to find and optimise the key factors for a multiple-response manufacturing process. The aim of using the MTGS method is to standardise and orthogonalise the multiple responses so that the Mahalanobis distance for each run …

Effects Of Reflow Profile And Thermal Conditioning On Intermetallic Compound Thickness For Snagcu Soldered Joints, Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno

Industrial and Manufacturing Engineering

Purpose – The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Design/methodology/approach – A four-factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding to pads over an organic substrate with gold metallizations. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequencies of 60 KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through the design of experimental methodology for four different cases: 25.4 mm wire at 60 kHz, 25.4 mm wire at 120 kHz, 17.8 mm wire at 60 kHz, …

Analysis Of Possible Use Of Identification Technologies In Disassembly, Vukica Jovanović, Sreten Filipović, Gordana Ostojić, Stevan Stankovski, Milovan Lazarević

Engineering Technology Faculty Publications

The barcodes and Radio Frequency Identification tags that are being used during manufacturing, assembly, warehousing, and distribution could also be reused at the end of the product lifecycle for an identification of the correct disassembly process that would result in recycling of its components. The barcodes or RFID tags can be helpful in identifying objects in terms of sustainable development, regarding disassembly, recycling and reuse. In this paper, the analysis of the current applications of RFID Technology in the final phase of the product lifecycle will be presented. The simulation of the disassembly process supported by both barcode and RFID-enabled …

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The integrity of wire bonds …

Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan

Industrial and Manufacturing Engineering

This paper presents the failure analysis results of board level drop tests. In this study, the test vehicle was designed according to the requirements of the Joint Electron Device Engineering Council (JEDEC) drop test board. The test vehicle was assembled with 15 chip scale packages (CSPs) each having 228 daisy-chained 0.5 mm pitch solder joints using Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) lead free solder. Assemblies were drop tested using three different peak accelerations of 900 G, 1500 G, 2900 G, with 0.7 ms, 0.5 ms, and 0.3 ms pulse durations, respectively. Scanning electron microscopy (SEM) with energy dispersive spectroscopy …

Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught in isolation followed by a single culminating senior design or capstone project experience. In the senior design class students being to synthesize the knowledge and skills that they acquired through the engineering curriculum. This paper presents lower and upper division course and curricular changes made to accommodate learning objectives that better prepare students for project-based learning. These learning experiences and skills include: systems level design, experience with state-of-the-art Computer Aided Design (CAD) tools, printed circuit board (PBC) design, design for manufacturability, electronics assembly, project management, …

Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan

Industrial and Manufacturing Engineering

This study examines the performance of a new class of wear-resistant but economical cutting tools produced by varying the binder composition of standard cemented carbide composites. By replacing some or all of the cobalt binder with rhenium and nickel-based superalloy, a stronger composite tool results, potentially capable of machining heat-resistant superalloys at significantly higher cutting speeds. Sample tools with alternative binder were produced and compared to standard tools bound with cobalt only. Turning experiments on Inconel 718 were run to evaluate wear resistance and tool life for several grades. The experimentation also examined the effects of varying the relative proportions …

Accuracy Analysis For Kolmogorov Entropy Used In Studying The Chaotic Dynamics Of Cfb Reactors Based On Solids Concentration Fluctuations, Samwel V. Manyele

Tanzania Journal of Engineering and Technology (TJET)

A study on the chaotic dynamics of a high flux circulating fluidized bed (CFB) riser (10-m high and 76-mm i.d.) using the maximum likelihood estimate of the Kolmogorov entropy (KML) is reported. The signals used were measured by using a solids concentration fiber optic probe, accuracy of which is reported based on statistical analysis. The sensitivity analysis of the parameters used for computing KML was conducted to identify optimum settings, based on the standard error, s(KML) and the nature of PDF of the b-values from the reconstructed phase space trajectories. The length of time series, N, sampling frequency, fs, and …