Operations Research, Systems Engineering and Industrial Engineering Commons^™

Backward And Forward Compatibility, Jianbiao Pan, Jasbir Bath, Xiang Zhou, Dennis Willie

Industrial and Manufacturing Engineering

In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’ impending lead-free directives, the electronics industry is moving toward lead-free soldering. Total lead-free soldering requires not only lead-free solder paste but also lead-free printed circuit board (PCB) finish and lead-free component/packages. Transitioning tin-lead (SnPb) soldering to totally lead-free soldering is a complex issue and involves movement of the whole electronics industry supply chain. In reality, there is a transition period.

Improving Factory Layout Under A Mixed Floor And Overhead Material Handling Condition, Manocher Djassemi

Industrial Technology and Packaging

Purpose –In spite of having a number of general-purpose algorithms for solving plant layout problems, facility planners may still face a challenging task to adjust these algorithms to handle special, but not uncommon, layout problems. The purpose of this study is to propose a new method for addressing the impact of overhead space utilization on a plant layout solution.

Design/methodology/approach –A new method for adjusting material flow under a mixed floor and overhead material handling condition is incorporated in an existing plant layout procedure. A case study involving the layout improvement in a lawn mower engine assembly facility …

The Paperless Factory: A Review Of Issues And Technologies, Manocher Djassemi, James A. Sena

Industrial Technology and Packaging

paper-based data management can be a bottleneck, slowing factory-wide information transfer. This study explores the evolution of paperless communication in a factory environment and reviews some of the key technologies that contribute to the implementation of a paperless system including digital communication, the virtual factory, computer-integrated manufacturing, and web-centric information flow. The challenges facing users of a paperless information system are also discussed.

Effect Of Chromium–Gold And Titanium–Titanium Nitride–Platinum–Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason B. Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications requires good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr-Au and Ti-TiN-Pt-Au metallization systems for an optoelectronic application. Both Chromium and Titanium are used to promote adhesion between semiconductor substrates and sputtered gold films. However, both will be oxidized if they diffuse to the gold surface and result in the degradation of the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr-Au and Ti-TiN-Pt-Au, annealing, and CAN etch processes, on …

A Lean Approach To Manage A Capstone Senior Project Course, Manocher Djassemi

Industrial Technology and Packaging

The senior project course (IT461) in the Industrial Technology program at California Polytechnic State University (Cal Poly) is a quarter long capstone course that complements the "learn-by-doing" educational approach at Cal Poly. Our short time frame, an 11-week academic quarter, poses a challenge for both students and faculty. This paper provides details of a new design for the IT461 course. A lean, paperless approach to course management is presented. Using this approach, little or no paper is exchanged between students and faculty. The reduction in waste can be significant in engineering or technology senior project courses. Evaluation of the results …

Investigation Of The Lead-Free Solder Joint Shear Performance, James Webster, Jianbiao Pan, Brian J. Toleno

Industrial and Manufacturing Engineering

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC …

Estimation Of Liquidus Temperature When Snagcu Bga/Csp Components Are Soldered With Snpb Paste, Jianbiao Pan

Industrial and Manufacturing Engineering

Recently, the soldering of lead-free components with SnPb paste, or lead-free backward compatibility, is becoming a hot topic. One of the major challenges in backward compatibility assembly is the development of a right reflow profile for the soldering of SnAgCu Ball Grid Array (BGA)/Chip Scale Package (CSP) components with SnPb paste. If the SnAgCu reflow profile is used, the reflow temperature may be too high for other SnPb components in the same board during assembly according to the component rating per IPC/JEDEC J-STD-020C. In addition, the flux in SnPb solder paste may not function properly in such a high reflow …

A Comparative Study Of Various Loss Functions In The Economic Tolerance Design, Jehnan Pan, Jianbiao Pan

Industrial and Manufacturing Engineering

Engineering tolerance design plays an important role in modern manufacturing. In this paper, the Kapur's model was modified so that the economic specification limits for both symmetric and asymmetric losses can be established. Three different loss functions: (1) Taguchi's quadratic loss function; (2) Inverted Normal Loss Function; (3) Revised Inverted Normal Loss Function are compared in the economic tolerance design. The relationships between the three loss functions and process capability indices for symmetric tolerance are established. The results suggest that the revised inverted normal loss function be used in determination of economic specification limits.

Plotting A Bright Future For Manufacturing Education: Results Of A Brainstorming Session, Daniel Waldorf, Sema E. Alptekin, Robert Bjurman

Industrial and Manufacturing Engineering

Manufacturing industries worldwide have undergone dramatic changes in recent years and now demand more from graduating manufacturing engineers. The effects of globalization have forever changed the parameters for success in manufacturing. Our educational institutions must respond to these changes with innovation. That agenda formed the basis for a special SME/CIRP international conference on manufacturing engineering education called “Looking Forward: Innovations in Manufacturing Engineering Education,” held in San Luis Obispo, California, June 22-25, 2005. At the meeting, manufacturing education professionals from around the world came together to share their own innovative ideas and to brainstorm ways to shape the future of …

Processing Model For Tungsten Powders And Extention To Nanoscale Size Range, Randall M. German, J. Ma, X. Wang, E. Olevsky

Industrial and Manufacturing Engineering

Nanoscale tungsten powders promise access to very hard, strong and wear resistant materials via the press–sinter route. A small particle size changes the response during sintering, requiring lower temperatures and shorter times to attain dense but small grain size structures. On the other hand, oxide reduction and impurity evaporation favour high sintering temperatures and long hold times. Accordingly, press–sinter processing encounters conflicting constraints when applied to small particles. Presented here is an analysis of press–sinter tungsten particle processing to isolate conditions that balance the temperature and size dependent effects. The calculations are pinned by existing data. Opportunities are identified for …

The Effect Of Reflow Profile On Snpb And Snagcu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee

Industrial and Manufacturing Engineering

Purpose –The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.

Design/methodology/approach –Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three levels of peak temperature (230°C, 240°C, and 250°C for Sn3.0Ag0.5Cu; and 195°C, 205°C, and 215°C for Sn37Pb) and three levels of time above solder liquidus temperature (30, 60, and 90 s). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different …

A Simplified Model For Ploughing Forces In Turning, Daniel Waldorf

Industrial and Manufacturing Engineering

This paper aims to provide experimental data in support of a modified theoretical model for quantifying the effect of cutting tool edge geometry on machining forces. A previously published slip-line model is simplified and extended to the case of turning. Several sets of machining experiments were run with custom-fabricated cutting inserts of varying edge hone radius and chamfer geometry. Cutting forces were measured using a dynamometer during cutting. Results show that varying edge geometry can have a major effect on cutting forces. The developed model effectively captures the edge phenomenon and its effect on cutting forces and also offers a …

Effect Of Time-Based Parameters On The Agility Of A Dynamic Mpc System, A. M. Deif, W. H. Elmaraghy

Industrial Technology and Packaging

This paper presents a dynamic manufacturing planning and control (MPC) system that can maintain agility through the ability to dynamically switch between different policies due to varying market strategies. The dynamic behavior of the developed system is investigated by studying the effect of the time based parameters on responsiveness and cost effectiveness of the system reflected in the natural frequency and the damping of its different configurations. Results showed that the agility requirements are directly affected by the time based parameters of the MPC system: production lead time, capacity scalability delay, and shipment time. This resulted in a better understanding …

A Control Approach To Explore The Dynamics Of Capacity Scalability In Reconfigurable Manufacturing Systems, Ahmed M. Deif, Waguih H. Elmaraghy

Industrial Technology and Packaging

This paper presents a dynamic model and analysis for one of the major characteristics of reconfigurable manufacturing systems (RMSs) capacity scalability. The dynamic model is analyzed using its transfer function. Dynamic characteristics associated with the delay in capacity scalability and how to minimize this delay are discussed using control approaches. The problem of how to supply exact capacity in response to market changes is also examined by solving the dynamic problem of the production offset phenomenon in RMSs. The effect of work in process as a damping factor for production disturbances during capacity scalability is addressed. Finally, a general capacity …

Optimization Of The Fuzzy Logic Controller For An Autonomous Uav, Jon C. Ervin, Sema E. Alptekin, Dianne J. Deturris

Industrial and Manufacturing Engineering

In this paper, we describe the optimization of membership functions in an application employing a hierarchical Fuzzy Logic Controller. The size of the rule base is made manageable by using a unique formulation, known as Combs method, to help control the problem of ‘exponential rule expansion’. The optimization is performed using a steady state genetic algorithm with a dynamic fitness function. The controller being developed is designed to fly a small, autonomous parafoil, suitable for short-range reconnaissance and land survey applications. The optimization process is performed in the Matlab/Simulink software environment and incorporates fuzzy logic modules developed in the Matlab …

Stability Analysis For Forging Of Porous Bodies, Xuan Wang, Eugene Olevsky, Alain Molinari

Industrial and Manufacturing Engineering

The continuum theory of sintering is used for the analysis of the stability of forging of a cylindrical powder specimen. The constitutive properties of the powder material are assumed to follow a power-law creep relationship. Temperature-coupled linear non-uniform stability analyses are carried out. Stability maps are obtained for forging of copper powder components.

The Use Of Rfid In Manufacturing And Packaging Technology Laboratories, Manocher Djassemi, Jay Singh

Industrial Technology and Packaging

Mandated use of Radio Frequency Identification (RFID) on goods at pallet, case and item level continues to churn the Consumer Product Goods (CPG), logistics and retail industry. The statement “Internet of things” is slowly becoming true; with concerted efforts from standard setting bodies such as Electronic Product Code (EPC) global, International Standards Organization (ISO), Fast Moving Consumer Goods (FMCG) companies like Gillette, P&G and major retailers like Wal-Mart, TESCO, and the US DoD, to replace barcodes with RFID tags. RFID bridges many areas of manufacturing including inventory management, assembly operation, material handling, packaging and shipping by providing an accurate and …

The Effectiveness Analysis Of The Online Tools For Engineering Faculty Needs, Ismail Fidan, Jianbiao Pan, Leijun Li

Industrial and Manufacturing Engineering

As the use of Internet is increasing dramatically, many faculty members are using it in their teaching, research, and services. The Internet also provides faculty easy access to employee benefits and other information. Many universities are using or plan to use online teaching. Lately, many editorial and funding agencies have also started to initiate online review and decision-making system. These systems have eased the burden on both reviewers and agencies. In this study, a survey was prepared and conducted to investigate the effectiveness of the online tools for faculty needs in authors’ institutions and some other United States universities. The …

Sequential Deposition Of Copper/Alumina Composites, X. Wang, J. Ma, A. Maximenko, E.A. Olevsky, M.B. Stern, B.M. Guenin

Industrial and Manufacturing Engineering

No abstract provided.

Pnl Applied To Economics, Barbara Diaz, Tomohiro Takagi, Sema E. Alptekin

Industrial and Manufacturing Engineering

This work is a continuation of Zadeh’s research on Precisiated Natural language. Precisiated Natural Language (PNL) provides a system for computation and deduction of propositions expressed in a natural language. The importance of PNL for economics is discussed. The improved process of PNL is presented using a real world example from economics.

A Simulation Analysis Of Factors Influencing The Flexibility Of Cellular Manufacturing, Manocher Djassemi

Industrial Technology and Packaging

The performance of cellular manufacturing (CM) systems in a variable demand and flexible workforce environment has been examined using simulation modelling. Discrepancies between academicians and practitioners' findings with respect to flexibility and uneven machine utilization in CM systems are discussed. The views of two parties were incorporated in simulation models to rectify the existing discrepancies. While the results of this study confirm the previous findings of academicians regarding the deterioration of the performance of CM in a variable product mix situation, it appears that those results may be significantly influenced by considering a flexible workforce. The simulation results show that …

Machine Vision Course For Manufacturing Engineering Undergraduate Students, Jose Macedo, Kurt Colvin, Daniel Waldorf

Industrial and Manufacturing Engineering

A 10-week course was designed with funding from the Society of Manufacturing Engineers (SME) and input from industry representatives, to offer upper division engineering students a course on advanced automation. The objective was to provide engineering students theoretical and hands-on practical experience with automation technologies that will be of prime importance over the next decade: data acquisition and instrumentation, machine vision and motion control. This paper describes the machine vision portion of that class. It describes important concepts, hands-on equipment, and labs developed for this course, as well as examples of student projects from Spring Quarter, 2004. The course and …

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand for replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concerns. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI …

The Limits Of Reflexive Design In A Secrecy-Based Organization, Michael W. Stebbins, Tali Freed, A.B. (Rami) Shani, Kenneth H. Doerr

Industrial and Manufacturing Engineering

No abstract provided.

Development Of A Flying Eye: A Project-Based Learning Experience, Sema E. Alptekin, Dianne Deturris, Daniel J. Macy, Jon E. Ervin

Industrial and Manufacturing Engineering

The paper describes the design for manufacturability of a prototype product as part of a manufacturing engineering capstone course. The product chosen was a vertically launched unmanned aerial vehicle (UAV)—the “Flying Eye.” The Flying Eye is an autonomous parafoil surveillance platform quipped with sensors, controllers, mechanical components, and software. Once the autonomous UAV is deployed, it is designed to follow a predetermined flight path down to the ground. The design effort of the prototype device took place over a three-year period as a collaborative effort between the Aerospace Engineering and Industrial and Manufacturing Engineering departments at California Polytechnic State University. …

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI …

Work Flow Policy And Within-Worker And Between-Workers Variability In Performance, Kenneth Howard Doerr, Tali Freed, Terence R. Mitchell, Chester A. Schriesheim, Xiaohua Zhou

Industrial and Manufacturing Engineering

Work flow policies are shown to induce a change in average between-workers variability (worker heterogeneity) and within-worker variability in performance times. In a laboratory experiment, the authors measured the levels of worker heterogeneity and within-worker variability under an individual performance condition, a work sharing condition, and a fixed assignment condition. The work sharing policy increased the levels of worker heterogeneity and worker variability, whereas the fixed assignment policy decreased them. These effects, along with work flow policy main effects on mean performance times and variability are examined. This article represents an initial step in understanding effects that may be important …

Wire Bonding Challenges In Optoelectronics Packaging, Jianbiao Pan, Patrice Fraud

Industrial and Manufacturing Engineering

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to have deep access capability. In this paper, the wire bonding technologies are reviewed and ball bonding and wedge bonding are compared. The variables that affect the wire bonding process are then discussed. Finally, the challenges of wire bonding in optoelectronics packaging are presented in detail.

Effect Of Chromium-Gold And Titanium-Titanium Nitride-Platinum-Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications require good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr/Au and Ti/TiN/Pt/Au metallization systems. Both chromium and titanium are used to promote adhesion between substrates and sputtered gold films. Both can diffuse the gold surface after annealing and degrade the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr/Au and Ti/TiN/Pt/Au, annealing, and CAN etch processes on 25.4 times; 254 μm (1 × 10 mil) ribbon bonding. All bonds were …

Critical Variables Of Solder Paste Stencil Printing For Micro-Bga And Fine-Pitch Qfp, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Stencil printing continues to be the dominant method of solder deposition in high-volume surface-mount assembly. Control of the amount of solder paste deposited is critical in the case of fine-pitch and ultrafine-pitch surface-mount assembly. The process is still not well understood as indicated by the fact that industry reports 52-71% surface-mount technology (SMT) defects are related to the solder paste stencil printing process. The purpose of this paper is to identify the critical variables that influence the volume, area, and height of solder paste deposited. An experiment was conducted to investigate the effects of relevant process parameters on the amount …