Operations Research, Systems Engineering and Industrial Engineering Commons^™

Characterization And Compression Properties Of Injection Molded Carbon Nanotube Composites, Grey Curtzwiler, Jay Singh, J. Miltz, Jimmy Doi, Keith Vorst

Industrial Technology and Packaging

Since the development of carbon nanotubes (CNTs) in 1991, they have received much attention with improved mechanical, thermal, and electrical properties of their composites compared to common polymer composites. The CNTs are currently used to increase the modulus of common thermoplastics and thermosets, including urethanes and epoxies. The CNTs are difficult to disperse within any media because of limited chemical reactivity and potential agglomeration in their ‘‘as grown’’ state. This study evaluated the effect of incorporating bundled and unbundled CNTs at different concentrations into Polyurethane/CNT/woven fiber reinforced composites. Optical microscopy and atomic force microscopy (AFM) characterized the dispersion of CNTs …

A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello

Industrial and Manufacturing Engineering

This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of this course is to provide lower-division engineering students a hands-on experience involving actual printed circuit board (PCB) design, layout, fabrication, assembly, and testing. Through project-based learning, students not only learn technical skills in designing and manufacturing an electronic device, but also develop their project management and communication skills early in their course of study at the university. The course outline and examples of the student projects are presented in this paper as well as project evaluations and students’ feedback. This paper also presents the selection …

Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

Undergraduate computer and electrical engineering programs often partition the curriculum into several courses based on related topics taught in isolation. Students are expected to synthesize their knowledge in a senior design project. It is the authors’ experience that students often struggle during their senior design project since they have not gained the appropriate knowledge or mastered necessary skills needed to work on a significant or team-based engineering design project. Specifically, students need to be able to define system requirements, partition the design into subcomponents, design, build, test, and verify that the system requirements have been met. The authors have enhanced …

Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat

Industrial and Manufacturing Engineering

The Cal Poly/Allan Hancock team is developing a learning module that will allow all lower division engineering students to design, fabricate, assemble, and test an electronic system implemented on a printed circuit board (PCB). All the services necessary to perform this laboratory experiment will be provided with low-cost vendors available on the . The learning module is being developed so that it can be integrated into the existing electrical engineering lower division courses that are required by all engineering students. The laboratory learning module will use operational amplifiers (op amp), resistors, capacitors and other common electronic components to study the …

Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin

Industrial and Manufacturing Engineering

In this paper, we describe various techniques used to make Intuitionistic Fuzzy Logic Systems amenable to operating on applications with large numbers of inputs. A rule reduction technique known as Combs method is combined with an automated tuning process based on Particle Swarm Optimization. A second stage of tuning on rule weights results in improved performance and further reduction in the size of the rule-base. The entire process has been developed to operate within the Matlab software environment. The technique is tested against the Wisconsin Breast Cancer Database. The use of these tools shows great promise in significantly expanding the …

The Effect Of Ventilation And Hand Holes On Loss Of Compression Strength In Corrugated Boxes, Jay Singh, Eric Olsen, S. P. Singh, J. Manley, F. Wallace

Industrial Technology and Packaging

Corrugated packaging is used to package approximately 90% of all products that reach retail store shelves and aisles in the United States. A large number of these corrugated shippers are used to ship fresh produce and perishables through the cold-chain environment that requires these boxes to have venting to permit air circulation. In addition, corrugated boxes for that are large in size and contain heavier products, may have hand holes to facilitate manual handling. The presence of ventilation and hand holes both cause a loss of material in two or more faces of the box. As a result the compression …

Measurement And Analysis Of Truck Transport Environment In Brazil, Giovani Otavio Rissi, Sher Paul Singh, Gary J. Burgess, Jay A. Singh

Industrial Technology and Packaging

Increasing trade in today’s global economy requires packaging to be designed to contain, protect and deliver products without damage during transportation and handling. Vibration forces that occur during transportation are one of the most significant causes of damage during shipping. The objective of this study was to quantify and analyse the vibration that occurs during truck transport in Brazil. The study was done using two types of trucks: small local trucks for local metropolitan distribution areas and larger tractor-trailers for cross-country transportation. Ten metropolitan areas in different regions of Brazil were selected for 1-day trips representing normal delivery. These trips …

Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a peak acceleration of 2900 G …

Effect Of Unitization And Product Types On Readability Of Tagged Packages Of Consumer Goods, Jay A. Singh, R. Holtz, S. P. Singh, K. Saha

Industrial Technology and Packaging

Proper implementation of radio frequency identification (RFID) has the potential to revolutionize supply chain management. This technology provides simultaneous indirect scanning of multiple packages and palletized loads equipped with a RFID tag, transmitting substantially more information than a bar code. Also, stored information on the tag can be updated according to inventory status, thus, eliminating key limitations of barcode technology. This study was designed to address some of the currently known shortcomings of the RFID technology. One of the commonly occurring drawbacks is transmitted signal from RFID antennae is reflected from metal objects or absorbed by water contained in a …

Rfid Research And Testing For Packages Of Apparel, Consumer Goods And Fresh Produce In The Retail Distribution Environment, S. P. Singh, M. Mccartney, Jay Singh, R. Clarke

Industrial Technology and Packaging

Radio frequency identification (RFID) is a term used for any device that can be sensed at a distance by radio frequencies with few problems of obstruction. The origins of the term lie in the invention of tags that reflect or retransmit a radiofrequency signal. According to a recent article by Forrester Research, the minimal ‘Slap and Ship’ approach to RFID compliance will cost an individual company between $2 million and $20 million. Because retailers like Wal-Mart plan to share with their suppliers all the RFID-generated data points (from when a case/pallet enters their distribution centre until it leaves their stockroom), …

Performance Comparison Of Thermal Insulated Packaging Boxes, Bags And Refrigerants For Single-Parcel Shipments, S. P. Singh, Gary J. Burgess, Jay Singh

Industrial Technology and Packaging

A range of packaging solutions exists for products that must be kept within a specific temperature range throughout the supply-and-distribution chain. This report summarizes the results of studies conducted over a span of 2 years by the Consortium for Distribution Packaging at Michigan State University. Thermal insulation packaging materials such as expanded polystyrene, polyurethane, corrugated fibreboard, ThermalCor® and other composite packaging such as thermal insulating bags were studied. Phase change materials such as gel packs were also evaluated. Properties such as R-value, melting point and heat absorption were examined and are reported.

Measurement And Analysis Of Vibration Levels On Warehouse And Retail Store Material Handling Equipment, S. P. Singh, Jay A. Singh, P. Gaur, K. Saha

Industrial Technology and Packaging

Material Handling Equipment (MHE) is widely used to move packaged goods from manufacturing to warehousing, storage, transportation, in both warehouses and distribution centers to retail stores. Moving product between facilities is done by different types of equipment ranging from manually pushed carts to automated vehicles. A considerable amount of research has been conducted to evaluate the ergonomics of manual or mechanized MHE in the past. There is, however, no published work documenting vibration conditions that occur when transporting packages using MHE. This study measured the vibration levels for typical MHE used at warehousing facilities. Power spectral density plots were generated …

Variability In Compression Strength And Deflection Of Corrugated Containers As A Function Of Positioning, Operators, And Climatic Conditions, Jay A. Singh, P. Bainbridge, S. P. Singh, Eric Olsen

Industrial Technology and Packaging

ASTM D642 is a commonly used standard for measuring the ability of containers to resist external compressive loads applied to its faces, to diagonally opposite edges, or to corners. The procedure recommends testing by centering the specimen on the lower platen of the testing machine in the desired orientation, so as not to incur eccentric loading. It is also recommended by the standard that the load be applied with a continuous motion of the movable platen of the testing machine at a speed of 0.5 ±0,1 in. (12.7 ± .25 cm)/min until failure or a specified load, has been reached. …

An Examination Of The Variables Affecting Rfid Tag Readability In A Conveyer Belt Environment, Jay A. Singh, C. Deupser, Eric Olsen, S. P. Singh

Industrial Technology and Packaging

There is a growing list of companies implementing radio frequency identification (RFID) systems to help optimize their supply chain processes. These companies realize that a successful RFID system can potentially lead to lower supply chain inventory levels, reduced operating expenses, and greater visibility throughout the supply chain. However, since RFID technology is still relatively immature, a majority of the applications experience less than perfect read rates for tagged items moving through the supply chain. This paper reports the results for a variety of different arrangements of variables that may influence the readability of the RFID tags in a conveyer belt …

Designing And Manufacturing Microelectronic Packages For High-Power Light-Emitting Diodes, Brian Wright, Jianbiao Pan, Richard Savage

Industrial and Manufacturing Engineering

A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was to build a package that enables the LED to operate with currents as high as 2 Amps. An innovative thin-film interface has been developed to electrically connect the cathode of the LED die to a 22AWG Cu wire. This thin-film interface is wirebondable and solderable, and consists of three layers: Au, Ni93/V7, and Si. Four 1 mil Au wirebonds, supporting 2A of maximum current, connect the Au thin-film to the LED die cathode. Sn96Ag4 solder is used for connecting the Ni93/V7 thin-film to the 22AWG …

In-House Development Of Scheduling Decision Support Systems: Case Study For Scheduling Semiconductor Device Test Operations, Tali Freed, K. H. Doerr, T. Chang

Industrial and Manufacturing Engineering

Most manufacturing processes can benefit from an automated scheduling system. However;: the design of a fast, computerised scheduling system that achieves high-quality results and requires minimal resources is a difficult undertaking. Efficient .. scheduling of a semiconductor device test facility requires an information system that provides good schedules quickly. Semiconductor device testing-is the last stage of the long semiconductor manufacturing process, and therefore. is subjected to customer service pressures. The cost of an off-the-shelf computerised scheduling system may he prohibitive for many companies. In addition, many companies are taken aback by other characteristics of off-the-shelf scheduling systems, such as code …

Fabrication Of Functionally Graded 3a/5a Zeolites By Electrophoretic Deposition, X. Wang, E. A. Olevsky, E. Bruce, M. B. Stern, D. T. Hayhurst

Industrial and Manufacturing Engineering

Functionally graded zeolites of molecular sieve type 3A and 5A are deposited by electrophoretic deposition (EPD) from acetone suspension with 8% volume concentration of n-butylamine as particle charging agent. The EPD characteristics of both 3A and 5A suspensions are studied. Functionally graded zeolite 3A/5A deposits are obtained at 200 V DC. Energy dispersive X-ray dispersion (EDX) analysis results confirm the graded structure. The deposited zeolites are also analysed by scanning electron microscopy (SEM). The factors influencing the deposition process are discussed.

Measurement And Analysis Of Truck And Rail Shipping Environment In India, Sher Paul Singh, A. P. S. Sandhu, Jay A. Singh, E. Joneson

Industrial Technology and Packaging

Free trade agreements have been on the rise in all regions of the world in the past decade. This has allowed for global distribution and marketing of products in an international market. Products once produced for domestic markets must now be able to compete in international markets without trade barriers. Increased international commerce and manufacturing have forced many packaging and logistics engineers to broaden their true understanding of the global distribution environment. India is a recent entrant on the global arena for manufacturing and services. While China’s economic developments have dominated global headlines, India’s own growth has been impressive as …

Measurement And Analysis Of International Air Parcel Shipping Environment For Dhl And Fedex Between Europe And United States, Manuel-Alfredo Garcia-Romeu-Martinez, S. Paul Singh, Vicente-Agustin Cloquell-Ballester, Koushik Saha

Industrial Technology and Packaging

Various studies have been conducted to determine the dynamics that single packages undergo during distribution between destinations as a function of package size and weight and carrier. Previous studies have normally focused on regional and domestic measurements of these environments in Europe and North America. However, no information is available to determine the international handling and shipping environment of single parcels between the two continents. This study used instrumented packages containing triaxial accelerometers. The measured shocks were analysed to determine the velocity change levels as a function of the events measured in the distribution environment and to develop data for …

The Benefits Of Automatic Data Collection In The Fresh Produce Supply Chain, Ryan Charles Panos, Tali Freed

Industrial and Manufacturing Engineering

The potential for RFID based systems to improve the safety and efficiency of a supply chain with rapidly decaying products and strict health standards is creating pressure to adopt RFID in several agricultural industries. A handful of fresh produce industry leaders currently participate in mandated pilot projects, while the industry as a whole is still intimidated by the perceived cost of RFID. Therefore in this study we attempt to validate the correlation between performance and automated data collection, paving the way to economic justification of investment in data collection technologies, such as barcode and RFID.

The majority of product in …

Measurement And Analysis Of The Shocks Generated During Egg Production, Jay A. Singh, Chris Ferrier, Paul Singh

Industrial Technology and Packaging

In their journey from the laying cage to shipments out of an egg production operation, table eggs encounter multiple shock events. While all agricultural commodities run the possibility of damage during the course of production, shell eggs are particularly susceptible to being cracked or broken during the production operation. A typical egg production facility experiences 2% to 7% checks (a partial mechanical failure to the egg shell) during handling, packaging and transportation of shell eggs. It has been estimated that the total losses to the U.S. egg industry due to checks and breakage of eggs during production amounts to over …

Development Of Wholesale Packaging To Prevent Post-Harvest Damage To Rose Apples, Bundit Jarimopas, Siam Toomsaengtong, Sher Paul Singh, Jay Singh, Rangsinee Sothornvit

Industrial Technology and Packaging

The purpose of this research was to determine post-harvest damage to rose apples due to transportation hazards and to comparatively evaluate the performance of the current and proposed wholesale packaging for the fruit. The methodology comprised of sampling and conducting damage analysis of rose apples of two varieties (Thongsamsri and Toonklao) distributed using commercial packaging to various retailers and wholesalers selected at random around the Bangkok metropolitan areas. Three kinds of current wholesale packaging were packed with newly harvested, damage-free, and uniform sized Thongsamsri rose apples and tested using a vibration simulator. The same testing was performed for the two …

Comparison Of Package Cushioning Materials To Protect Post-Harvest Impact Damage To Apples, Bundit Jarimopas, Sher Paul Singh, S. Sayasoonthorn, Jay A. Singh

Industrial Technology and Packaging

Damage to fruits and vegetables continues to be a big challenge as global markets become a reality. Worldwide distribution of sensitive produce is faced with various levels of impacts from shipping and handling. Despite a variety of packaging options available today, bruising damage is commonplace for post-harvest apples throughout the supply chain. The major sources of bruising are compression, impact or vibration forces. Understanding where these forces occur can help reduce this type of mechanical damage to apples. The purpose of this study was to investigate the impact characteristics of foam net and corrugated board when applied as wrapping for …

Assessing Capacity Scalability Policies In Rms Using System Dynamics, Ahmed M. Deif, Hoda A. Elmaraghy

Industrial Technology and Packaging

This paper presents a model for assessing different capacity scalability policies in Reconfigurable Manufacturing System (RMS) for different changing demand scenarios. The novelty of this approach is two fold: (1) it is the first attempt to explore different capacity scalability policies in RMS based on multiple performance measures, mainly scaling rate, Work In Process level, inventory level and backlog level; and (2) the dynamic scalability process in RMS is modeled for the first time using System Dynamics. Different policies for capacity scalability for various demand scenarios were assessed. Numerical simulation results obtained using the developed capacity scalability model showed that …

Measurement, Analysis, And Comparison Of The Parcel Shipping Shock And Drop Environment Of The United States Postal Service With Commercial Carriers, J. A. Singh, S. P. Singh, G. Burgess, K. Saha

Industrial Technology and Packaging

The past decade has shown a great increase in the number of direct to consumer shipments of products and packages. As a result, parcel delivery companies like DHL, FedEx, UPS, and the USPS have strengthened their presence in air transport to deliver products faster and through larger distances. Using cargo planes, they route packages from various destinations to large airport hubs, where they sort millions of packages and ship them to their destinations. There is a continuous need to quantify what happens to these packages as they are handled both manually during collection and delivery and on large high-speed conveying …

Fabrication Of Net-Shape Functionally Graded Composites By Electrophoretic Deposition And Sintering: Modeling And Experimentation, E.A. Olevsky, X. Wang, A. Maximenko, M.A. Meyers

Industrial and Manufacturing Engineering

It is shown that electrophoretic deposition (EPD) sintering is a technological sequence that is capable of producing net-shape bulk functionally graded materials (FGM). By controlling the shape of the deposition electrode, components of complex shapes can be obtained. To enable sintering net-shape capabilities, a novel optimization algorithm and procedure for the fabrication of net-shape functionally graded composites by EPD and sintering has been developed. The initial shape of the green specimen produced by EPD is designed in such a way that the required final shape is achieved after sintering-imposed distortions. The optimization is based on a special innovative iteration procedure …

Investigation Of The Lead-Free Solder Joint Shear Performance, James Webster, Jianbiao Pan, Brian J. Toleno

Industrial and Manufacturing Engineering

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC …

Agile Mpc System Linking Manufacturing And Market Strategies, Ahmed M. Deif, Waguih H. Elmaraghy

Industrial Technology and Packaging

Increasing complexity and interdependency in manufacturing enterprises require an agile manufacturing paradigm. This paper considers a dynamic control approach for linking manufacturing strategy with market strategy through a reconfigurable manufacturing planning and control (MPC) system to support agility in this context. A comprehensive MPC model capable of adopting different MPC strategies through distributed controllers of inventory, capacity, and WIP is presented. A hierarchical supervisory controller (referred to as decision logic unit, DLU) that intakes the high-level strategic market decisions and constraints together with feedback of the current manufacturing system state (WIP, production, and inventory levels) and optimally manages the distributed …

Investigating Optimal Capacity Scalability Scheduling In A Reconfigurable Manufacturing System, Ahmed M. Deif, Waguih Elmaraghy

Industrial Technology and Packaging

Responsiveness to dynamic market changes in a cost-effective manner is becoming a key success factor for any manufacturing system in today’s global economy. Reconfigurable manufacturing systems (RMSs) have been introduced to react quickly and effectively to such competitive market demands through modular and scalable design of the manufacturing system on the system level, as well as on the machine components’ level. This paper investigates how RMSs can manage their capacity scalability on the system level in a cost-effective manner. An approach for modeling capacity scalability is proposed, which, unlike earlier approaches, does not assume that the capacity scalability is simply …

Synthesis Of Gold Micro- And Nano-Wires By Infiltration And Thermolysis, E.A. Olevsky, X. Wang, E. Bruce, M.B. Stern, S. Wildhack, F. Aldinger

Industrial and Manufacturing Engineering

An approach for synthesizing micro- and nano-sized gold wires by infiltration and thermolysis is investigated. A porous ZrO₂ ceramic preform with aligned pores obtained by unidirectional freezing and freeze-drying is employed as an infiltration template. The sintered porous ZrO₂ preform is then infiltrated by a brushing gold solution. The thermolysis is conducted at 600 °C in air. Micro- and nano-sized gold wires are developed within the walls of the pores after thermolysis. The diameter of the gold wires ranges from several hundred nanometers to several microns.