Operations Research, Systems Engineering and Industrial Engineering Commons^™

Wire Bonding Challenges In Optoelectronics Packaging, Jianbiao Pan, Patrice Fraud

Industrial and Manufacturing Engineering

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to have deep access capability. In this paper, the wire bonding technologies are reviewed and ball bonding and wedge bonding are compared. The variables that affect the wire bonding process are then discussed. Finally, the challenges of wire bonding in optoelectronics packaging are presented in detail.

Effect Of Chromium-Gold And Titanium-Titanium Nitride-Platinum-Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications require good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr/Au and Ti/TiN/Pt/Au metallization systems. Both chromium and titanium are used to promote adhesion between substrates and sputtered gold films. Both can diffuse the gold surface after annealing and degrade the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr/Au and Ti/TiN/Pt/Au, annealing, and CAN etch processes on 25.4 times; 254 μm (1 × 10 mil) ribbon bonding. All bonds were …

Review Of The Product Development Process And Information Flow In The Manufacturing Industry: Problems And A Possible Wav Forward, E Opiyo

Tanzania Journal of Engineering and Technology (TJET)

No abstract provided.

Development Of A Multidisciplinary Engineering Foundation Spiral, Samuel Bogan Daniels, Bouzid Aliane, Jean Nocito-Gobel, Michael Collura

Engineering and Applied Science Education Faculty Publications

To operate effectively in today’s workforce engineers need to have a muti-disciplinary perspective along with substantial disciplinary depth. This broad perspective cannot be achieved by merely taking 2 or 3 engineering courses outside of the major, but rather will require a radical change in the way we educate engineers. The faculty of the School of Engineering and Applied Science at the University of New Haven have developed a new approach: the Multidisciplinary Engineering Foundation Spiral. This curricular model provides the needed mix of breadth and depth, along with the desired professional skills, by providing carefully crafted, well-coordinated curricular experiences in …

Project-Based Introduction To Engineering -- Course Assessment, Samuel Bogan Daniels, Michael Collura, Bouzid Aliane, Jean Nocito-Gobel

Engineering and Applied Science Education Faculty Publications

The School of Engineering and Applied Science at the University of New Haven has a newly developed project-based Introduction to Engineering course. This new course plays a central role in the new Multi-Disciplinary Engineering Foundation Spiral curriculum as the first semester course for all engineering freshmen. An assessment process was developed to determine the effectiveness of this project-based course, specifically with attention towards assessing attitudes, impact on retention, problem-solving and engineering foundation topics. This paper addresses the particular portion of the assessment process for the individual course projects and their contribution to the last two assessment categories.

Project-Based Introduction To Engineering - A University Core Course, Samuel Bogan Daniels, Bouzid Aliane, Jean Nocito-Gobel, Michael Collura

Engineering and Applied Science Education Faculty Publications

This paper describes a first year engineering course that is taken by both engineering and non-engineering students. The project-based Introduction to Engineering course, EAS107P, fulfills a university core curriculum elective. Although engineering students take the course during their first year, students from other majors typically elect to take the course later in their curriculum. The focus of EAS107P is to have students experience the engineering design and problem solving process in a multi-disciplinary, team-based setting. In addition to learning about design, students develop an interest in the engineering profession and build a foundation of skills for future work. An additional …

Project Planning & Development For Engineering Freshmen, Bouzid Aliane, Michael Collura, Samuel Bogan Daniels, Jean Nocito-Gobel

Engineering and Applied Science Education Faculty Publications

The nature and background of students seeking an engineering education has changed drastically in the last decade, as has the expectations of industrial employers. Many students lack the organizational skills needed for academic success. Similar organizational skills, although more advanced, are required for managing engineering projects. A new course was developed by the faculty at the School of Engineering and Applied Science at the University of New Haven. Through this course, a key component of the Multidisciplinary Engineering Foundation Spiral, seeks to promote higher retention rates, increase student motivation and begin a confidence-building transition to professional practice. Project management concepts …

Combining Systematic Layout Planning And Computer Simulation In The Design Of Manufacturing Facilities, Akintoye M. Akinyoade

All-Inclusive List of Electronic Theses and Dissertations

In this study, the systematic layout planning (SLP) and computer simulation were combined to improve the layout design of a manufacturing facility using a case study.

Critical Variables Of Solder Paste Stencil Printing For Micro-Bga And Fine-Pitch Qfp, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Stencil printing continues to be the dominant method of solder deposition in high-volume surface-mount assembly. Control of the amount of solder paste deposited is critical in the case of fine-pitch and ultrafine-pitch surface-mount assembly. The process is still not well understood as indicated by the fact that industry reports 52-71% surface-mount technology (SMT) defects are related to the solder paste stencil printing process. The purpose of this paper is to identify the critical variables that influence the volume, area, and height of solder paste deposited. An experiment was conducted to investigate the effects of relevant process parameters on the amount …

A Supply Chain Management Tool For Linking Courses In Manufacturing Engineering , Daniel Waldorf, Sema E. Alptekin

Industrial and Manufacturing Engineering

A Recent Society of Manufacturing Engineers (SME) grant received by Manufacturing Engineering Program at Cal Poly has provided funds to strengthen its curricular focus on supply chain management, flexibility, business skills, quality, and process controls. New courses and laboratories are developed in electronics manufacturing, information technology, and supply chain management. A functioning supply chain environment has been developed to provide vertical integration among several courses. A software tool being developed in-house integrates the activities of the students who play the roles of customers and suppliers. Details of the various components of this comprehensive project are presented in this paper.

The Frequency Distribution Of Quantization Error In Digitizers For Coherent Sampling, Sol Neeman Ph.D.

Engineering Studies Faculty Publications and Creative Works

In this paper the frequency distribution of quantization error in coherent sampling of digitizers will be investigated. As the distribution of the quantization error affects the values of THD and SNR, it is relevant for a correct interpretation of THD and SNR of sine waves in coherent sampling. The distribution of the quantization error will be analyzed as a function of N, total number of samples and M, number of cycles in the sample set and it will be proved that for certain cases, the quantization error falls on odd harmonics only of the frequency of the sampled sine wave.

Why Toyota And Honda Topped The 2002 J.D. Power Quality Study, Susan Lightle, Kenneth Yale Rosenzweig, John Talbott

Accounting Faculty Publications

Toyota again topped the annual J. D. Power and Associates quality study released in late May of 2002. Toyota scored the highest mark ever with l 07 defects per l 00 vehicles, while Honda came in second with 113 defects. The study was based on responses of approximately 65,000 new car owners queried during their first 90-days of ownership.

These results do not surprise us, as we have been fortunate to make numerous sojourns to the Toyota plant in Georgetown, Kentucky, and observe the manufacturing processes. These trips were normally facilitated by a former Japanese student of ours, Minako Yanke, …

Optimization-Based Architecture For Managing Complex Integrated Product Development Projects, Hisham Mohamed El-Sayed Abdelsalam

Mechanical & Aerospace Engineering Theses & Dissertations

By the mid-1990's, the importance of early introduction of new products to both market share and profitability became fully understood. Thus, reducing product time-to-market became an essential requirement for continuous competition. Integrated Product Development (IPD) is a holistic approach that helps to overcome problems that arise in a complex product development project. IPD emphasis is to provide a framework for an effective planning and managing of engineering projects. Coupled with the fact that about 70% of the life cycle cost of a product is committed at early design phases, the motivation for developing and implementing more effective methodologies for managing …

Composite Structures Using Asphalt Based Roofing Scrap Materials: Eiera -- Final Report, V. J. Flanigan, K. Chandrashekhara, Susan L. Murray

Mechanical and Aerospace Engineering Faculty Research & Creative Works

The uses of recycled materials in composites provide the potential for large cost savings and a solution to the ever-growing disposal problem. Shingles contain petroleum based binders and fillers, which used as a valuable resource in composite production. Composites offer inherent advantages over traditional materials in regard to corrosion resistance, design flexibility and extended service life. Use of scrap-roofing shingles as a core material in glass fiber reinforced composite materials offer potential low cost composite products such as sound barrier system, railroad ties and other building materials including blocks. In the present work, processes have been developed for shredding scrap …

Comparison Of Repair Costs Of Two Wheel Drive Tractors Under Tanzania Conditions, S. M. Mpanduji

Tanzania Journal of Engineering and Technology (TJET)

The repair costs of 2WD tractors were investigated in order to provide important information, which lacks in the scope of agricultural mechanization in Tanzania. Previously repair cost functions established for tractors in developed countries were used for both theoretical and practical purposes. The findings of this study have revealed that repair costs of tractors vary substantially from one make to another. The prediction functions developed in this study indicated that the magnitudes of repair costs in Tanzania are higher than the repair costs established in Europe and North America. The reason for this could be either due to high cost …

A Taxonomy Of Scheduling Problems In Semiconductor Device Test Operations, Tali Freed, Robert C. Leachman, Kenneth H. Doerr

Industrial and Manufacturing Engineering

Semiconductor device test facilities differ not only by production volume and tester brands. The complexity of the devices and the characteristics of the testers affect the scheduling methodologies as well. Goals and strategies vary from one firm to another, leading to a variety of objectives and performance measures. Due to random yield lot size is variable and lot priorities are common. Changeover times are oftentimes sequence-dependent. Since semiconductor device testing systems are very costly, scheduling methods that increase the throughput of the facility are financially significant. In this paper we describe a variety of semiconductor device testing environments, develop mathematical …

Generic Cost Estimation Framework For Design And Manufacturing Evaluation, Uday A. Kilkami

Mechanical & Aerospace Engineering Theses & Dissertations

A major drawback of current cost estimation models is their incapability of embracing effectively complete product development stage. Parametric estimation works well in early stages of design, but in detail design stage, a more complete estimation is provided by process model based and detail estimation techniques. A major paradigm shift is proposed in this work whereby ‘Cost’ is to be considered as a design parameter from scientific perspective, and it is to be treated as a design consequence rather than as an operational outcome. A comprehensive framework using System Analysis fundamentals is designed to study ‘Process Cost’ aspects of part …

Adaptive Critic-Based Neural Network Controller For Uncertain Nonlinear Systems With Unknown Deadzones, Pingan He, Jagannathan Sarangapani, S. N. Balakrishnan

Electrical and Computer Engineering Faculty Research & Creative Works

A multilayer neural network (NN) controller in discrete-time is designed to deliver a desired tracking performance for a class of nonlinear systems with input deadzones. This multilayer NN controller has an adaptive critic NN architecture with two NNs for compensating the deadzone nonlinearity and a third NN for approximating the dynamics of the nonlinear system. A reinforcement learning scheme in discrete-time is proposed for the adaptive critic NN deadzone compensator, where the learning is performed based on a certain performance measure, which is supplied from a critic. The adaptive generating NN rejects the errors induced by the deadzone whereas a …

A Comparative Study On Projected And Actual Manufacturing Times To Identify The Source Of Customer Delinquency, Zaki Kuruppalil

All-Inclusive List of Electronic Theses and Dissertations

This study was an investigation of the projected lead time and the actual lead time for a part manufactured at Tri-Industries Inc., Terre Haute, Indiana. The research was focused on a single part produced in Tri-Industries. The problem was that there is a difference in the projected lead time and the actual lead time of the part under investigation. The actual lead time was longer than projected lead time, which resulted in the company being delinquent in customer delivery. This investigation was conducted to find out the source for customer delinquency for a single part in Tri-Industries. The conclusion was …

Simulation Of Engineering Systems Described By High-Index Dae And Discontinuous Ode Using Single Step Methods, Marc Compere

Publications

This dissertation presents numerical methods for solving two classes of or-dinary diferential equations (ODE) based on single-step integration meth-ods. The first class of equations addressed describes the mechanical dynamics of constrained multibody systems. These equations are ordinary differential equations (ODE) subject to algebraic constraints. Accordinly they are called differential-algebraic equations (DAE).

Specific contributions made in this area include an explicit transforma-tion between the Hessenberg index-3 form for constrained mechanical systems to a canonical state-space form used in the nonlinear control communities. A hybrid solution method was developed that incorporates both sliding-mode control (SMC) from the controls literature and post-stabilization from …

Computer-Aided Engineering For Tool Design In Manufacturing Engineering Curriculum, Daniel J. Waldorf

Industrial and Manufacturing Engineering

At Cal Poly – San Luis Obispo, a variety of tool design issues are covered in a junior-level manufacturing engineering course called Tool Engineering. In the course, designing fixtures – for any process – is a major component of the content. The process of designing a fixture is similar to the method a mechanical engineer would use to design a new product. The course is therefore an excellent opportunity to teach design principles to manufacturing engineers. This project involves an attempt to introduce computer-aided methods, including the finite element method (FEM), for analysis of tool design into the Tool Engineering …

Teaching Factory, Sema E. Alptekin, Reza Pouraghabagher, Patricia Mcquaid, Daniel Waldorf

Industrial and Manufacturing Engineering

Academia must develop a new approach to teaching in order to better prepare engineering students to function efficiently and adjust readily within the framework of the factories in the real world. Some engineering programs emphasize theory, while others emphasize application as isolated blocks. The "Teaching Factory" being developed at Cal Poly combines both theory and applications. It makes use of state-of-the-art industrial grade production equipment, computer hardware and software in the form of the following two systems: 1) a functioning "real" factory hardware environment, and 2) a Production Planning and Control Center.

The Need For Emphasis On Teaching The Content Of Certain Subject Areas And Teaching Concepts Related To Certain Packaging Industry Job Titles As Perceived By Packaging Professionals In Indiana And The Surrounding States, Marion D. Schafer

All-Inclusive List of Electronic Theses and Dissertations

The study investigates the opinions or packaging professionals about an appropriate curriculum for a Bachelor of Science degree program in packaging. The study was conducted by surveying packaging profossionals randomly seleclcd from the Central Indiana Institute of Packaging Professionals mailing list. This list was made up mostly of Indiana residents but included a few residents from the fhur surrounding slates. The study was initiated as a first step in the process of developing appropri.ite improvements to the curriculum for the Bachelor of Science degree in packaging al Indiana State University. Six packaging job titles and twenty-three su~jcct areas were chosen …

Study Of Automotive Hydromount Mechanism, Min Lu

Dissertations

The hydromount mechanism is studied. It was determined that the dynamic characteristics of the hydromounts are related to the rubber static stiffness, rubber damping coefficient, volumetric stiffness, and effectiveness of the oscillating fluid in the inertia track. At high frequencies the motion of the fluid in the inertia track diminishes so that its effect is negligible and may be ignored. It is also concluded that the rubber damping has a minimal effect on the hydromount dynamic properties and may be neglected. The maximum loss angle, which corresponds to the maximum damping coefficient of the hydromount, occurs near the inertia track …

Plastic Solder Paste Stencil For Surface Mount Technology, Christopher K. Wong, Daniel Waldorf

Industrial and Manufacturing Engineering

Solder paste masks or stencils are an integral part of the manufacturing process for surface mount PCBs. This study examines the feasibility of a process for rapid creation of a solder paste stencil using thermoplastic material. CNC laser cutting of the stencil geometry is replacing traditional use of chemical etching on metal sheets to produce stencils. Laser cutting has been used to improve process speed, accuracy, and cost. This research attempts to continue to simplify and reduce costs in the stencil making process by proposing as the stencil material a common thermoplastic that can be cut easily and quickly using …

Product Flexibility In Selecting Manufacturing Planning And Control Strategy, Emine Persentili, Sema E. Alptekin

Industrial and Manufacturing Engineering

The manufacturing systems capable of producing several products simultaneously are frequently subject to changes in product types due to demand fluctuations. In such systems a product flexible manufacturing planning and control (MPC) strategy is needed to change from one product type to another with minimum deterioration to system performance levels. The objective of this research is to develop a systematic analysis and evaluation approach in order to compare the MRP-push and JIT-pull strategies quantitatively based on a product flexibility measure. A new product flexibility measure is developed based on the sensitivity to change concept and presented together with the implementation …

Process Flow Optimization Studies Through Discrete Event Simulation, Milind Chokshi

Electrical & Computer Engineering Theses & Dissertations

Computer-aided simulation has begun to emerge as a powerful tool for numerical analysis of the behavior and anticipated performance of industrial systems and their optimization. Applications include materials handling, storage and controls systems, prediction of manufacturing efficiencies, and production optimization. Simulations are used to test baseline models and subsequently analyze new production concepts, operating strategies, and planned procedures prior to costly implementation.

The study of process flows in a manufacturing environment is difficult due to its inherent stochastic nature. Breakdown of the sub-systems and failures of machines is a random process and needs to be solved based on concepts of …

An Integrated Engineering-Computation Framework For Collaborative Engineering: An Application In Project Management, Hisham Mohamed El-Sayed Abdelsalam

Mechanical & Aerospace Engineering Theses & Dissertations

Today's engineering applications suffer from a severe integration problem. Engineering, the entire process, consists of a myriad of individual, often complex, tasks. Most computer tools support particular tasks in engineering, but the output of one tool is different from the others'. Thus, the users must re-enter the relevant information in the format required by another tool. Moreover, usually in the development process of a new product/process, several teams of engineers with different backgrounds/responsibilities are involved, for example mechanical engineers, cost estimators, manufacturing engineers, quality engineers, and project manager. Engineers need a tool(s) to share technical and managerial information and to …

Application Of Wavelets And Principal Component Analysis In Image Query And Mammography, Sol Neeman Ph.D.

Engineering Studies Faculty Publications and Creative Works

Breast cancer is currently one of the major causes of death for women in the U.S. Mammography is currently the most effective method for detection of breast cancer and early detection has proven to be an efficient tool to reduce the number of deaths. Mammography is the most demanding of all clinical imaging applications as it requires high contrast, high signal to noise ratio and resolution with minimal x-radiation. According to studies [36], 10% to 30% of women having breast cancer and undergoing mammography, have negative mammograms, i.e. are misdiagnosed. Furthermore, only 20%-40% of the women who undergo biopsy, have …

Production Innovation Through Design Methodology: Development Of A Fuel Pump For Motorists, E. Elias

Tanzania Journal of Engineering and Technology (TJET)

Design Methodology is a discipline of scientific engineering design for provision of solutions to user needs. It is composed of design models (showing the path/procedural steps of design) and design tactics (i.e. techniques, technologies and methods aiding the designer). When rigorously applied, design methodology leads to innovation of products and businesses.

The present paper describes how design methodology was applied to the development of a siphon device (Apump@) for motorists when in need to refill fuel in their vehicles away from petrol stations. The need for the device was realised through the method of Alooking around & deep thinking@ and …