Manufacturing Commons^™

Warehouse Redesign, Cristine Carmel Dewar

Industrial and Manufacturing Engineering

A young, growing biomedical company is expanding its warehouse space to keep up with the increasing production. This project’s goals were to recommend a layout and improve a process that would minimize the distance traveled by the material handlers, increase the safety of the warehouse by implementing visual controls, implement ergonomics to reduce chance of injury, and save money for the company. To achieve this first I familiarized myself with their current processes and department and the space required for their current and future production levels. Next I created two alternative layouts, the first (Layout A) to minimize distance and …

Integrating Courses Through Project Based Learning, Lizabeth Schlemer, Sema E. Alptekin, Karen R. Bangs

Industrial and Manufacturing Engineering

Integrating three courses (one sophomore level, two senior level) through Project Based Learning (PBL) within the Industrial Engineering curriculum at the California Polytechnic State University, San Luis Obispo is presented. Three courses (IME 443 Facilities Planning and Design - senior level; IME 420 Simulation - senior level; and IME 223 Process Improvement Fundamentals - sophomore level) were linked by various mechanisms: Common industry projects, common students in two of the three courses; senior students having access to sophomores in their teams to carry out time consuming tasks such as time studies, and sophomores having access to seniors as team members, …

Effect Of Gold Content On The Microstructural Evolution Of Sac305 Solder Joints Under Isothermal Aging, Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland

Industrial and Manufacturing Engineering

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag- 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one …

The Morphology Evolution And Voiding Of Solder Joints On Qfn Central Pads With A Ni/Au Finish, Julie Silk, Jianbiao Pan, Mike Powers

Industrial and Manufacturing Engineering

In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish. Samples were isothermally aged at the equivalent of 0, 2, 7 and 14 years service life. Representative solder joints were cross-sectioned and analyzed using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) in order to investigate the evolution of the solder joint morphology as a function of Au content and isothermal aging. IMC thickness was …

Introducing Fly Ash Into Lsi's Recipe, Andrew Mathias Beckrich

All Graduate Theses, Dissertations, and Other Capstone Projects

There has been published data that states that concrete producers can use Fly Ash as an alternative to Portland cement and still generate similar or better strength properties. By applying these principles to our industry and products, what new processes will need to be put in place and followed? What is the correct combination/portion of Fly Ash that will produce similar and better results as well as the adjusted new recipes? What type of cost is associated with the introduction of this new ingredient? Lastly, how does this affect the quality and reputation of the product?

Investigation Into The Usability Of Micromechanical Models To Predict The Behavior Of A Nanocomposite Polymer, Jason Handlogten

All Graduate Theses, Dissertations, and Other Capstone Projects

The purpose of this thesis was to determine the acceptability of a set of existing nanocomposite test specimens for tensile testing and then to determine the Young's and shear modulus of these test specimens. If the test specimens were found to be acceptable, the accuracy of three micromechanical models was to be evaluated by comparing their predictions to the mechanical properties determined from testing the specimens. The set of existing nanocomposite test specimens had a distinct concave shape on two surfaces that were believed to be intended as flat. In order to determine if they adhered to the Type I …

An Empirical Study On Quality Management Practices, Organization Performance And Suppliers' Selection In Southern Minnesota Manufacturing Firms, Rachel Yetunde-Abiodun Awoku

All Graduate Theses, Dissertations, and Other Capstone Projects

Quality management systems (QMS) have been widely applied successfully by many manufacturing companies to improve their process, increase profits and organizational performance. The most applied of the quality programs are ISO 9001, Total Quality Management (TQM), Just-In-time (JIT), Lean Management and Six Sigma. Although past studies on quality management have identified and studied the implementation of quality management practices, there is little or no research on quality management practices and business performance in Southern Minnesota manufacturing companies. Many researchers have concluded that the implementation of quality management practices has led to significant improvements in companies' business performance while others have …

A Study Of Solder Joint Failure Criteria, Jianbiao Pan, Julie Silk

Industrial and Manufacturing Engineering

One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a solder joint or a daisy-chain. However, no scientific research has been done in establishing the relationship between the crack area of an interconnection and the change in resistance of the interconnection. This paper proposes a method …

Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland

Industrial and Manufacturing Engineering

Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well as for component leads, especially wire-bondable high-frequency packages, where the gold thickness requirement for wire bonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this paper is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au …

The Inside-Out Classroom: A Win-Win Strategy For Teaching With Technology, Daniel J. Waldorf, Lizabeth Schlemer

Industrial and Manufacturing Engineering

As costs of higher education soar and many universities face uncertain funding models, institutional pressures have increased to improve instructor efficiency. At the same time, U.S. industry leaders and leading educators have called for improvements in engineering education based on more interactive, hands-on student learning experiences. Although many efforts have been made to take advantage of technology to either improve student learning or to maintain student learning while increasing instructor efficiency, few approaches have been shown to improve both learning and efficiency. A teaching method is proposed to improve student learning and increase student satisfaction while also addressing the instructors’ …

Evolving A Summer Engineering Camp Through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, Teana Fredeen

Industrial and Manufacturing Engineering

EPIC (Engineering Possibilities in College) is a one-week summer program for high school students (entering 9th-12th grades) to learn about engineering and experience hands-on labs in a university atmosphere. It's an opportunity for students to explore the different types of engineering available at many universities. The aim of EPIC is to expand the College of Engineering mission to K-12 students: "To educate students for careers of service, leadership and distinction in engineering or other fields by using a participatory, learn by doing, ‘hands-on’ approach".

Design Projects With Out-Of-Town Companies, Lizabeth Schlemer

Industrial and Manufacturing Engineering

The capstone design class in the industrial engineering department at California Polytechnic State University, San Luis Obispo (Cal Poly) includes projects with companies. The projects are large ambiguous facilities design problems that allow students to incorporate many aspects of the IE curriculum. For the past 15 years students have been participating in these projects with local companies. Over the past several years, companies from out of town (200 miles to the north in Mountain View or 200 miles to the south in Oxnard) have participated. These out of town companies have presented certain logistical issues, but they have proven to …

Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, Patrick Hyland

Industrial and Manufacturing Engineering

Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads, especially wire-bondable high frequency packages, where the gold thickness requirement for wirebonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this study is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au thicknesses using …

High-Resolution, Non-Contact Angular Measurement System For Psa/Rsa, Ronald D. Sloat

Master's Theses

A non-contact angular measurement system for Pitch Static Attitude (PSA) and Roll Static Attitude (RSA) of hard disk drive sliders is designed and built. Real-time sampling at over 15 KHz is achieved with accuracy of +/- 0.05 degrees over a range of approximately 2-3 degrees. Measuring the PSA and RSA is critical for hard drive manufacturers to control and improve the quality and reliability of hard drives. Although the hard drive industry is able to measure the PSA and RSA at the subassembly level at this time, there is no system available that is able to measure PSA/RSA at the …

Perspectives On Quality Coordination And Assurance In Global Supply Chains, Ling Li, John N. Warfield

Information Technology & Decision Sciences Faculty Publications

The 2007 recall of Berko Electric Toe-Space Heaters made in the US, the recall of backpack blowers made in Japan, the recalls of toys and pet food produced in China have exposed the potential of global supply chain disruptions. This product recall storm leads to the issue of quality assurance in global supply chain management. Product recalls indicate that manufacturing companies are particularly vulnerable to ensure quality when they source via a global supply chain with poor visibility. Obviously, a supply chain cannot afford this kind of sourcing and supply structure that threatens the supply-chain integrity. This special issue on …

Estimating Industrial Building Energy Savings Using Inverse Simulation, Franc Server, J. Kelly Kissock, Dan Brown, Steve Mulqueen

Mechanical and Aerospace Engineering Faculty Publications

Estimating energy savings from retrofitting existing building systems is traditionally a time intensive process, accomplished by developing a detailed building simulation model, running the model with actual weather data, calibrating the model to actual energy use data, modifying the model to include the proposed changes, then running the base and proposed models with typical weather data to estimate typical energy savings. This paper describes a less time-intensive method of estimating energy savings in industrial buildings using actual monthly energy consumption and weather data. The method begins by developing a multivariate three-parameter changepoint regression model of facility energy use. Next, the …

Development Of A Task Assignment Tool To Customize Job Descriptions And Close Person-Job Fit Gaps, Bryan W. Booker

Dissertations

Does the knowledge worker fit the job or should the job fit the knowledge worker? This research developed a methodology and a tool to customize a knowledge worker’s job design to better fit their knowledge, skills, abilities and characteristics. The research outcomes support the customization of the job design to improve person-job fit, the documentation of the customized job design as a position description, and the use of a structured person-task assignment process. The recommended task assignment process includes a job aid that uses multivariate equations to predict expected task performance. Data were collected from two knowledge worker sub-groups: lean …

Testing The Test: Validity And Reliability Of Senior Exit Exam, Lizabeth Schlemer, Daniel Waldorf

Industrial and Manufacturing Engineering

A senior exit exam is considered an excellent direct measure of student learning for ABET assessment, but the usefulness of the information gathered is related to the validity and reliability of the test itself. The Industrial and Manufacturing Engineering Department at California Polytechnic State University, San Luis Obispo has used a content exam for several years. This paper will discuss test development, administration, and the role it plays in the assessment process. In addition, the test is evaluated using the standard psychometric techniques of reliability and validity. The results of the evaluation are used to refine the test. The importance …

Development And Assessment Of A Pcb Layout And Manufacturong Laboratory Module In Introductory Electric Circuits For Ee And Non-Ee Majors, Albert Liddicoat, Jianbiao Pan, James G. Harris, Gary Perks, Linda Shepherd

Industrial and Manufacturing Engineering

In standard introductory electric circuits laboratories for electrical engineering (EE) majors and non-EE majors, prototype boards are typically used to construct and test electric circuits. Students typically do not learn how to design and manufacture Printed Circuit Boards (PCB) that are commonly used in more sophisticated design projects and other engineering applications. This paper will present the development and assessment of a PCB layout and manufacturing laboratory module that has been used in introductory electric circuits laboratories for EE and non-EE majors. The feasibility of integrating the new PCB layout and manufacturing module into the electric circuit course will be …

Assessing Curriculum Improvement Through Senior Projects, Jianbiao Pan, Albert Liddicoat, James G. Harris, Linda Shepherd

Industrial and Manufacturing Engineering

Senior project and/or capstone design courses are intended to provide a culminating design experience for students and to demonstrate their understanding of engineering knowledge and their ability to apply that knowledge to practical problems. It is expected that the quality and attributes of students’ senior design projects can be used as a good measure of determining how well the curriculum prepares students to engage in engineering design as well as a measure of faculty teaching and student learning. This paper reports the results of a study designed to assess whether the new computer engineering curriculum implemented at Cal Poly over …

Laser Clean Room Re-Design: A Manufacturing Facility Re-Layout, Jennifer J. Siu

Industrial and Manufacturing Engineering

Alcon’s Laser Clean Room fosters inefficient production practices, is outdated for its current process, and lacking in clear process/product flow. A facility re-design is applied to bring order, efficiency, and optimize flow in the laser production lines.

Deliverables include a new layout that decreases product travel distances and increases productivity as well as an implementation plan and cost/savings analysis. Major design decisions include downsizing the clean room, sorting to find waste and establishing clear process/product flows. The design was implemented within three weeks and results yield 29% reduction of product travel distance, 10.4 hrs/day saved from eliminated gowning time and …

Using Sports Coaching Techniques To Enhance Project Based Learning Instruction, Lizabeth Schlemer, Faith Mimnaugh

Industrial and Manufacturing Engineering

As instructors attempt to apply project based learning as a preferred pedagogy for many aspects of engineering education, countless questions are raised. For instance, how do instructors assess individual performance in a team based environment? How do instructors prepare students for the culminating presentation or report? How do instructors develop the students individually? After reviewing literature on both project based learning and exceptional coaching, we have found that much can be learned from John Wooden, Phil Jackson and other coaches. This paper will organize some of the best practices in sports coaching and draw parallels that will enhance student learning …

Design For Manufacturing Of Sports Equipment, Cedrick Bit, Christopher L. Head

Industrial and Manufacturing Engineering

The purpose of this project was to validate industrial designs for a product in its conceptual stage and suggest/implement design changes that suit the contracting company’s needs while assuring the product maintains its basic functional requirements. Techniques and methods used to validate the design include 3‐D solid modeling, physical product application using rapid prototyping to produce the product. Methods of design for manufacturing were analyzed in the design. Processes used in the validation and verification of the design include solid modeling design, methods of measurements, fixture design and manufacturing processes. Full design specifications and solid model files were finalized and …

Hazard Identification, Risk Assessment And Risk Control (Hirarc) In A Steel Foundry., Lee Hooi Nee

Student Works (2010-2019)

Abstract NA

Drop Impact Reliability Of Edge-Bonded Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board. The test boards were subjected to drop tests at several impact pulses, including a peak acceleration of 900 Gs with a pulse duration of 0.7 ms, a peak acceleration of 1500 Gs with a pulse duration of 0.5 ms, and a peak acceleration of 2900 Gs with a pulse duration of 0.3 ms. A high-speed dynamic resistance measurement system was used to monitor the failure of the solder joints. Two edge-bond materials used in …

Teaming Multi-Level Classes On Industry Projects, Lizabeth Schlemer, Jose Macedo

Industrial and Manufacturing Engineering

For the past few years we experimented with teaming students from a sophomore-level class and a senior-level class to work on industry projects. The classes are “work design” and “facilities design.” Projects are selected to require the application of knowledge from both disciplines. In addition, the projects are selected from small local companies. The intent of this paper is to describe the benefits and difficulties associated with this methodology. While specific classes in this experience are typical of an industrial engineering curriculum, the lessons learned and benefits could translate to other disciplines.

Optimization Of Engineering Tolerance Design Using Revised Loss Functions, Jeh-Nan Pan, Jianbiao Pan

Industrial and Manufacturing Engineering

Engineering tolerance design plays an important role in modern manufacturing. Both symmetric and asymmetric tolerances are common in many manufacturing processes. Recently, various revised loss functions have been proposed for overcoming the drawbacks of Taguchi's loss function. In this article, Kapur's economic tolerance design model is modified and the economic specification limits for both symmetric and asymmetric losses are established. Three different loss functions are compared in the optimal symmetric and asymmetric tolerance design: a revised Taguchi quadratic loss function, an inverted normal loss function and a revised inverted normal loss function. The relationships among the three loss functions and …

Finding And Optimising The Key Factors For The Multiple-Response Manufacturing Process, Jeh-Nan Pan, Jianbiao Pan, Chun-Yi Lee

Industrial and Manufacturing Engineering

With the advent of modern technology, manufacturing processes became so sophisticated that a single quality characteristic cannot reflect the true product quality. Thus, it is essential to perform the key factor analysis for the manufacturing process with multiple-input (factors) and multiple-output (responses). In this paper, an integrated approach of using the desirability function in conjunction with the Mahalanobis-Taguchi-Gram Schmit (MTGS) system is proposed in order to find and optimise the key factors for a multiple-response manufacturing process. The aim of using the MTGS method is to standardise and orthogonalise the multiple responses so that the Mahalanobis distance for each run …

Effects Of Reflow Profile And Thermal Conditioning On Intermetallic Compound Thickness For Snagcu Soldered Joints, Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno

Industrial and Manufacturing Engineering

Purpose – The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Design/methodology/approach – A four-factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding to pads over an organic substrate with gold metallizations. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequencies of 60 KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through the design of experimental methodology for four different cases: 25.4 mm wire at 60 kHz, 25.4 mm wire at 120 kHz, 17.8 mm wire at 60 kHz, …