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Mechanical and Aerospace Engineering Theses - Archive

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Articles 181 - 210 of 677

Full-Text Articles in Mechanical Engineering

Computational Morphology Modelling And Mixed Mode Fracture Analysis Of Zrb2/Sic Based Ceramic Nano-Materials Using Molecular Dynamics, Krutarth Shaileshkumar Patel Dec 2017

Computational Morphology Modelling And Mixed Mode Fracture Analysis Of Zrb2/Sic Based Ceramic Nano-Materials Using Molecular Dynamics, Krutarth Shaileshkumar Patel

Mechanical and Aerospace Engineering Theses - Archive

Transition metal carbides, nitrides, and borides are a group of Ultra High-Temperature Ceramic (UHTC). Owing to their remarkable properties of the high melting point, high thermal conductivity and excellent strength at elevated temperature ZrB2 based composites are of high interest for use in the high-temperature environment. It is proved that addition of SiC in ZrB2 can advance composite’s oxidation resistance, mechanical strength, fracture toughness and sintering behavior. Firstly, molecular dynamics is used to simulate crack growth under mixed mode loading in Al, SiC, and ZrB2 single crystals by considering inclined crack under uniaxial tension and crack growth angle are compared …


Investigation On Metal-Composite Hybrid Flywheels Using Finite Element Method, Ching Huai Wang Dec 2017

Investigation On Metal-Composite Hybrid Flywheels Using Finite Element Method, Ching Huai Wang

Mechanical and Aerospace Engineering Theses - Archive

This research is aimed to investigate the kinetic energy storage of a hybrid metal-composite flywheel rotating at high speeds. The upper limit of energy, which flywheel can supply, is restricted by the strength of material because both energy and stress are proportional to the density of the material and the square of the velocity. Metal flywheels operate at lower rotational speed and supply less energy than the composite flywheels. Composite flywheels have a very high density per unit mass, but lower energy density per unit of the design volume. The ultra-high speed of composite flywheels creates some engineering challenges such …


Reliability Assessment Of Solder Joint Interconnects Of Bga Package-Megtron Series Under Power Cycling, Mahesh Pallapothu Dec 2017

Reliability Assessment Of Solder Joint Interconnects Of Bga Package-Megtron Series Under Power Cycling, Mahesh Pallapothu

Mechanical and Aerospace Engineering Theses - Archive

Solder joint interconnects are the second level assembly in surface mount interconnection technology. Mismatch in the coefficient of thermal expansion (CTE) between package and substrate or PCB creates failure in solder joints such as excessive warpage, low-k dielectric cracking, solder mask cracking and bump cracking. Conventional accelerated thermal cycling tests are performed to evaluate the Solder Joint Reliability (SJR). But, in everyday application, the package is subjected to Power cycling. Power cycling is the phenomenon where the package experiences non-uniform temperature distribution in the package with the chip as an internal heat generating source when an electronic device is turned …


Effective Thermal Conductivity Of Porous Media By Inverse Heat Transfer Analysis, Oscar Javier Ii Fabela Dec 2017

Effective Thermal Conductivity Of Porous Media By Inverse Heat Transfer Analysis, Oscar Javier Ii Fabela

Mechanical and Aerospace Engineering Theses - Archive

This research describes the application of inverse analysis to estimate the thermal conductivity of a porous material using temperature measurements at the surfaces. Finite volume analysis code is implemented in MATLAB and it is utilized to solve the steady state, axisymmetric heat transfer governing energy equation. The analysis code is coupled with a numerical optimization method and utilized to predict thermal conductivity using the measurements. An experimental setup was developed to test a porous media composed of a mixture of small pellets and air. In experiments, temperature is measured at outer surface of copper tube. These data, serves as input …


Real-Time Minimum Jerk Optimal Trajectory Synthesis And Tracking For Ground Vehicle Applications, Naga Venkata Murali Veerapaneni Dec 2017

Real-Time Minimum Jerk Optimal Trajectory Synthesis And Tracking For Ground Vehicle Applications, Naga Venkata Murali Veerapaneni

Mechanical and Aerospace Engineering Theses - Archive

Research on wheeled mobile robots has been an active research field for several decades with focus on the problems of stability, maneuverability and control. The trajectory generation for wheeled mobile robots is usually handled by considering a smooth function satisfying the boundary conditions. Even though this problem is well posed for several function classes, the real issue occurs in generating a feasible trajectory for the robot which takes into account the constraints of the system. Another problem from the control system perspective is, whether the derived controller is stable for the entire trajectory span to track the given trajectory. The …


Pseudo-Spectral Methods Based Real-Time Optimal Path Planning For Unmanned Ground Vehicles, Denish Kamleshkumar Baman Dec 2017

Pseudo-Spectral Methods Based Real-Time Optimal Path Planning For Unmanned Ground Vehicles, Denish Kamleshkumar Baman

Mechanical and Aerospace Engineering Theses - Archive

Real-time optimal trajectory design and tracking for autonomous ground vehicles are maturing technologies with the potential to advance mobility by enhancing time and energy efficiency in application such as indoor surveillance robots or planetary exploration rovers. Pseudo-spectral methods based trajectory generation framework provides the desired trajectory which minimizes a prescribed objective function (i.e. minimum time, acceleration, and energy) while satisfying kinodynamics and various types of constraints (i.e. obstacle avoidance and smooth turning at waypoint transitions). In this thesis cyber-physical system architecture is used for the communication between rover-vehicle and the ground station. By using optimal state and control vector from …


Board Level Solder Joint Reliability Assessment Study Of Megtron 6 Vs Fr-4 Under Power Cycling And Thermal Cycling, Jyotirmoy Denria Dec 2017

Board Level Solder Joint Reliability Assessment Study Of Megtron 6 Vs Fr-4 Under Power Cycling And Thermal Cycling, Jyotirmoy Denria

Mechanical and Aerospace Engineering Theses - Archive

High frequency laminates like Nelco N4000-13, Isola FR408 and Panasonic Megtron 6 packages gained popularity among the industry due to better and improved electrical performances, Improved impedance control, low moisture absorption, good thermal management. High speed laminates are extensively used in high-speed system-level interconnects like high speed network equipment, mainframes, IC testers and high frequency measuring instruments. When an electronic device is turned off and then turned on multiple times, it creates a loading condition called power cycling. The die is the only heat source causing non-uniform temperature distribution. In this paper, the solder joint reliability assessment of Megtron 6 …


A Design Methodology For Continuous Fiber Additive Manufacturing Using Advanced Computer Aided Engineering Techniques, Nicholas Venter Dec 2017

A Design Methodology For Continuous Fiber Additive Manufacturing Using Advanced Computer Aided Engineering Techniques, Nicholas Venter

Mechanical and Aerospace Engineering Theses - Archive

A design methodology for Continuous Carbon Fiber Additive Manufacturing (CCFAM) developed using Computer Aided Engineering (CAE) techniques takes advantage of both the mechanical strength of composite materials and the Fused Filament Fabrication (FFF) method. By performing topology optimization and Finite Element Analysis (FEA) on a load-bearing part, engineers can design much lighter optimized parts that are just as strong as those produced using FFF. This weight reduction is achieved by relying on the mechanical strength of continuous carbon fibers printed alongside a traditional thermoplastic matrix. The FFF additive manufacturing method enables the production of complex shapes, which can match the …


Effect Of Underfill Material & Gap Height On Reliability Of Low-K Large-Die Flip Chip Package Under Thermal Loading, Paul Crisanth Dec 2017

Effect Of Underfill Material & Gap Height On Reliability Of Low-K Large-Die Flip Chip Package Under Thermal Loading, Paul Crisanth

Mechanical and Aerospace Engineering Theses - Archive

The reliability assessment of package assembly is important to predict the performance of any microelectronic devices. Formation of fatigue cracks at the interface between the solder joint and component is the common failure occurring in widely used microelectronic devices. Lead-free solders and advanced silicon process nodes with the low-k dielectrics flip chip package are used and are facing significant reliability challenges. The mismatch of coefficient of thermal expansion (CTE) between the chip and substrate affect solder joint reliability. The underfill encapsulant packaging is widely used to improve chip device reliability. In this paper, we are studying the effect of different …


A Comparative Study Of Wooden And Hyrbid Composite Crossarms Of An Electric Utility Pole, Rohit Avadhani Dec 2017

A Comparative Study Of Wooden And Hyrbid Composite Crossarms Of An Electric Utility Pole, Rohit Avadhani

Mechanical and Aerospace Engineering Theses - Archive

Most of the cross arms in the country are made from wood. Wood, although easily accessible, has its own defects. Environmental effects which includes the expansion and contraction of wood over the years which will disrupt its structural integrity, the presence of termites and other insects which dig into wood and destroy it from the inside, Materials wastage when it comes to improving the structural strength by increasing the cross-sectional thickness and height The replacement of wood with composites seems like a logical idea and also a solution to most of the problems. The applications of composites in our day …


Effect Of Solder Voids And Distance To Neutral Point (Dnp) On Sjr Of Wcsp Under Reflow Condition And Thermal Cycling, Aniruddha Doiphode Dec 2017

Effect Of Solder Voids And Distance To Neutral Point (Dnp) On Sjr Of Wcsp Under Reflow Condition And Thermal Cycling, Aniruddha Doiphode

Mechanical and Aerospace Engineering Theses - Archive

Since the introduction of Chip Scale Packages (CSP’s) in the early 2000s, they have become one of the biggest packaging trends in recent history. There are currently over 50 different types of CSP’s available throughout the industry and the numbers are increasing almost daily. Wafer Level Chip Scale Package’s (WCSP) is kind of CSP’s used widely due to its small form factor which offers efficient use of limited space and miniaturization of the electronic device. On the other hand, small form factor typically incurs greater initial cost in product design and development. In an electronic device, it is equally important …


Strength And Damage Prognosis Of Adhesive Bond And Inter-Ply Hybrid Composites Based On Dielectric Properties, Priyanshu K. Banerjee Dec 2017

Strength And Damage Prognosis Of Adhesive Bond And Inter-Ply Hybrid Composites Based On Dielectric Properties, Priyanshu K. Banerjee

Mechanical and Aerospace Engineering Theses - Archive

Composite materials have found their applications in a wide range of industries particularly in the aerospace and automotive sectors. This is because they are comparatively light-weight and provide a much better corrosion and wear resistance as compared to other ceramics and metals. Adhesive bonding can be used to improve the stress distribution between these composite materials. Moreover, adhesive bond decreases the weight and concentration of stresses in the structure. Broadband Dielectric Spectroscopy, BbDS is a robust tool used for analyzing the dielectric properties of a polymer composite. This method can be used to monitor the curing process of the specimen. …


Multiphase Flow Modeling And Analysis Of Phased Filling Process For Pulsed Detonation Engine, Nirmal Kumar Umapathy Dec 2017

Multiphase Flow Modeling And Analysis Of Phased Filling Process For Pulsed Detonation Engine, Nirmal Kumar Umapathy

Mechanical and Aerospace Engineering Theses - Archive

Filling of reactants into a pulsed detonation engine (PDE) should be carried out quickly because any lengthening of the fill time will lead to an increased cycle time. The fill process and, the purge process constitutes a large proportion of time in a cycle. The purpose of this research was to improve the time of fill by implementing various injection geometries in two injection schemes with five different premixed stoichiometric fuel-air mixture injected at wide range of velocity. The different configurations examined were end wall injection, side wall injection with ports angled and normal to the flow direction and staggered …


An Investigation Of Topology Optimization For Coupled Thermo-Structural Loading For Additive Manufacturing, Vaibhav Shankar Gaikwad Dec 2017

An Investigation Of Topology Optimization For Coupled Thermo-Structural Loading For Additive Manufacturing, Vaibhav Shankar Gaikwad

Mechanical and Aerospace Engineering Theses - Archive

This work investigates the ability of topology optimization methods to design multifunctional components with coupled thermo-structural loading for fabrication with additive manufacturing technologies. Topology Optimization is a mathematical approach developed to perform design optimization with the purpose of reducing material usage, while maximizing the structural and thermal performance, in accordance to specific design constraints. Additive manufacturing provides the capability to create internal structures and complex surfaces developed by topology optimization that would not be possible to produce by conventional manufacturing. The more structurally efficient configuration generated by topology optimization and fabricated with additive manufacturing can result in components with improved …


Numerical Study Of Droplet Evaporation, Ritul Gandhi Dec 2017

Numerical Study Of Droplet Evaporation, Ritul Gandhi

Mechanical and Aerospace Engineering Theses - Archive

Droplet evaporation plays a vital role in various engineering fields such as air/fuel premixing, inkjet printing and many more. The high rate of power dissipation from the integrated circuits and chips of electronic devices creates a need for cooling it to achieve their optimal functionality. The high rate of cooling can be achieved by thin film evaporation of water by phase change as compared to the air cooling methods. Therefore, the study of droplet evaporation is necessary to understand the underlying physics and effects of different parameters on cooling performance. Numerical study of droplet evaporation has been done by using …


Flexible-Continuum Robot For Bladder Tissue Diagnostics, Samson Abimbola Adejokun Aug 2017

Flexible-Continuum Robot For Bladder Tissue Diagnostics, Samson Abimbola Adejokun

Mechanical and Aerospace Engineering Theses - Archive

The aim of this thesis is to investigate and develop a robotic system capable of a transurethral palpation of any targeted area on the bladder interior wall tissue to determine the biomechanical properties of the tissue considering the urinary tract geometric constraints and to demonstrate the motion kinematics of such robot to achieve a desired robot pose normal to any localized region throughout the bladder workspace. Current technologies have, to varied degree of success, provide approximate, global diagnostics information to bladder tissue elasticity. However, no direct access qualitative methods to measure the bladder tissue properties are known. For this reason, …


Enhancing Indirect / Direct Evaporative Heat Exchanger In Data Center Cooling By Using Phase Change Material, Ahmed Ali Abuklam Aug 2017

Enhancing Indirect / Direct Evaporative Heat Exchanger In Data Center Cooling By Using Phase Change Material, Ahmed Ali Abuklam

Mechanical and Aerospace Engineering Theses - Archive

Electrical usage in data center continues to grow and recent projection estimate that it contributes 2% in the electricity use in the U.S. One method of controlling the electrical usage during cooling is to reduce or eliminate mechanical cooling; however, using indirect/direct evaporative (IDE) cooling system is starting to be quite popular. IDE has limitations and in this paper we will show how phase change material (PCM) can extend the cooling capacity of IDE. The PCM has been used for temperature control operations. Latent heat storage is one of the most efficient ways of storing thermal energy in PCM. The …


Cfd Simulation And Design Optimization To Improve Cooling Performance Of Open Compute ‘Big Sur’ Server, Mangesh Mohan Dhadve Aug 2017

Cfd Simulation And Design Optimization To Improve Cooling Performance Of Open Compute ‘Big Sur’ Server, Mangesh Mohan Dhadve

Mechanical and Aerospace Engineering Theses - Archive

In recent years, there have been a phenomenal increase in Artificial Intelligence and Machine Learning that require data collection, mining and using data sets to teach computers certain things to learn, analyze image and speech recognition. Machine Learning tasks require a lot of computing power to carry out numerous calculations. Therefore, most servers are powered by Graphics Processing Units (GPUs) instead of traditional CPUs. GPUs provide more computational throughput per dollar spent than traditional CPUs. Open Compute Servers forum has introduced the state-of-the-art machine learning servers “Big Sur” recently. Big Sur unit consists of 4OU (OpenU) chassis housing eight NVIDIA …


Analysis Of Composite Structures With Curvature Under Temperature Environment, Muthu Ram Prabhu Elenchezhian Aug 2017

Analysis Of Composite Structures With Curvature Under Temperature Environment, Muthu Ram Prabhu Elenchezhian

Mechanical and Aerospace Engineering Theses - Archive

Composite structures are frequently exposed to environments with change in temperatures during their service life. The thermal behaviours of the laminated composite structures are more pronounced than that of the structures made of isotropic materials. For the structures under thermal environment, extensive studies have been conducted to investigate the induced thermal stresses and deformation of composite laminated plates by linear/non-linear analysis and composite structures by finite element analysis. The main focus of this study is concentrated on development of an analytical method for analyzing composite thin shells and/or moderate curved beam structures under temperature environment. This includes the derivation of …


Finite Element Analysis On Hybrid Boron-Carbon Composites, Amruta Rupa Nemani Aug 2017

Finite Element Analysis On Hybrid Boron-Carbon Composites, Amruta Rupa Nemani

Mechanical and Aerospace Engineering Theses - Archive

Adaptability to different situations and the ease of combination makes composites one of the most extensively used materials in the engineering industries. One of the ways of managing properties of composites is hybridization of different fibers in one composite. This work merely focuses upon the analysis of effective stiffness of Hybrid materials which is carried out using Finite Element Method. A series of models were experimented in a sequence by imposing various conditions on each of them. Boron and Carbon fibers were used primarily for these experiments because of their better compatibility than other combinations of fibers. Due to the …


Thermal Modeling Of 3-Dimensionally Stacked Dram Memory, Ratnesh Raj Aug 2017

Thermal Modeling Of 3-Dimensionally Stacked Dram Memory, Ratnesh Raj

Mechanical and Aerospace Engineering Theses - Archive

A large fraction of energy consumed in modern microelectronic devices and systems is taken up by memory access operations, which is expected to cause significant temperature rise. Since memory access operations are very short this is expected to inherently be a transient thermal phenomenon. Despite the critical importance of thermal management in microelectronics, not much work exists on understanding the nature of thermal transport during memory access operations. In this work, a mathematical model to predict the transient temperature rise within a 3D layered memory chip is presented. Most heat-generating memory access processes occur over a short timescale for which …


Numerical Simulation Of Flow In Fluidic Valves In Rotating Detonation Engines, Nandini Gopalakrishnan Aug 2017

Numerical Simulation Of Flow In Fluidic Valves In Rotating Detonation Engines, Nandini Gopalakrishnan

Mechanical and Aerospace Engineering Theses - Archive

Rotating detonation engines (RDE) have received considerable research attention in recent times for use in propulsion systems. The cycle frequency of operation of an RDE can be as high as 10,000 Hz. Conventional mechanical valves cannot operate at such high frequencies, leading to the need for propellant injectors or valves with no moving parts. A fluidic valve is such a valve and is the focus of this study. The valve consists of an orifice connected to a constant area plenum cavity which operates at constant pressure. The fluidic valve supplies propellants to the detonation tube through the orifice. Hydrogen – …


Prediction Of Process-Induced Defects By Ply-Drops In The Design Optimization Of A Complex Composite Laminate, Sitanshu Pandya Aug 2017

Prediction Of Process-Induced Defects By Ply-Drops In The Design Optimization Of A Complex Composite Laminate, Sitanshu Pandya

Mechanical and Aerospace Engineering Theses - Archive

The objective of this work is to characterize manufacturing process-induced warping defects due to ply drops in composite laminates to guide composite laminate design. Composite laminate optimization seeks weight efficient models, but the process can also generate complex ply geometry, which compounds the challenges of the already rigorous composite laminate manufacturing process. Increased design complexity enhances the likelihood of manufacturing process-induced defects like warping; therefore, it is important to predict such defects in the design phase to make the product more efficient yet producible and thereby avoid such defects. This work study is manufacturing process induced warpage in complex composite …


Characterization Of Vertically Split Distribution-Wet Cooling Media Used In Data Centers, Mullaivendhan Varadharasan May 2017

Characterization Of Vertically Split Distribution-Wet Cooling Media Used In Data Centers, Mullaivendhan Varadharasan

Mechanical and Aerospace Engineering Theses - Archive

Data Centers houses substantial number of information technology (IT) equipment like computer servers and storage modules associated with various electronic components which consume high volume of electricity. The IT equipment in data center housing keeps dissipates heat energy as it is constantly running day and night. To keep the data center environment under thermally control and to favor the reliability of electronic components, we need to adopt a cooling technique which aids the module level cooling, with due consideration of the size of the data center and its geographical location. One of the adopted cooling technique in data center thermal …


Composite Plate Optimization With Structural And Manufacturing Constraints, Deepak Polaki May 2017

Composite Plate Optimization With Structural And Manufacturing Constraints, Deepak Polaki

Mechanical and Aerospace Engineering Theses - Archive

This is a design optimization study that focuses on the value of free size optimization technology on composite structures which incorporates realistic structural requirements and practical manufacturing limitations to achieve an iterative design with effective structural performance. To detail a study on such practical implementation, a sample structure is required. A rectangular composite laminate with a central hole cutout is considered for this study and is designed using finite elemental tools which includes compression, tension and shear loading conditions with load reactions at bolted joints and buckling stability. Free size optimization and size optimization are used in this study to …


Reliability Assessment Of Solder Joint Using Bga Package – Megtron 6 Versus Fr4 Printed Circuit Boards, Mugdha Anish Chaudhari May 2017

Reliability Assessment Of Solder Joint Using Bga Package – Megtron 6 Versus Fr4 Printed Circuit Boards, Mugdha Anish Chaudhari

Mechanical and Aerospace Engineering Theses - Archive

When it comes to the mechanical and electrical seam of the Printed Circuit Board (PCB) and package, reliability of the board plays a major impact on PCB. As the frequency increases, losses in signals increase. This necessitates the use of new materials for such applications. Nelco 4000-13EPSI, Rogers 4350B, Panasonic Megtron 6 are few high-speed materials used. Studies have shown that Megtron 6 has the least dielectric losses so far, low transmission loss, high heat resistance and has low weight loss than the FR-4 boards. With an increasing demand for high performance, reliability and lower costs, the field of electronic …


Solder Joints Design Optimization Of Qfn Packages For Different Boards By Investigating Solder Joint Reliability, Rishikesh Vilas Tendulkar May 2017

Solder Joints Design Optimization Of Qfn Packages For Different Boards By Investigating Solder Joint Reliability, Rishikesh Vilas Tendulkar

Mechanical and Aerospace Engineering Theses - Archive

Quad Flat No-lead package (QFN) is one of the most cutting-edge technologies emerged in the market, exhibiting high performance and efficiency with unparalleled cost effectiveness. QFN, a leadless package, is an ideal choice for applications where size, weight thermal and electrical characteristics are critical, particularly in mobile and handheld devices. Applications like automotive, defense and high current circuits require the package to be mounted on thick printed circuit boards (PCB). The motivation of this work is to understand the effect of design variations of solder joints affecting reliability and optimize the solder package to improve reliability for application on different …


An Improved Method For Measurement Of Radial Thermal Conductivity Of Cylindrical Bodies, Salwa Shaik May 2017

An Improved Method For Measurement Of Radial Thermal Conductivity Of Cylindrical Bodies, Salwa Shaik

Mechanical and Aerospace Engineering Theses - Archive

Li-ion cells are ubiquitously found in day to day electronic devices due to their high power density storage capacity. These batteries are known to exhibit sharp reduction in performance at high temperature. Due to this, several attempts have been made in the past to measure thermal properties of the Li-ion cell. This work improves upon past measurements by showing that heat loss during measurements is non-negligible, and by developing an analytical model to account for such heat loss. Experimental measurements carried out on multiple materials demonstrate non-negligible heat loss. When accounted analytically, these data result in thermal conductivity values that …


Electro-Pneumatic Shifting And Servo Control Of A Clutch For A Fsae Racecar, Rahul Janardhan Chalmela May 2017

Electro-Pneumatic Shifting And Servo Control Of A Clutch For A Fsae Racecar, Rahul Janardhan Chalmela

Mechanical and Aerospace Engineering Theses - Archive

FSAE is an international student design competition held by SAE International where students design, build and compete in static events like cost, design and dynamic events ranging from acceleration, autocross to endurance. UTA Racing has been a part of FSAE since 1982 and have been using a mechanical design for their shifter and clutch since then. This year for the 2017 design competition an electro-pneumatic system is developed to replace the mechanical system. This system consists of pneumatic cylinders controlling a sequential shifter and a servo clutch. The cylinders are controlled using direction control valves, these receive their signals from …


Rack Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping For Centralized Coolant System, Chinmay Sanjay Kshirsagar May 2017

Rack Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping For Centralized Coolant System, Chinmay Sanjay Kshirsagar

Mechanical and Aerospace Engineering Theses - Archive

As the worldwide demand for the data centers grows, so does the size and load placed on data centers which leads to the applied constraints on power and space available to the operator. Cooling power consumption is a major contributor of the total energy consumption of the system. In the process of optimization of cooling energy consumption per performance unit, liquid cooling technology has emerged as one of the most viable solutions. In this rack level study, 2OU (Open U) hybrid cooled web servers are tested for an evaluation of warm water cooling in centralized coolant system. Effects of higher …