Mechanical Engineering Commons^™

Design Projects With Out-Of-Town Companies, Lizabeth Schlemer

Industrial and Manufacturing Engineering

The capstone design class in the industrial engineering department at California Polytechnic State University, San Luis Obispo (Cal Poly) includes projects with companies. The projects are large ambiguous facilities design problems that allow students to incorporate many aspects of the IE curriculum. For the past 15 years students have been participating in these projects with local companies. Over the past several years, companies from out of town (200 miles to the north in Mountain View or 200 miles to the south in Oxnard) have participated. These out of town companies have presented certain logistical issues, but they have proven to …

Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, Patrick Hyland

Industrial and Manufacturing Engineering

Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads, especially wire-bondable high frequency packages, where the gold thickness requirement for wirebonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this study is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au thicknesses using …

Testing The Test: Validity And Reliability Of Senior Exit Exam, Lizabeth Schlemer, Daniel Waldorf

Industrial and Manufacturing Engineering

A senior exit exam is considered an excellent direct measure of student learning for ABET assessment, but the usefulness of the information gathered is related to the validity and reliability of the test itself. The Industrial and Manufacturing Engineering Department at California Polytechnic State University, San Luis Obispo has used a content exam for several years. This paper will discuss test development, administration, and the role it plays in the assessment process. In addition, the test is evaluated using the standard psychometric techniques of reliability and validity. The results of the evaluation are used to refine the test. The importance …

Development And Assessment Of A Pcb Layout And Manufacturong Laboratory Module In Introductory Electric Circuits For Ee And Non-Ee Majors, Albert Liddicoat, Jianbiao Pan, James G. Harris, Gary Perks, Linda Shepherd

Industrial and Manufacturing Engineering

In standard introductory electric circuits laboratories for electrical engineering (EE) majors and non-EE majors, prototype boards are typically used to construct and test electric circuits. Students typically do not learn how to design and manufacture Printed Circuit Boards (PCB) that are commonly used in more sophisticated design projects and other engineering applications. This paper will present the development and assessment of a PCB layout and manufacturing laboratory module that has been used in introductory electric circuits laboratories for EE and non-EE majors. The feasibility of integrating the new PCB layout and manufacturing module into the electric circuit course will be …

Assessing Curriculum Improvement Through Senior Projects, Jianbiao Pan, Albert Liddicoat, James G. Harris, Linda Shepherd

Industrial and Manufacturing Engineering

Senior project and/or capstone design courses are intended to provide a culminating design experience for students and to demonstrate their understanding of engineering knowledge and their ability to apply that knowledge to practical problems. It is expected that the quality and attributes of students’ senior design projects can be used as a good measure of determining how well the curriculum prepares students to engage in engineering design as well as a measure of faculty teaching and student learning. This paper reports the results of a study designed to assess whether the new computer engineering curriculum implemented at Cal Poly over …

Laser Clean Room Re-Design: A Manufacturing Facility Re-Layout, Jennifer J. Siu

Industrial and Manufacturing Engineering

Alcon’s Laser Clean Room fosters inefficient production practices, is outdated for its current process, and lacking in clear process/product flow. A facility re-design is applied to bring order, efficiency, and optimize flow in the laser production lines.

Deliverables include a new layout that decreases product travel distances and increases productivity as well as an implementation plan and cost/savings analysis. Major design decisions include downsizing the clean room, sorting to find waste and establishing clear process/product flows. The design was implemented within three weeks and results yield 29% reduction of product travel distance, 10.4 hrs/day saved from eliminated gowning time and …

Using Sports Coaching Techniques To Enhance Project Based Learning Instruction, Lizabeth Schlemer, Faith Mimnaugh

Industrial and Manufacturing Engineering

As instructors attempt to apply project based learning as a preferred pedagogy for many aspects of engineering education, countless questions are raised. For instance, how do instructors assess individual performance in a team based environment? How do instructors prepare students for the culminating presentation or report? How do instructors develop the students individually? After reviewing literature on both project based learning and exceptional coaching, we have found that much can be learned from John Wooden, Phil Jackson and other coaches. This paper will organize some of the best practices in sports coaching and draw parallels that will enhance student learning …

Process Design For Aeration Of Facial Prosthetic, Nathaniel J. Urciuoli

Industrial and Manufacturing Engineering

Facial prosthetics are becoming a necessary step for the recovery of injured veterans and civilians who have suffered severe facial burning. Current users of such prosthetics are not able to wear the prosthetic for an extended period of time due to uncomfortable conditions created by the silicone material. A solution for this problem was to develop a process for creating small holes similar to skin pores that will both ventilate and aid in the evaporation of accumulated sweat under the prosthetic.

The main steps of this process were to create a flexible fixture capable of supporting and securing the prosthetic …

Design Of A Low Cost Powered R/C Combat Airplane And Manufacturing Plan, Jonathan N. Bailey

Industrial and Manufacturing Engineering

The goals of this project are to design a low cost powered remote control combat airplane capable of outdoor flight, named the Aero EX and to develop a manufacturing plan to produce each unit at a selling price of $200, while operating at a 25 vehicle batch rate inside a 1,000 square foot facility. These goals are achieved using: Aerospace fundamentals to design the vehicle, Design for Manufacturability to optimize the design for minimal use of labor, Design for Assembly to give consumers the ability to build the vehicle without fixtures, Pull production to eliminate scheduling and match customer demand. …

Design For Manufacturing Of Sports Equipment, Cedrick Bit, Christopher L. Head

Industrial and Manufacturing Engineering

The purpose of this project was to validate industrial designs for a product in its conceptual stage and suggest/implement design changes that suit the contracting company’s needs while assuring the product maintains its basic functional requirements. Techniques and methods used to validate the design include 3‐D solid modeling, physical product application using rapid prototyping to produce the product. Methods of design for manufacturing were analyzed in the design. Processes used in the validation and verification of the design include solid modeling design, methods of measurements, fixture design and manufacturing processes. Full design specifications and solid model files were finalized and …

Design And Manufacture Of Tennis Ball Retriever, Philip Hurst

Industrial and Manufacturing Engineering

No abstract provided.

Drop Impact Reliability Of Edge-Bonded Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board. The test boards were subjected to drop tests at several impact pulses, including a peak acceleration of 900 Gs with a pulse duration of 0.7 ms, a peak acceleration of 1500 Gs with a pulse duration of 0.5 ms, and a peak acceleration of 2900 Gs with a pulse duration of 0.3 ms. A high-speed dynamic resistance measurement system was used to monitor the failure of the solder joints. Two edge-bond materials used in …

Teaming Multi-Level Classes On Industry Projects, Lizabeth Schlemer, Jose Macedo

Industrial and Manufacturing Engineering

For the past few years we experimented with teaming students from a sophomore-level class and a senior-level class to work on industry projects. The classes are “work design” and “facilities design.” Projects are selected to require the application of knowledge from both disciplines. In addition, the projects are selected from small local companies. The intent of this paper is to describe the benefits and difficulties associated with this methodology. While specific classes in this experience are typical of an industrial engineering curriculum, the lessons learned and benefits could translate to other disciplines.

Optimization Of Engineering Tolerance Design Using Revised Loss Functions, Jeh-Nan Pan, Jianbiao Pan

Industrial and Manufacturing Engineering

Engineering tolerance design plays an important role in modern manufacturing. Both symmetric and asymmetric tolerances are common in many manufacturing processes. Recently, various revised loss functions have been proposed for overcoming the drawbacks of Taguchi's loss function. In this article, Kapur's economic tolerance design model is modified and the economic specification limits for both symmetric and asymmetric losses are established. Three different loss functions are compared in the optimal symmetric and asymmetric tolerance design: a revised Taguchi quadratic loss function, an inverted normal loss function and a revised inverted normal loss function. The relationships among the three loss functions and …

Finding And Optimising The Key Factors For The Multiple-Response Manufacturing Process, Jeh-Nan Pan, Jianbiao Pan, Chun-Yi Lee

Industrial and Manufacturing Engineering

With the advent of modern technology, manufacturing processes became so sophisticated that a single quality characteristic cannot reflect the true product quality. Thus, it is essential to perform the key factor analysis for the manufacturing process with multiple-input (factors) and multiple-output (responses). In this paper, an integrated approach of using the desirability function in conjunction with the Mahalanobis-Taguchi-Gram Schmit (MTGS) system is proposed in order to find and optimise the key factors for a multiple-response manufacturing process. The aim of using the MTGS method is to standardise and orthogonalise the multiple responses so that the Mahalanobis distance for each run …

Effects Of Reflow Profile And Thermal Conditioning On Intermetallic Compound Thickness For Snagcu Soldered Joints, Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno

Industrial and Manufacturing Engineering

Purpose – The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Design/methodology/approach – A four-factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding to pads over an organic substrate with gold metallizations. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequencies of 60 KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through the design of experimental methodology for four different cases: 25.4 mm wire at 60 kHz, 25.4 mm wire at 120 kHz, 17.8 mm wire at 60 kHz, …

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The integrity of wire bonds …

Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan

Industrial and Manufacturing Engineering

This paper presents the failure analysis results of board level drop tests. In this study, the test vehicle was designed according to the requirements of the Joint Electron Device Engineering Council (JEDEC) drop test board. The test vehicle was assembled with 15 chip scale packages (CSPs) each having 228 daisy-chained 0.5 mm pitch solder joints using Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) lead free solder. Assemblies were drop tested using three different peak accelerations of 900 G, 1500 G, 2900 G, with 0.7 ms, 0.5 ms, and 0.3 ms pulse durations, respectively. Scanning electron microscopy (SEM) with energy dispersive spectroscopy …

Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught in isolation followed by a single culminating senior design or capstone project experience. In the senior design class students being to synthesize the knowledge and skills that they acquired through the engineering curriculum. This paper presents lower and upper division course and curricular changes made to accommodate learning objectives that better prepare students for project-based learning. These learning experiences and skills include: systems level design, experience with state-of-the-art Computer Aided Design (CAD) tools, printed circuit board (PBC) design, design for manufacturability, electronics assembly, project management, …

Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan

Industrial and Manufacturing Engineering

This study examines the performance of a new class of wear-resistant but economical cutting tools produced by varying the binder composition of standard cemented carbide composites. By replacing some or all of the cobalt binder with rhenium and nickel-based superalloy, a stronger composite tool results, potentially capable of machining heat-resistant superalloys at significantly higher cutting speeds. Sample tools with alternative binder were produced and compared to standard tools bound with cobalt only. Turning experiments on Inconel 718 were run to evaluate wear resistance and tool life for several grades. The experimentation also examined the effects of varying the relative proportions …

A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello

Industrial and Manufacturing Engineering

This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of this course is to provide lower-division engineering students a hands-on experience involving actual printed circuit board (PCB) design, layout, fabrication, assembly, and testing. Through project-based learning, students not only learn technical skills in designing and manufacturing an electronic device, but also develop their project management and communication skills early in their course of study at the university. The course outline and examples of the student projects are presented in this paper as well as project evaluations and students’ feedback. This paper also presents the selection …

Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

Undergraduate computer and electrical engineering programs often partition the curriculum into several courses based on related topics taught in isolation. Students are expected to synthesize their knowledge in a senior design project. It is the authors’ experience that students often struggle during their senior design project since they have not gained the appropriate knowledge or mastered necessary skills needed to work on a significant or team-based engineering design project. Specifically, students need to be able to define system requirements, partition the design into subcomponents, design, build, test, and verify that the system requirements have been met. The authors have enhanced …

Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat

Industrial and Manufacturing Engineering

The Cal Poly/Allan Hancock team is developing a learning module that will allow all lower division engineering students to design, fabricate, assemble, and test an electronic system implemented on a printed circuit board (PCB). All the services necessary to perform this laboratory experiment will be provided with low-cost vendors available on the . The learning module is being developed so that it can be integrated into the existing electrical engineering lower division courses that are required by all engineering students. The laboratory learning module will use operational amplifiers (op amp), resistors, capacitors and other common electronic components to study the …

Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin

Industrial and Manufacturing Engineering

In this paper, we describe various techniques used to make Intuitionistic Fuzzy Logic Systems amenable to operating on applications with large numbers of inputs. A rule reduction technique known as Combs method is combined with an automated tuning process based on Particle Swarm Optimization. A second stage of tuning on rule weights results in improved performance and further reduction in the size of the rule-base. The entire process has been developed to operate within the Matlab software environment. The technique is tested against the Wisconsin Breast Cancer Database. The use of these tools shows great promise in significantly expanding the …

Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a peak acceleration of 2900 G …

Designing And Manufacturing Microelectronic Packages For High-Power Light-Emitting Diodes, Brian Wright, Jianbiao Pan, Richard Savage

Industrial and Manufacturing Engineering

A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was to build a package that enables the LED to operate with currents as high as 2 Amps. An innovative thin-film interface has been developed to electrically connect the cathode of the LED die to a 22AWG Cu wire. This thin-film interface is wirebondable and solderable, and consists of three layers: Au, Ni93/V7, and Si. Four 1 mil Au wirebonds, supporting 2A of maximum current, connect the Au thin-film to the LED die cathode. Sn96Ag4 solder is used for connecting the Ni93/V7 thin-film to the 22AWG …

In-House Development Of Scheduling Decision Support Systems: Case Study For Scheduling Semiconductor Device Test Operations, Tali Freed, K. H. Doerr, T. Chang

Industrial and Manufacturing Engineering

Most manufacturing processes can benefit from an automated scheduling system. However;: the design of a fast, computerised scheduling system that achieves high-quality results and requires minimal resources is a difficult undertaking. Efficient .. scheduling of a semiconductor device test facility requires an information system that provides good schedules quickly. Semiconductor device testing-is the last stage of the long semiconductor manufacturing process, and therefore. is subjected to customer service pressures. The cost of an off-the-shelf computerised scheduling system may he prohibitive for many companies. In addition, many companies are taken aback by other characteristics of off-the-shelf scheduling systems, such as code …

Fabrication Of Functionally Graded 3a/5a Zeolites By Electrophoretic Deposition, X. Wang, E. A. Olevsky, E. Bruce, M. B. Stern, D. T. Hayhurst

Industrial and Manufacturing Engineering

Functionally graded zeolites of molecular sieve type 3A and 5A are deposited by electrophoretic deposition (EPD) from acetone suspension with 8% volume concentration of n-butylamine as particle charging agent. The EPD characteristics of both 3A and 5A suspensions are studied. Functionally graded zeolite 3A/5A deposits are obtained at 200 V DC. Energy dispersive X-ray dispersion (EDX) analysis results confirm the graded structure. The deposited zeolites are also analysed by scanning electron microscopy (SEM). The factors influencing the deposition process are discussed.