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Full-Text Articles in Metallurgy
Effect Of Au Content On Microstructural Evolution Of Snagcu Solder Joints That Undergo Isothermal Aging And Reliability Testing, Patrick J. Hyland
Effect Of Au Content On Microstructural Evolution Of Snagcu Solder Joints That Undergo Isothermal Aging And Reliability Testing, Patrick J. Hyland
Master's Theses
Electronics, especially, printed circuit boards (PCBs) are a widespread technology. Metal coatings or “surface finishes” are often added to PCB board pads and component leads during manufacturing to improve their performance. Electroplated nickel/gold over copper is a popular surface finish for printed circuit boards and component leads. The presence of gold in solder joints, however, is known to have detrimental effects referred to as gold embrittlement. It is generally understood that tin-lead solder joints with less than 3 weight percent (wt%) of gold will not experience reliability issues. The acceptable level of gold in lead-free solder joints, however, is less …