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- Welding (2)
- Aluminate basic (1)
- Copper Electrodeposition; Copper Sulphate; Glycine Additive; Cyclic Voltammetry; Scanning Electron Microscopy (SEM); Surface Morphology (1)
- Copper decoration; Copper ion deposition; Oxide breakdown; Copper dot formation; Copper concentration in methanol (1)
- Electrochemical analysis. (1)
Articles 1 - 6 of 6
Full-Text Articles in Metallurgy
Effects Of New And Recycle Flux On The Mechanical Properties Of Submerged Arc Welded (Saw) Line Pipe Grade X52m And X65m, Taib Meor Mohd Adli
Effects Of New And Recycle Flux On The Mechanical Properties Of Submerged Arc Welded (Saw) Line Pipe Grade X52m And X65m, Taib Meor Mohd Adli
Student Works (2020-2029)
Two line pipe grade X52M and X65M were manufactured using submerged arc welding process. For each grade, two different welding flux condition were simulated, i.e. 100% new flux and 100% recycle flux. The flux used was aluminate basic type trade name OP 132. The outside diameter and wall thickness for X52M was 610mm x 12.7mm and for X65M was 762mm x 14.3mm. Lower weld re-entrant angle and higher weld bead height were observed in recycle flux condition. Lower weld manganese content recorded in recycle flux condition. And lower mechanical tests (i.e. tensile, impact, and hardness) value reported for recycle flux …
Investigation On The Mechanical Properties And Microstructure Analysis Of Micro-Resistance Spot Welding Between Stainless Steel 316l And Tl-6al-4v, Mohd Mansor Muhammad Safwan
Investigation On The Mechanical Properties And Microstructure Analysis Of Micro-Resistance Spot Welding Between Stainless Steel 316l And Tl-6al-4v, Mohd Mansor Muhammad Safwan
Student Works (2020-2029)
In this study, ASS 316L and Ti-6Al-4V were welded together by micro-resistance spot welding (μRSW) at different combinations of welding parameters using specifically design electrode geometry in order to acquire the optimal combination of welding parameters. The welded joint were subjected to tensile shear strength test to determine the influence of welding current, welding time, welding force and different design of elctrode tip on the mechanical properties and the strength of the welded joint. The experiment was conducted by using full factorial design of experiment (DoE) with L27 orthogonal array and utilizing the analysis of variance (ANOVA) to obtain the …
Electrodeposition Of Tin Using Tin (Ii) Methanesulfonate From Mixture Of Ionic Liquid And Methane Sulfonic Acid., Yang Kok Kee
Electrodeposition Of Tin Using Tin (Ii) Methanesulfonate From Mixture Of Ionic Liquid And Methane Sulfonic Acid., Yang Kok Kee
Student Works (2010-2019)
The electrodeposition of tin from Tin(II) Methane Sulfonate (MSA) with varying concentration in air and water stable 1-butyl-1-methyl-pyrrolidinium trifluoromethanesulfonate, (BMPOTF) ionic liquid at room temperature was studied. Cyclic Voltammetry served to characterize the electrochemical behavior of tin reduction and oxidation. The diffusion coefficient of stannous ions in the mixture of BMPOTF ionic liquid and MSA based electrolyte obtained via Randles-Sevcik and Cottrell equation was 2 × 10-7 cm2/s. Electroplating on copper panel was conducted under different current densities to determine BMPOTF based tin plating solution current efficiency. Mixture of BMPOTF and MSA based tin plating solution gave current efficiency as …
Electrodeposition Of Tin Using Tin(Ii) Methanesulfonate From Mixture Of Ionic Liquid And Methane Sulfonic Acid., Yang Kok Kee
Electrodeposition Of Tin Using Tin(Ii) Methanesulfonate From Mixture Of Ionic Liquid And Methane Sulfonic Acid., Yang Kok Kee
Student Works (2010-2019)
The electrodeposition of tin from Tin(II) Methane Sulfonate (MSA) with varying concentration in air and water stable 1-butyl-1-methyl-pyrrolidinium trifluoromethanesulfonate, (BMPOTF) ionic liquid at room temperature was studied. Cyclic Voltammetry served to characterize the electrochemical behavior of tin reduction and oxidation. The diffusion coefficient of stannous ions in the mixture of BMPOTF ionic liquid and MSA based electrolyte obtained via Randles-Sevcik and Cottrell equation was 2 × 10-7 cm2/s. Electroplating on copper panel was conducted under different current densities to determine BMPOTF based tin plating solution current efficiency. Mixture of BMPOTF and MSA based tin plating solution gave current efficiency as …
Formation Of Copper Dots In Copper Decoration Technique, Swee Yong Pung
Formation Of Copper Dots In Copper Decoration Technique, Swee Yong Pung
Student Works (2000-2009)
Copper ions are dissolved from highly pure copper plate into the methanol during copper decoration process. As a result, copper concentration in methanol is increased with time. The copper concentration in methanol measured by ICP-OES is correlated well with the calculated value based on the magnitude of current and time during the process. Consequently, higher magnitude of current can be applied to build up copper concentration in methanol in shorter period. When copper ions are ejected in methanol, they are positively charged. They experience force from electric field and migrate towards oxide surface. Eventually, these copper ions will be discharged …
Electrodeposition Of Copper On Polished Copper Electrode, Jia Tsung Ling
Electrodeposition Of Copper On Polished Copper Electrode, Jia Tsung Ling
Student Works (2000-2009)
This project studies the surface morphology of the copper deposit from three different bath solutions on polished copper (3.1 mm in diameter) electrode by using Scanning Electron Microscopy. The behaviour of glycine as an additive in a bath solution containing 0.3 M of copper (II) sulphate and 2.2 M of sulphuric acid was studied by using cyclic voltammetry. In this project, glycine did not involved directly in the reaction of CU²⁺/CU couple but increased the potential and current density of the plating process. However, glycine has the properties for inhibiting the deposition of copper onto the copper disc. Moreover, block …