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Articles 211 - 240 of 743
Full-Text Articles in Metallurgy
Modeling And Simulation Of A Laser Deposition Process, Frank W. Liou, Zhiqiang Fan, Heng Pan, Kevin P. Slattery, Mary Kinsella, Joseph William Newkirk, Hsin-Nan Chou
Modeling And Simulation Of A Laser Deposition Process, Frank W. Liou, Zhiqiang Fan, Heng Pan, Kevin P. Slattery, Mary Kinsella, Joseph William Newkirk, Hsin-Nan Chou
Mechanical and Aerospace Engineering Faculty Research & Creative Works
A laser deposition process involves the supply of metallic powders into a laser-heated spot where the powder is melted and forms a melt puddle which quickly solidifies into a bead. In order to design an effective system, the laser beam, the powder beam, and their interactions need to be fully understood. In this paper, the laser-material interaction within the melt pool is reported using a multi-scale model: A macroscopic model to model mass, heat, and momentum transfer. Experiments were also conducted to validate the simulation model.
Numerical Simulation Of The Evolution Of Solidification Microstructure In Laser Deposition, Zhiqiang Fan, Todd E. Sparks, Frank W. Liou, Anand Jambunathan, Yaxin Bao, Jianzhong Ruan, Joseph William Newkirk
Numerical Simulation Of The Evolution Of Solidification Microstructure In Laser Deposition, Zhiqiang Fan, Todd E. Sparks, Frank W. Liou, Anand Jambunathan, Yaxin Bao, Jianzhong Ruan, Joseph William Newkirk
Mechanical and Aerospace Engineering Faculty Research & Creative Works
A predictive model is developed to simulate the evolution of the solidification microstructure during the laser deposition process. The microstructure model is coupled with a comprehensive macroscopic thermodynamic model. This model simulates dendritic grain structures and morphological evolution in solidification. Based on the cellular automata approach, this microstructure model takes into account the heterogeneous nucleation both within the melt pool and at the substrate/melt interface, the growth kinetics, and preferential growth directions of dendrites. Both diffusion and convection effects are included. This model enables prediction and visualization of grain structures during and after the deposition process. This model is applied …
Age Strengthening Of Gray Cast Iron: Alloying Effects And Kinetics Study, Thottathil Viswanathan Anish
Age Strengthening Of Gray Cast Iron: Alloying Effects And Kinetics Study, Thottathil Viswanathan Anish
Masters Theses
"Age strengthening of gray cast iron has become a critical issue with metal casters trying to optimize their process for the closest conformance to properties. This necessitated more robust and precise methods to predict age strengthening. Most foundries use age strengthening behavior to cast at hight carbon equivalents to facilitate smaller gating systems. Also, it is well known in the casting industry that the tool life improves with aging. Hence these foundries require a model to predict aging behavior and accelerate the mechanism from days to hours. This research focuses on the methods of composition adjustments to control aging properties, …
Microstructural Modification Of As-Cast Al-Si-Mg Alloy By Friction Stir Processing, Z. Y. Ma, S. R. Sharma, Rajiv S. Mishra
Microstructural Modification Of As-Cast Al-Si-Mg Alloy By Friction Stir Processing, Z. Y. Ma, S. R. Sharma, Rajiv S. Mishra
Materials Science and Engineering Faculty Research & Creative Works
Friction stir processing (FSP) has been applied to cast aluminum alloy A356 plates to enhance the mechanical properties through microstructural refinement and homogenization. the effect of tool geometry and FSP parameters on resultant microstructure and mechanical properties was investigated. the FSP broke up and dispersed the coarse acicular Si particles creating a uniform distribution of Si particles in the aluminum matrix with significant microstructural refinement. Further, FSP healed the casting porosity. These microstructural changes led to a significant improvement in both strength and ductility. Higher tool rotation rate was the most effective parameter to refine coarse Si particles, heal the …
Effect Of Friction Stir Processing On The Microstructure Of Cast A356 Aluminum, Z. Y. Ma, S. R. Sharma, Rajiv S. Mishra
Effect Of Friction Stir Processing On The Microstructure Of Cast A356 Aluminum, Z. Y. Ma, S. R. Sharma, Rajiv S. Mishra
Materials Science and Engineering Faculty Research & Creative Works
Friction stir processing (FSP) was applied to cast A356 Al to modify the as-cast microstructure. FSP homogenizes and refines the cast microstructure, completely eliminates porosity, and creates a microstructure with fine Si particles (0.25-0.42 μm) distributed in a fine grain aluminum matrix (3-4 μm). Further, FSP parameters significantly influence microstructural development in the processed zone of cast A356 Al. Generally, higher tool rotation rate creates a more homogeneous microstructure. at lower tool rotation rates, a macroscopically visible banded structure characterized by a low density of coarse particles, was detected in the nugget zone. However, FSP parameters did not significantly influence …
Comparison Of Thermal Properties Of Laser Deposition And Traditional Welding Process Via Thermal Diffusivity Measurement, Yu Yang, Omoghene Osaze Obahor, Yaxin Bao, Todd E. Sparks, Jianzhong Ruan, Jacquelyn K. Stroble, Robert G. Landers, Joseph William Newkirk, Frank W. Liou
Comparison Of Thermal Properties Of Laser Deposition And Traditional Welding Process Via Thermal Diffusivity Measurement, Yu Yang, Omoghene Osaze Obahor, Yaxin Bao, Todd E. Sparks, Jianzhong Ruan, Jacquelyn K. Stroble, Robert G. Landers, Joseph William Newkirk, Frank W. Liou
Mechanical and Aerospace Engineering Faculty Research & Creative Works
Laser deposition is an effective process for mold and die repair. In order to improve the part repair quality, the process impact on thermal diffusivity and thermal conductivity needs to be understood for laser deposited, welded and virgin H13. In this paper, H13 tool steel samples were made by laser deposition, welding and virgin H13 and then cut into pieces. Experiments were conducted to investigate the thermal diffusivity and conductivity. A laser flash method is used to test these samples. The future work and opportunities are also summarized.
Evaluation Of Mechanical Properties And Microstructure For Laser Deposition Process And Welding Process, Yaxin Bao, Jianzhong Ruan, Todd E. Sparks, Jambunathan Anand, Joseph William Newkirk, Frank W. Liou
Evaluation Of Mechanical Properties And Microstructure For Laser Deposition Process And Welding Process, Yaxin Bao, Jianzhong Ruan, Todd E. Sparks, Jambunathan Anand, Joseph William Newkirk, Frank W. Liou
Mechanical and Aerospace Engineering Faculty Research & Creative Works
Laser Aided Manufacturing Process (LAMP) can be applied to repair steel die/molds which are currently repaired using traditional welding process in industry. In order to fully understand the advantages of laser deposition repair process over traditional welded-repair process, the mechanical properties such as tensile strength and hardness of H13 tool steel samples produced by these two processes were investigated. The microstructure and fracture surface of the samples were analyzed using optical microscope and SEM (Scanning Electron Microscope). Moreover, depositions on substrates with different shapes were studied to evaluate the performance of LAMP on damaged parts with complicated geometric shape.
2nd Annual Undergraduate Research Conference Abstract Book, University Of Missouri--Rolla
2nd Annual Undergraduate Research Conference Abstract Book, University Of Missouri--Rolla
Undergraduate Research Conference at Missouri S&T
No abstract provided.
Designing And Modeling Of A New Continuous Steelmaking Process, Jörg Peter
Designing And Modeling Of A New Continuous Steelmaking Process, Jörg Peter
Doctoral Dissertations
"Continuous steel production has the potential to lower the cost of steelmaking as compared to current batch operations. However, experiences from past attempts to develop and commercialize continuous steelmaking processes show that there are several engineering hurdles to overcome. The objective of this research was the development of a fully continuous steelmaking process that would incorporate the lessons from past experiences, address the foreseen challenges, and meet the requirements to justify the possible replacement of the current EAF-LMF steelmaking route.
The design of the new process consists of five interconnected vessels. Preheated scrap would be continuously charged, melted, and superheated …
Effect Of Welding Parameters On Properties Of 5052 Al Friction Stir Spot Welds, T. A. Freeney, S. R. Sharma, Rajiv S. Mishra
Effect Of Welding Parameters On Properties Of 5052 Al Friction Stir Spot Welds, T. A. Freeney, S. R. Sharma, Rajiv S. Mishra
Materials Science and Engineering Faculty Research & Creative Works
Effect of process parameters on friction stir spot welding (FSSW) of 5052 Al alloy has been evaluated. a plunge type FSSW machine was used for this study. Sheet thicknesses of 1 and 1.6mm were used. the tool rotation rate was varied between 1000 and 3000 rpm. the tool plunge rate and dwell time was varied to give weld cycle of 1-4 seconds. Shear tests were performed in 2 sheet and 3 sheet configurations to determine the influence of processing parameters on the mechanical properties of lap joint FSSWs. Higher joint strengths were observed at lower tool rotation rates. Copyright © …
Journal Of Materials Engineering And Performance: Editorial, C. Suryanarayana, Leon L. Shaw, Rajiv S. Mishra
Journal Of Materials Engineering And Performance: Editorial, C. Suryanarayana, Leon L. Shaw, Rajiv S. Mishra
Materials Science and Engineering Faculty Research & Creative Works
No abstract provided.
Approaches Toward Integrating Functionality Into Structural Materials, Rajiv S. Mishra
Approaches Toward Integrating Functionality Into Structural Materials, Rajiv S. Mishra
Materials Science and Engineering Faculty Research & Creative Works
No abstract provided.
Study Of Ceramic Slurries For Investment Casting With Ice Patterns, Qingbin Liu, Ming-Chuan Leu, Harish Jose, Von Richards
Study Of Ceramic Slurries For Investment Casting With Ice Patterns, Qingbin Liu, Ming-Chuan Leu, Harish Jose, Von Richards
Mechanical and Aerospace Engineering Faculty Research & Creative Works
Ice patterns generated by rapid freeze prototyping or a molding process can be used to make ceramic investment molds for metal castings. Due to the use of ice, the ceramic slurries must be poured around the pattern and cured at sub-freezing temperatures. Success of this process depends greatly on the mold strength after the gelation of the slurries. This paper describes the experimental results of the mold strength after the gelation of the slurries under different compositions. The parameters considered include mixing time, alumino-silicate vs. fused silica ratio, volume of binder, and volume of catalyst. The strength of the gelled …
Superplasticity In Cast A356 Induced Via Friction Stir Processing, Z. Y. Ma, Rajiv S. Mishra, M. W. Mahoney
Superplasticity In Cast A356 Induced Via Friction Stir Processing, Z. Y. Ma, Rajiv S. Mishra, M. W. Mahoney
Materials Science and Engineering Faculty Research & Creative Works
Super plasticity was investigated in friction stir processed A356 alloy at temperatures of 470-570 °C and initial strain rates of 3x10 -4-1x10-1 s-1. Maximum superplastic elongation of 650% was obtained at 530 °C and an initial strain rate of 1x10-3 s-1 where a maximum strain rate sensitivity of 0.45 was observed. © 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Segmented Roll For Casting Metal Strip, James R. Sauer, Ronald J. O'Malley, Robert S. Williams
Segmented Roll For Casting Metal Strip, James R. Sauer, Ronald J. O'Malley, Robert S. Williams
Materials Science and Engineering Faculty Research & Creative Works
Casting molten metal using a segmented roll for casting continuous metal strip. A strip caster (10) for producing a continuous strip (18) includes a tundish for containing a melt and a pair of horizontally disposed water cooled composite casting rolls (84). The casting rolls are juxtaposed relative to one another for forming a pouring basin (16) for receiving molten metal. The composite rolls are formed from a plurality of annular segments (45). Each segment preferably includes at least a pair of coolant openings (34) and means for aligning the coolant openings, such as a pair of alignment openings (26). The …
Evaluation Of Lead Anode Reactions In Acid Sulfate Electrolytes: Ii. Manganese Reactions, Pu Yu, Thomas J. O'Keefe
Evaluation Of Lead Anode Reactions In Acid Sulfate Electrolytes: Ii. Manganese Reactions, Pu Yu, Thomas J. O'Keefe
Materials Science and Engineering Faculty Research & Creative Works
Lead alloys containing calcium-tin, silver, or similar combinations are the primary insoluble anodes used for copper and zinc electrowinning. One potential concern with these anodes is the detrimental effect on cathode purity from incorporation of lead corrosion products. Other factors which are important to process economics are the reaction potential and overpotential required for oxygen evolution. In addition to the inherent overpotential, impurities in the electrolyte can have a significant polarization impact, such as the films that may form when manganese is present. In order to gain a better understanding of the fundamental behavior of various concentrations of manganese ions …
Misinformation [1], Hollis P. Leighly
Misinformation [1], Hollis P. Leighly
Materials Science and Engineering Faculty Research & Creative Works
No abstract provided.
Evaluating And Monitoring Nucleation And Growth In Copper Foil, Ye Kun Lee, Thomas J. O'Keefe
Evaluating And Monitoring Nucleation And Growth In Copper Foil, Ye Kun Lee, Thomas J. O'Keefe
Materials Science and Engineering Faculty Research & Creative Works
The electrodeposition of copper foil for use in electronic materials applications is a complex and demanding process. The specific aspects of producing and controlling the structure-property-performance requirements of the foil are important because of the stringent demands placed on their use in printed circuit boards and similar products. In this paper, a brief review of the electrodeposition process for raw copper foil is presented. Since electrolyte additives play such a significant role in the copper-deposition process, the effects of two essential additives, chloride ion and an organic (e.g., glue or gelatine), on the foil are described. Also, the influence of …
Electrochemical Characterization Of The Effects Of Impurities And Organic Additives In Lead Electrowinning From Fluoborate Electrolyte, Puqiang Zhang, Thomas J. O'Keefe, Pu Yu
Electrochemical Characterization Of The Effects Of Impurities And Organic Additives In Lead Electrowinning From Fluoborate Electrolyte, Puqiang Zhang, Thomas J. O'Keefe, Pu Yu
Materials Science and Engineering Faculty Research & Creative Works
The effects of glue and calcium lignin sulfonate additives, and chloride and antimony impurities on the lead electrowinning process, using a fluoborate electrolyte, were studied. Short-term deposition tests, voltammetry, electrochemical impedance spectroscopy (EIS) and SEM techniques were used for the evaluation. The interactions among additives and impurities were also evaluated. The presence of antimony or chloride ion in the range of 50 to 200 mg/L was shown to cause a more dendritic and powdery lead deposit. Additions of glue and calcium lignin sulfonate at selected concentrations helped to level the deposit and counteracted the detrimental effects of chloride and antimony. …
Properties Of Sputtered Bilayer Wnx/W Diffusion Barriers Between Si And Cu, K. D. Leedy, Matthew O'Keefe, E. J. Dahlgren, J. T. Grant
Properties Of Sputtered Bilayer Wnx/W Diffusion Barriers Between Si And Cu, K. D. Leedy, Matthew O'Keefe, E. J. Dahlgren, J. T. Grant
Materials Science and Engineering Faculty Research & Creative Works
Copper interconnect metallizations in next generation integrated circuits will require thin diffusion barrier layers (< 20 nm) between the Cu and low-k dielectric which may also function as seed layers for subsequent material depositions. One possible structure entails a multicomponent diffusion barrier with a lower resistivity component, such as W on WNx. In this study, sputtered WNx/W bilayer thin films were investigated as diffusion barriers between Si and Cu. The total thickness of the WNx/W bilayer was fixed at 20 nm while the WNx thickness was varied from 0 to 20 nm. After deposition of the barrier films, a 100 nm thick Cu film was sputtered over the top of the ct-W and amorphous WNx bilayer. The as-deposited WNx/W film stress was found to be strongly dependent on the relative amount of WNx and W present and the addition of a Cu overlayer was found to mitigate the stress levels. The WNx/W barriers remained stable after 650°C anneals and exhibited phase transformations to W 2N. Microstructural characterization using transmission electron microscopy and x-ray diffraction and chemical analysis by x-ray photoelectron spectroscopy of the films were used to identify the as deposited and transformed phases. © 2001 Materials Research Society.
Rms Titanic: A Metallurgical Problem, Hollis P. Leighly, B. L. Bramfitt, S. J. Lawrence
Rms Titanic: A Metallurgical Problem, Hollis P. Leighly, B. L. Bramfitt, S. J. Lawrence
Materials Science and Engineering Faculty Research & Creative Works
No abstract provided.
Characterization And Soldering Of Organic Modified Aluminum Thin Films And Bond Pads, Rui Fang, Eric Dahlgren, Matthew O'Keefe, Thomas J. O'Keefe, Wu Sheng Shih, Daniel R. Gamota, Jie Zhang
Characterization And Soldering Of Organic Modified Aluminum Thin Films And Bond Pads, Rui Fang, Eric Dahlgren, Matthew O'Keefe, Thomas J. O'Keefe, Wu Sheng Shih, Daniel R. Gamota, Jie Zhang
Materials Science and Engineering Faculty Research & Creative Works
An immersion plating process using organic solutions was used to deposit a seed layer of copper and to activate the surface of thin film aluminum surfaces and bond pads. The seeded surfaces were subsequently electroless copper plated and tested for compatibility with soldering assembly. It was demonstrated that the copper particles deposited from the organic solution onto sputter deposited aluminum thin films were able to act as nucleation sites for the subsequent buildup of adherent, continuous copper films from conventional electroless plating baths. In addition, the metal deposition from organic solution process was found to be very selective on patterned …
Spontaneous, Non-Aqueous Electrochemical Deposition Of Copper And Palladium On Al And Al(Cu) Thin Films, R. Fang, H. Gu, Matthew O'Keefe, Thomas J. O'Keefe, W. S. Shih, K. D. Leedy, R. Cortez
Spontaneous, Non-Aqueous Electrochemical Deposition Of Copper And Palladium On Al And Al(Cu) Thin Films, R. Fang, H. Gu, Matthew O'Keefe, Thomas J. O'Keefe, W. S. Shih, K. D. Leedy, R. Cortez
Materials Science and Engineering Faculty Research & Creative Works
Copper and palladium seed layers have been successfully deposited from organic solutions onto patterned and unpatterned pure aluminum and Al (0.5%Cu) thin films using an immersion displacement process. The reaction occurs at ambient temperature and pressure by a spontaneous electrochemical mechanism. Copper and palladium deposition using the organic solution was studied as a function of reaction time and Cu or Pd concentration in the solution. It was found that both time and the initial ionic metal concentration significantly influence deposit morphology, particle size and shape, and adherence. Nucleation of Cu or Pd sub-micron particles on both Al and Al (Cu) …
Evaluation Of Nickel Deposition By Electrochemical Impedance Spectroscopy, M. Holm, Thomas J. O'Keefe
Evaluation Of Nickel Deposition By Electrochemical Impedance Spectroscopy, M. Holm, Thomas J. O'Keefe
Materials Science and Engineering Faculty Research & Creative Works
Electrochemical impedance spectroscopy was used to characterize the deposition of nickel from unbuffered acid sulfate electrolytes, from which a wide range of deposit morphologies and current efficiencies are possible. The operating parameters were in the range of 40 to 60 g L-1 Ni2+, 40 to 60 °C, and the pH from 2.0 to 3.5. The resulting impedance spectra for nickel deposition at 20 mA cm-2 consisted of one or two characteristic loops whose frequency and capacitance were dependent upon the electrowinning conditions and indicative of the resultant deposit morphology. A single high frequency capacitive loop, on the order of 1 …
The Anomalous Behavior Of Al³⁺ In Nickel Electrowinning From Sulfate Electrolytes, Michael Holm, Thomas J. O'Keefe
The Anomalous Behavior Of Al³⁺ In Nickel Electrowinning From Sulfate Electrolytes, Michael Holm, Thomas J. O'Keefe
Materials Science and Engineering Faculty Research & Creative Works
The effect of varying concentrations of Al3+ on the morphology and current efficiency of electrodeposited nickel from an acid-sulfate electrolyte was studied. Concentrations of Al3+ of 20 to 100 ppm significantly degraded the nickel-cathode morphology and current efficiency. However, it was found that higher concentrations of Al3+, in the range of 1 to 5 g/L, depending on the electrolyte parameters and operating conditions, improved the deposit morphology compared to deposition from a pure electrolyte. However, the current efficiency remained low. Physical characterization of the nickel revealed that a smoother, more uniform surface resulted from deposition in …
Organic Solution Deposition Of Copper Seed Layers Onto Barrier Metals, H. Gu, R. Fang, Thomas J. O'Keefe, Matthew O'Keefe, W. S. Shih, J. A.M. Snook, K. D. Leedy, R. Cortez
Organic Solution Deposition Of Copper Seed Layers Onto Barrier Metals, H. Gu, R. Fang, Thomas J. O'Keefe, Matthew O'Keefe, W. S. Shih, J. A.M. Snook, K. D. Leedy, R. Cortez
Materials Science and Engineering Faculty Research & Creative Works
Spontaneous deposition of copper seed layers from metal bearing organic based solutions onto sputter deposited titanium, titanium nitride, and tantalum diffusion barrier thin films has been demonstrated. Based on electrochemically driven cementation exchange reactions, the process was used to produce adherent, selectively deposited copper metal particulate films on blanket and patterned barrier metal thin films on silicon substrates. The organic solution deposited copper films were capable of acting as seed layers for subsequent electrolytic and electroless copper deposition processes using standard plating baths. Electroless and electrolytic copper films from 0.1μm to 1.0μm thick were produced on a variety of samples …
Evaluation Of Lead Anode Reactions In Acid Sulfate Electrolytes. I. Lead Alloys With Cobalt Additives, Pu Yu, Thomas J. O'Keefe
Evaluation Of Lead Anode Reactions In Acid Sulfate Electrolytes. I. Lead Alloys With Cobalt Additives, Pu Yu, Thomas J. O'Keefe
Materials Science and Engineering Faculty Research & Creative Works
Lead alloys, such as lead-calcium-tin and lead-silver, are the primary insoluble anodes used in the electrowinning of metals. While some difficulties are encountered in their use, there is no obvious replacement that is economically and technically competitive. Two of the specific problems with lead include decreased cathode purity due to incorporation from corrosion products and the relatively high overpotential which increases cell voltage. To gain an improved understanding of the fundamental behavior of lead anodes, the polarization behavior of six different alloys in sulfuric acid was evaluated. Some tests were also made with Co(II) in the acid sulfate electrolyte. Notable …
Modeling The Dielectric Response And Relaxation Spectra Of Relaxor Ferroelectrics, Huh Tswen Lin, David C. Van Aken, Wayne Huebner
Modeling The Dielectric Response And Relaxation Spectra Of Relaxor Ferroelectrics, Huh Tswen Lin, David C. Van Aken, Wayne Huebner
Materials Science and Engineering Faculty Research & Creative Works
A multi-Debye relaxation model that is based upon the Boltzmann superposition principle has been used to determine the frequency-dispersion behavior of Pb (Mg1/3-Nb2/3)O3 (PMN) and Pb0.88La0.08 (Zr0.65Ti0.35) O3 (PLZT 8/65/35) relaxor ferroelectrics. For PMN, relaxation times on the order of seconds contribute to the dispersive character of the dielectric properties. A defect-relaxation mechanism that involves Mg cation hopping in a structure that is composed of interpenetrating 〈111〉 chains of ordered Pb (Mg1/2Nb1/2) O3 is proposed for PMN. Motion of the Mg cations …
Copper Nucleation On Titanium For Thin Film Applications, A. J.B. Dutra, Thomas J. O'Keefe
Copper Nucleation On Titanium For Thin Film Applications, A. J.B. Dutra, Thomas J. O'Keefe
Materials Science and Engineering Faculty Research & Creative Works
Copper nucleation and growth on titanium substrates from concentrated acidic copper sulfate solutions was studied at 45 and 65 °C and high cathodic potentials. Electrochemical experiments allied to SEM examination were performed to characterize the mechanism of nucleation and its evolution with time. Particular emphasis was given to the influence of potential and agitation on the initial stages of nucleation and growth. Results indicated that most of copper nucleation on titanium from a 83 g dm-3 Cu2+ solution, at 65 °C, is achieved in a matter of milliseconds. As expected, the initial stages of the copper nucleation and growth is …
Vacancy Clustering In Quenched Al-Li Solid Solution Alloys Studied By Doppler Broadening Spectroscopy, Hollis P. Leighly, P. G. Coleman
Vacancy Clustering In Quenched Al-Li Solid Solution Alloys Studied By Doppler Broadening Spectroscopy, Hollis P. Leighly, P. G. Coleman
Materials Science and Engineering Faculty Research & Creative Works
The clustering of vacancies in severely quenched Al-Li solid solution alloys, with Li content between 230 and 2760 ppm, has been studied using Doppler broadening spectroscopy. The alloy samples were initially annealed at 873 K in dry air or dry, pure nitrogen. The onset temperature for vacancy clustering in samples initially annealed in air was found to be 150 ± 10 K, 40 ± 15 K lower than for the nitrogen-annealed samples. This result is consistent with the migration of divacancies, formed as a result of the significant increase in vacancy concentration caused by Li migration to, and oxidation at, …