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Articles 1 - 5 of 5
Full-Text Articles in Ceramic Materials
Design And Fabrication Of A Microstrip Bandpass Filter In Ltcc, Allison Rucker
Design And Fabrication Of A Microstrip Bandpass Filter In Ltcc, Allison Rucker
Electrical Engineering Undergraduate Honors Theses
The goal of the project was to design and fabricate a bandpass filter with a center frequency of 25GHz with a 2GHz bandwidth. The first step was to do the calculation to design a bandpass filter to meet these specifications along with the properties of the DupontTM GreenTapeTM 9K7. HFSS was then used to verify the results from the initial calculations. There was a significant error between the two results, so more tweaking was done to the calculations to get a better center frequency. After a final design was decided, the fabrication process started. Low-Temperature Co-Fired Ceramics (LLTC) …
Study Of Static And Dynamical Properties Of Complex Antiferroelectrics Materials, Kinnary Yogeshbhai Patel
Study Of Static And Dynamical Properties Of Complex Antiferroelectrics Materials, Kinnary Yogeshbhai Patel
Graduate Theses and Dissertations
The aim of this dissertation is the investigation of the static and dynamical properties of the complex antiferroelectric materials using Effective Hamiltonian method and First principles calculations. In chapter 3, a novel elemental interatomic coupling in perovskite materials which bilinearly couples the antiferroelectric displacements of cations with the rotations of the oxygen octahedra. This new coupling explains a very complex crystal structure of prototypical antiferroelectric PbZrO3. My explanation provides a unified description of many other complex antipolar crystal structures in variety of perovskite materials, including the occurrence of incommensurate phases in some of them. In chapter 4, results and analysis …
Synthesis And Application Of Ceramic Paste For High-Temperature Electronic Packaging, Ardalan Nasiri
Synthesis And Application Of Ceramic Paste For High-Temperature Electronic Packaging, Ardalan Nasiri
Graduate Theses and Dissertations
This dissertation research focused on the synthesis and application of ceramic paste for high-temperature applications. An alumina paste material comprising aluminum dihydric phosphate and alumina powder was developed for high-temperature electronic packaging. Nano aluminum nitride and nano-silica powders were embedded to promote the paste curing process, limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500°C showed no defect or additional cracks. Thermal …
Measuring Characteristic Shrinkage Variability Due To Metal Loading Effects In Low Temperature Co-Fired Ceramic Using Image Processing, John Ezekiel Zumbro
Measuring Characteristic Shrinkage Variability Due To Metal Loading Effects In Low Temperature Co-Fired Ceramic Using Image Processing, John Ezekiel Zumbro
Graduate Theses and Dissertations
Low temperature co-fired ceramic (LTCC) has many benefits when it comes to electronic packaging due to the low dielectric loss, reliability in extreme environments, and high breakdown voltage. Though the ceramic has a lot of benefits it is not widely used due to the high cost and complexities associated with manufacturing. One of these issues with manufacturing is compensating for the shrinkage of the ceramic, this is accomplished by using an expansion factor, creating the “green” or manufactured design. This expansion factor is approximated through knowledge of the ceramic factors such as the metal loading, layers of ceramic tape, firing …
Comparison Of Low-Temperature Co-Fired Ceramic And Direct Bonded Copper For Single Ended Primary Inductance Topology, Kristopher Cody Johnson
Comparison Of Low-Temperature Co-Fired Ceramic And Direct Bonded Copper For Single Ended Primary Inductance Topology, Kristopher Cody Johnson
Electrical Engineering Undergraduate Honors Theses
This work examines the thermal dissipation characteristics of Low-Temperature Co-fired Ceramic (LTCC) and Direct Bonded Copper (DBC) with the implementation of a Single Ended Primary Inductance Converter (SEPIC) topology. The advantages and disadvantages of the two substrates will be explored in addition to a description of the design and control of the SEPIC. It will be shown that the DBC implementation is superior with regards to thermal dissipation, but that LTCC has advantages in high- density packaging, RF applications, and embedded components. These substrates and converters provide many advantages in industrial applications that include automotive and grid level implementations. Additional …