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Architecting Np-Dynamic Skybridge, Jiajun Shi
Architecting Np-Dynamic Skybridge, Jiajun Shi
Masters Theses
With the scaling of technology nodes, modern CMOS integrated circuits face severe fundamental challenges that stem from device scaling limitations, interconnection bottlenecks and increasing manufacturing complexities. These challenges drive researchers to look for revolutionary technologies beyond the end of CMOS roadmap. Towards this end, a new nanoscale 3-D computing fabric for future integrated circuits, Skybridge, has been proposed [1]. In this new fabric, core aspects from device to circuit style, connectivity, thermal management and manufacturing pathway are co-architected in a 3-D fabric-centric manner.
However, the Skybridge fabric uses only n-type transistors in a dynamic circuit style for logic and memory …
Architecting Skybridge-Cmos, Mingyu Li
Architecting Skybridge-Cmos, Mingyu Li
Masters Theses
As the scaling of CMOS approaches fundamental limits, revolutionary technology beyond the end of CMOS roadmap is essential to continue the progress and miniaturization of integrated circuits. Recent research efforts in 3-D circuit integration explore pathways of continuing the scaling by co-designing for device, circuit, connectivity, heat and manufacturing challenges in a 3-D fabric-centric manner. SkyBridge fabric is one such approach that addresses fine-grained integration in 3-D, achieves orders of magnitude benefits over projected scaled 2-D CMOS, and provides a pathway for continuing scaling beyond 2-D CMOS.
However, SkyBridge fabric utilizes only single type transistors in order to reduce manufacture …