Nanotechnology Fabrication Commons^™

High-Throughput Screening Of Shape Memory Alloy Thin-Film Spreads Using Nanoindentation, Arpit Dwivedi, Thomas Wyrobek, Oden Warren, Jason Hattrick-Simpers, Olubenga Famodu, Ichiro Takeuchi

Jason R. Hattrick-Simpers

We have demonstrated the utility of nanoindentation as a rapid characterization tool for mapping shape memoryalloy compositions in combinatorial thin-film libraries. Nanoindentation was performed on Ni–Mn–Al ternary composition spreads. The indentation hardness and the reduced elastic modulus were mapped across a large fraction of the ternary phase diagram. The large shape memoryalloy composition region, located around the Heusler composition (Ni2MnAl), was found to display significant departure in these mechanical properties from the rest of the composition spread. In particular, the modulus and the hardness values are lower for the martensite region than those of the rest of the phase diagram.

Architecting Np-Dynamic Skybridge, Jiajun Shi

Masters Theses

With the scaling of technology nodes, modern CMOS integrated circuits face severe fundamental challenges that stem from device scaling limitations, interconnection bottlenecks and increasing manufacturing complexities. These challenges drive researchers to look for revolutionary technologies beyond the end of CMOS roadmap. Towards this end, a new nanoscale 3-D computing fabric for future integrated circuits, Skybridge, has been proposed [1]. In this new fabric, core aspects from device to circuit style, connectivity, thermal management and manufacturing pathway are co-architected in a 3-D fabric-centric manner.

However, the Skybridge fabric uses only n-type transistors in a dynamic circuit style for logic and memory …