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Electronic Theses and Dissertations

Thermal actuators

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Full-Text Articles in Electronic Devices and Semiconductor Manufacturing

Investigating Mems Devices In Flow Conditions Relevant To Flow-Through Systems., Mohammad Shafquatul Islam Dec 2023

Investigating Mems Devices In Flow Conditions Relevant To Flow-Through Systems., Mohammad Shafquatul Islam

Electronic Theses and Dissertations

Advancements in microscale actuating technologies has substantially expanded the possibilities of interacting with the surrounding environment. Microstructures that deflect in response to mechanical forces are one of the largest application areas of microelectromechanical systems (MEMS). MEMS devices, functioning as sensors, actuators, and support structures, find applications in inertial sensors, pressure sensors, chemical sensors, and robotics, among others. Driven by the critical role of catalytic membrane reactors, this dissertation aims to evaluate enzyme activity on polymeric membranes and explore how fabrication methods from the field of Electrical and Computer Engineering (ECE) can incorporate sensing and actuation into these porous surfaces. Toward …


Microrobots For Wafer Scale Microfactory: Design Fabrication Integration And Control., Ruoshi Zhang May 2020

Microrobots For Wafer Scale Microfactory: Design Fabrication Integration And Control., Ruoshi Zhang

Electronic Theses and Dissertations

Future assembly technologies will involve higher automation levels, in order to satisfy increased micro scale or nano scale precision requirements. Traditionally, assembly using a top-down robotic approach has been well-studied and applied to micro-electronics and MEMS industries, but less so in nanotechnology. With the bloom of nanotechnology ever since the 1990s, newly designed products with new materials, coatings and nanoparticles are gradually entering everyone’s life, while the industry has grown into a billion-dollar volume worldwide. Traditionally, nanotechnology products are assembled using bottom-up methods, such as self-assembly, rather than with top-down robotic assembly. This is due to considerations of volume handling …