Electronic Devices and Semiconductor Manufacturing Commons^™

Cmos Compatible Carbonization Of Polymer For Elctrochemical Sensors, Mohammad Aminul Haque

Doctoral Dissertations

Carbon-based electrodes that are integrable with CMOS readout electrodes possess great potential in a wide range of cutting-edge applications. The primary scientific contribution is the development of a processing sequence which can be implemented on CMOS chips to fabricate pyrolyzed carbon microelectrodes from 3D printed polymer microstructures to develop lab-on-CMOS monolithic electrochemical sensor systems. Specifically, optimized processing conditions to convert 3D printed polymer micro- and nano-structures to carbonized electrodes have been explored in order to obtain sensing electrodes for lab-on- CMOS electrochemical systems. Processing conditions have been identified, including a sequel of oxidative and inert atmosphere anneals to form pyrolyzed …

A Low-Power Approach For Front End Biological Signal Conditioning, Logan Smith Taylor

Masters Theses

In a lab-on-a-chip (LOC) application, the measurement of small analog signals such as local temperature variation often involves detection of very low-level signals in a noisy micro-scale environment. This is true for other biomedical monitoring systems as well. These systems observe various physiological parameters or electrochemical reactions that need to be tracked electrically. For temperature measurement pyroelectric transducers represent an efficient solution in terms of speed, sensitivity, and scale of integration, especially when prompt and accurate temperature monitoring is desired.

The ability to perform laboratory operations on a small scale using miniaturized LOC devices is a promising biosensing technique. The …

Characterization And Implementation Of An Injection Locked Frequency Divider Based On Relaxation Oscillator, Kai Zhu

Doctoral Dissertations

There has been a dramatic increase in wireless awareness among the user community in the past few years. As the wireless communication devices require more integration in terms of both hardware and software, the low-power integrated circuit (IC) solution has gained higher dedication and will dominate in the future radio-frequency IC (RFIC) design. Complementary Metal-Oxide Semiconductor (CMOS) process is extremely attractive for such applications because of its low cost and the possibility to integrate baseband and high frequency circuits on the same chip. The transceiver is often the most power-hungry block in a wireless communication system. The frequency divider (prescaler) …