Electronic Devices and Semiconductor Manufacturing Commons^™

Real-Time Internal Temperature Estimation And Health Monitoring For Igbt Modules, Ze Wang

Department of Electrical and Computer Engineering: Dissertations, Theses, and Student Research

Field experiences have demonstrated that power semiconductor devices, such as insulated-gate bipolar transistors (IGBTs), are among the most fragile components of power electronic converters. Thermomechanical stresses produced by temperature variations during operational and environmental loads are the major causes of IGBT degradation. As the devices are often operated under complex working conditions, temperature variations and the associated damage are difficult to predict during the converter design stage. A promising approach—online health monitoring and prognosis for power semiconductor devices—that can avoid device failure and effectively schedule maintenance has attracted much interest.

This dissertation research focused on real-time accurate internal temperature estimation …

Nanostructured Semiconductor Device Design In Solar Cells, Hongmei Dang

Theses and Dissertations--Electrical and Computer Engineering

We demonstrate the use of embedded CdS nanowires in improving spectral transmission loss and the low mechanical and electrical robustness of planar CdS window layer and thus enhancing the quantum efficiency and the reliability of the CdS-CdTe solar cells. CdS nanowire window layer enables light transmission gain at 300nm-550nm. A nearly ideal spectral response of quantum efficiency at a wide spectrum range provides an evidence for improving light transmission in the window layer and enhancing absorption and carrier generation in absorber. Nanowire CdS/CdTe solar cells with Cu/graphite/silver paste as back contacts, on SnO₂/ITO-soda lime glass substrates, yield the …

End-To-End Modeling For Variability And Reliability Analysis Of Thin Film Pv, Sourabh Dongaonkar, Muhammad Alam

Sourabh Dongaonkar

We present an end-to-end modeling framework, spanning the device, module and also system levels, for analyzing thin film photovoltaics (PV). This approach is based on embedding a detailed, statistically relevant, physics based equivalent circuit into module and array level simulations. This approach enables us to analyze key variability and reliability issues in thin film PV, and allows us to interpret their effect on process yield and intrinsic module lifetimes. Our results suggest that the time-zero gap between cell and module efficiencies, a key variability concern for thin-film PV, can be attributed to processrelated shunts with log-normal PDF distributed randomly across …