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Electronic Devices and Semiconductor Manufacturing Commons™
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Full-Text Articles in Electronic Devices and Semiconductor Manufacturing
Memristive Nanodevices And Arrays: Scaling And Novel Applications, Shuang Pi
Memristive Nanodevices And Arrays: Scaling And Novel Applications, Shuang Pi
Doctoral Dissertations
This dissertation addresses the challenges for device scaling and novel application of nanoscale memristive devices and device arrays through demonstrating the first working sub-10 nm memristor array, the first ultra-dense atomic scale working memristor array and the first high performance nanoscale radiofrequency switch based on memristive devices. Nanoimprint lithography is used to generate the sub-10 nm cross-point memristor array. The imprint mold with sub-10 nm features is generated by using wet chemical method to shrink the larger features on a master mold. The imprinting, pattern transfer and metallization process are closely monitored to enforce optimal conditions for sub-1 nm critical …
Three-Dimensional Memristor Integrated Circuits And Applications, Peng Lin
Three-Dimensional Memristor Integrated Circuits And Applications, Peng Lin
Doctoral Dissertations
New computing paradigms are highly demanded in the “Big Data” era to efficiently process, store and extract useful information from overwhelmingly rich amount of data. New computing systems based on large scale memristor circuits emerges as a very promising candidate due to its capability to both store and process information, thus eliminating the von Neumann bottleneck in the conventional complementary metal oxide semiconductor (CMOS) based computers. As the lateral scaling of the device geometry approaching its physical limit, three-dimensional stacking of multiple device layers becomes necessary to further increase the packing density. Moreover, innovations in the 3D circuits design can …
Metal-Assisted Etching Of Silicon Molds For Electroforming, Ralu Divan, Dan Rosenthal '14, Karim Ogando, Leonidas E. Ocola, Daniel Rosenmann, Nicolaie Moldovan
Metal-Assisted Etching Of Silicon Molds For Electroforming, Ralu Divan, Dan Rosenthal '14, Karim Ogando, Leonidas E. Ocola, Daniel Rosenmann, Nicolaie Moldovan
Student Publications & Research
Ordered arrays of high-aspect-ratio micro/nanostructures in semiconductors stirred a huge scientific interest due to their unique one-dimensional physical morphology and the associated electrical, mechanical, chemical, optoelectronic, and thermal properties. Metal-assisted chemical etching enables fabrication of such high aspect ratio Si nanostructures with controlled diameter, shape, length, and packing density, but suffers from structure deformation and shape inconsistency due to uncontrolled migration of noble metal structures during etching. Hereby the authors prove that a Ti adhesion layer helps in stabilizing gold structures, preventing their migration on the wafer surface while not impeding the etching. Based on this finding, the authors demonstrate …